Abstract: A display module includes a substrate, m rows and n columns of pad sets, m*n sets of light emitting chip sets and multiple pins. The substrate includes a first surface and a second surface disposed opposite to each other. Each set of pad sets among the m rows and n columns of pad sets includes three pairs of pads, and first pads in the each set of pad sets are electrically connected. In a same set of light emitting chips, each of first electrodes of the light emitting chips is connected to a respective one of first pads of one set of pad sets among the m rows and n columns of pad sets, and each of second electrodes of the light emitting chips is connected to a respective one of second pads of a same set of pad sets.

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

Abstract: Provided are an LED display module and a display device. The LED display module includes LED display units and a circuit board. Each LED display unit includes pixel units. Each pixel unit includes LED light-emitting chips. A surface of the circuit board is provided with a circuit layer. The circuit layer includes first wirings and second wirings that do not cross each other. A-electrodes of LED light-emitting chips in an i-th row of pixel units in a current LED display unit and in an i-th row of pixel units in a subsequent LED display unit are electrically connected by one first wiring. B-electrodes of LED light-emitting chips of a same color in a j-th column of pixel units in a current LED display unit and in a j-th column of pixel units in a subsequent LED display unit are electrically connected by one second wiring.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N?2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m?2, n?2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

Abstract: A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step S1 and step S2. In step S1, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S2, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.

Abstract: Provided is a light-emitting diode (LED) display assembly. The LED display assembly includes a plurality of chips, a first carrier and a second carrier. Two opposite side surfaces of the first carrier are respectively a first mounting surface and a second mounting surface. The first mounting surface is provided with first pads, and the first pads are connected to the chips. The second mounting surface is provided with first pins, and wires in the first carrier connect the first pads to the first pins. An area of each of the first pins is larger than an area of each of the first pads. The second carrier is provided with a third mounting surface, the third mounting surface is provided with second pads whose number is the same as a number of the first pins, and the second pads are welded to the first pins in one-to-one correspondence.

Abstract: A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.

Abstract: Some embodiments of the present disclosure relate to the technical field of Light-Emitting Diodes (LEDs), for example, an LED line backlight source liquid crystal display screen, including liquid crystal glass and a light guide plate. The light guide plate is provided on one side of the liquid crystal glass, the outside of the end surface of a first end of the light guide plate and the outside of the end surface of a second end thereof are both provided with LED line backlight sources, the LED line backlight source includes an elongated circuit substrate, a side of the circuit substrate close to the light guide plate is provided with at least one row of light-emitting assemblies, and each row of the light-emitting assemblies includes a plurality of red, green, and blue (RGB) light-emitting units arranged at intervals along the length direction of the circuit substrate.

Abstract: Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.

Abstract: The disclosure provides a light-emitting device and a displayer. Herein, the light-emitting device includes a substrate, a light-emitting chip, a first light-transmitting layer, a second light-transmitting layer and a nano coating. The light transmittance of the second light-transmitting layer is greater than the light transmittance of the first light-transmitting layer. A reference surface corresponding to the light-emitting chip is arranged above the substrate, and the reference surface is higher than the bottom surface of the light-emitting chip and not higher than the top surface of the light-emitting chip. The first light-transmitting layer covers the surface of the light-emitting chip below the reference surface, and the second light-transmitting layer covers the surface of the light-emitting chip above the reference surface. The nano coating covers the outer surface of the first light-transmitting layer, the outer surface of the second light-transmitting layer and the side surface of the substrate.

Abstract: Provided is a LED backlight module, display screen and detection method of a LED backlight module. The LED backlight module includes a substrate and multiple LED chips arranged on the substrate, one first detection group is arranged on the substrate for each LED chip of more than one LED chip arranged at an interval of N LED chips connected in series, where N is greater than or equal to 0, the first detection group includes a first positive electrode detection point and a first negative electrode detection point, the first positive electrode detection point and the first negative electrode detection point of the first detection group are respectively connected to a positive electrode and a negative electrode of the each LED chip.

Abstract: Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.

Abstract: Provided is an LED display unit group, comprising: an insulation substrate, a front circuit board, and a back circuit board. The front circuit board is divided into pixel areas arranged in an array of 2m rows and 2n columns. Each pixel area comprises three A-electrode pads, three LED light-emitting chips of different light emission colors, and B-electrode pads corresponding to the three LED light-emitting chips. In each pixel area, the electrode A of each LED light-emitting chip is electrically connected to a corresponding A-electrode pad, and the electrode B of each LED light-emitting chip is electrically connected to a corresponding B-electrode pad. In the same column of pixel areas, B-electrode pads corresponding to all LED light-emitting chips are electrically connected to each other. In the same row of pixel areas, A-electrode pads corresponding to LED light-emitting chips of the same light emission color are electrically connected to each other.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units arranged in an array of m rows and n columns on the circuit board. The circuit board includes N metal line layers stacked in sequence and an insulating plate located between adjacent metal line layers. The N metal line layers are electrically connected through a conductive via on the insulating plate, where N?2. Each pixel unit includes at least two LED light-emitting chips with different light-emitting colors, where m?2, n?2. The first metal line layer includes m common A-electrode pads, multiple A-electrode pads and multiple B-electrode pads.

Abstract: Some embodiments provide a full-color display module and display device. The full-color display module includes at least two light-emitting layers. Any one of the at least two light-emitting layers includes a substrate and a plurality of light-emitting portions encapsulated on the substrate. A type of any one of the plurality of light-emitting portions is one of a red light-emitting portion, a green light-emitting portion, and a blue light-emitting portion. The at least two light-emitting layers are successively laminated in a laminating direction and form a plurality of pixel points. Any one of the plurality of pixel points is a surrounding area on the full-color display module, which is surrounded by a surrounding curved surface. The surrounding area of the any one of the plurality of pixel points includes at least one red light-emitting portion, at least one green light-emitting portion, and at least one blue light-emitting portion.

Abstract: Provided is a light-emitting diode (LED) display unit group and a display panel. The LED display unit group includes a circuit board, and a pixel unit array located on the circuit board. The pixel unit array includes a plurality of pixel units arranged in n rows and m columns, n and m are both positive integers and greater than or equal to 2. Each of the pixel units includes multiple LED light-emitting chips of at least two colors, each of the LED light-emitting chips includes an electrode A and an electrode B of opposite polarities. The LED light-emitting chip of each of the pixel units includes at least one dual-electrode chip, the dual-electrode chip has the electrode A and the electrode B located on a same side of the dual-electrode chip. All dual-electrode chips in the plurality of pixel units of a same color have connecting lines from the electrode A to the electrode B directed in a same direction.

Abstract: A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.

Abstract: A Chip-on-Board (COB) display module is provided, which includes a Printed Circuit Board (PCB) a plurality of Light-Emitting Diode (LED) luminous units, a packaging adhesive layer and a light shielding layer wherein the plurality of LED luminous units are mounted and fixed on the PCB, the packaging adhesive layer covers the PCB and wraps the LED luminous units thereon, a liquid passage is provided in the packaging adhesive layer between every two adjacent LED luminous units, and the light shielding layer fills the liquid passage. The COB display module further includes a reflecting layer, and the reflecting layer covers two sidewalls of the liquid passage, and is positioned between the packaging adhesive layer and the light shielding layer. A manufacturing method for the COB display module is also disclosed.