Abstract: A method for forming a multilayered circuit pattern on a surface of a 3D metal board includes: forming a first insulation layer on the surface of the 3D metal board; forming a first conductive pattern on the first insulation layer; forming a second insulation layer on the first conductive pattern except for a predetermined region; forming a second conductive pattern on the second insulation layer; and forming a third insulation layer on the second conductive pattern except for one or more circuit element mounting regions.

Abstract: A method for forming a circuit pattern on a surface of a 3D structure includes: forming a first insulation layer on the surface of the 3D structure; forming a conductive pattern on the first insulation layer; forming a second insulation layer on the conductive pattern except for a circuit element mounting region; and mounting one or more circuit elements on the circuit element mounting region.

Abstract: An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.

Abstract: An embodiment of the present invention provides a PCB module comprising: a multilayer PCB assembly including a heat dissipation plate layer, and an upper PCB and a lower PCB which are attached to the upper surface and the lower surface of the heat dissipation plate layer, respectively; and an upper case and a lower case for covering the upper side and the lower side of the multilayer PCB assembly, respectively, wherein the heat dissipation plate layer includes a plurality of electrically insulating heat dissipation plates arranged on the same plane, and at least one of the plurality of heat dissipation plates comprises: a first heat pole in thermal contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole in thermal contact with the inner surface of at least one of the upper and lower cases.

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.

Abstract: A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

Abstract: The present disclosure relates to a layered structure of a multi-layer PCB, and more particularly, to a structure of a high-power multi-layer PCB which can use a high current by efficiently dissipating heat generated from the inside of the multi-layered PCB and heat generated from a power semiconductor module package mounted on the PCB, and a production method thereof. The multi-layer PCB includes: a conductive plate having a plurality of heat poles protruding from at least one of a top surface and a bottom surface thereof; PCBs which are disposed on the top surface and the bottom surface of the conductive plate, and have a plurality of penetrating holes formed therethrough to allow the heat poles of the conductive plate to be inserted thereinto; and an insulation layer which is attached between the conductive plate and the PCBs in order to electrically insulate.

Abstract: There is provided an apparatus and method for controlling a switch of a flyback converter for a solar generating system. The apparatus for controlling a switch of a flyback converter for a solar generating system includes: an MPPT controller generating a current command value for a maximum power point tracker of a solar cell module, based on input voltage, input current, and output voltage of the flyback converter; a current controller generating a current control signal for tracking the current command value; an output current command value generator generating the phase and magnitude command value of the output current, based on the phase of the output voltage and the current control signal; and a switch controller controlling the main switch of the flyback converter, based on the phase and magnitude command value of the output current, thereby simplifying a circuit while solving disadvantages of a discontinuous conduction mode and a boundary conduction mode.

Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage lev

Abstract: The power supply includes: an electromagnetic interference filter including a first filter which has a pair of electromagnetically coupled cores having at least two leg parts, first and second bobbins each having a tube-shaped body part having a penetration hole into which each of the leg parts is inserted and having a winding region defined as the circumference of the outer peripheral surface of the body part, and first and second coils respectively wound around the first and second bobbins to remove common mode electromagnetic interference included in power transmitted from a power line, the electromagnetic interference filter removing differential mode electromagnetic interference due to leakage inductance formed due to the leakage of magnetic flux flowing through the cores; a power factor corrector correcting a power factor of the power where the electromagnetic interference is removed; and a power converter switching the power-factor-corrected power into a driving power having a predetermined voltage lev

Abstract: There is provided an apparatus and method for controlling a switch of a flyback converter for a solar generating system. The apparatus for controlling a switch of a flyback converter for a solar generating system includes: an MPPT controller generating a current command value for a maximum power point tracker of a solar cell module, based on input voltage, input current, and output voltage of the flyback converter; a current controller generating a current control signal for tracking the current command value; an output current command value generator generating the phase and magnitude command value of the output current, based on the phase of the output voltage and the current control signal; and a switch controller controlling the main switch of the flyback converter, based on the phase and magnitude command value of the output current, thereby simplifying a circuit while solving disadvantages of a discontinuous conduction mode and a boundary conduction mode.

Abstract: Provided is a power supply device including a power supply unit that supplies a driving voltage for driving at least one or more loads; a current balancing unit that maintains a current balance of the driving voltage supplied to the respective loads; a detection unit that detects currents flowing in the current balancing unit through electromagnetic induction so as to output a detection signal; and a control unit that receives the detection signal to judge whether the loads are opened or not and outputs a control signal for controlling the magnitude of the driving voltage.