Abstract: A controlling method for a wireless communication device is provided. The controlling method for the wireless communication device includes: attaching a first Universal Subscriber Identity Module (USIM) to a Long-Term Evolution (LTE) network; determining whether a second USIM is camped on the LTE network; detecting whether a paging collision is happened, if the second USIM is camped on the LTE network; generating a requested International Mobile Subscriber Identity (IMSI) offset for the second USIM, if the paging collision is happened, wherein the requested IMSI offset is 1 or min(T, nB)?1, T is a default paging period and nB is a number of paging occurrences within the default paging period; transmitting an attach request with the requested IMSI offset to the LTE network for the second USIM; receiving a negotiated IMSI offset from the LTE network; and attaching the second USIM to the LTE network with the negotiated IMSI offset.

Abstract: A method for processing an integrated circuit includes forming first and second gate all around transistors. The method forms a dipole oxide in the first gate all around transistor without forming the dipole oxide in the second gate all around transistor. This is accomplished by entirely removing an interfacial dielectric layer and a dipole-inducing layer from semiconductor nanosheets of the second gate all around transistor before redepositing the interfacial dielectric layer on the semiconductor nanosheets of the second gate all around transistor.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A semiconductor device structure is provided. The device includes one or more first semiconductor layers, each first semiconductor layer of the one or more first semiconductor layers is surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.

Abstract: A dust-proof sensing device includes a mechanical body, a feeding path, a first photoelectric sensor disposed above the feeding path, a second photoelectric sensor disposed under the feeding path, and an upper bracket. The mechanical body has a feeding path. The upper bracket is mounted above the feeding path. The upper bracket has an upper fastening portion fastened to the mechanical body, an upper wedging portion fastened at the upper fastening portion, an L-shaped upper light guiding holder fastened at the upper fastening portion, and a first light guider fastened at the upper light guiding holder. The upper fastening portion has a first inclined section. An inner edge of an upper surface of the first inclined section is intersected with a top edge of an inner surface of the upper wedging portion to form a clamping angle.

Abstract: An image rendering device and an image rendering method are disclosed. For the elements of the image rendering device, a first sensor and a second sensor are configured to sense a target object in a two-dimensional (2D) mode and three-dimensional (3D) mode to generate a first surface-color-signal, a first 3D-depth-signal, a second surface-color-signal and a second 3D-depth-signal respectively. An IR projector is configured to generate an IR-dot-pattern. A processor is configured to control the IR projector to project the IR-dot-pattern on the target object in the 3D mode, and configured to process the first surface-color-signal, the second surface-color-signal, the first 3D-depth-signal and the second 3D-depth-signal to obtain a color 3D model of the target object.

Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A dust-proof sensing device includes a mechanical body, a feeding path, a first photoelectric sensor disposed above the feeding path, a second photoelectric sensor disposed under the feeding path, and an upper bracket. The mechanical body has a feeding path. The upper bracket is mounted above the feeding path. The upper bracket has an upper fastening portion fastened to the mechanical body, an upper wedging portion fastened at the upper fastening portion, an L-shaped upper light guiding holder fastened at the upper fastening portion, and a first light guider fastened at the upper light guiding holder. The upper fastening portion has a first inclined section. An inner edge of an upper surface of the first inclined section is intersected with a top edge of an inner surface of the upper wedging portion to form a clamping angle.

Abstract: A flexural document pick-up device includes: a feeding path comprised of a upper wall and a lower wall; a input tray arranged upstream to the feeding path; a paper feeding unit arranged partially in the feeding path; a separation roller disposed on the opposite side of the paper feeding unit; a blocking arm disposed upstream to the paper feeding unit; a securing groove arranged on the upper wall; and a guiding unit with the following portions disposed sequentially from downstream to upstream of the feeding direction: a securing section which is secured to the securing groove, a flexure section which is extended from the securing section to the feeding path, a guiding section which is connected to the flexure section and essentially parallel to the feeding path, a lifting section which is connected to the guiding section and a vertex which is arranged on the end of the lifting section.

Abstract: A paper pickup mechanism includes a mechanical frame, a pickup roller module, a feeding roller module, a driving device, a separation roller module and an energy storage element. The mechanical frame has a platform. The pickup roller module is pivoted to and connected to the mechanical frame. The feeding roller module is pivoted to and connected to the mechanical frame. The driving device is mounted to the mechanical frame. The separation roller module is pivoted to and connected to the mechanical frame. The energy storage element is mounted between the mechanical frame and the separation roller module. When the separation roller module rotates together with the feeding roller module in a forward direction, the energy storage element accumulates energies. When more than one piece of paper is fed into the paper pickup mechanism, the energy storage element releases the energies.

Abstract: A paper pickup mechanism includes a mechanical frame, a pickup roller module, a feeding roller module, a driving device, a separation roller module and an energy storage element. The mechanical frame has a platform. The pickup roller module is pivoted to and connected to the mechanical frame. The feeding roller module is pivoted to and connected to the mechanical frame. The driving device is mounted to the mechanical frame. The separation roller module is pivoted to and connected to the mechanical frame. The energy storage element is mounted between the mechanical frame and the separation roller module. When the separation roller module rotates together with the feeding roller module in a forward direction, the energy storage element accumulates energies. When more than one piece of paper is fed into the paper pickup mechanism, the energy storage element releases the energies.

Abstract: A paper feeding device includes a motor, a pickup roller assembly, a velocity sensor and a feeding roller assembly. The pickup roller assembly is driven by the motor for picking up the papers. The velocity sensor is mounted to the pickup roller assembly for detecting rotating speeds of the pickup roller assembly so as to detect speeds of feeding forward the papers. The feeding roller assembly is driven by the motor for continuing feeding forward the papers. A speed discrepancy will be generated between the rotating speed of the pickup roller assembly after the one of the papers is fed to the feeding roller assembly and the rotating speed of the pickup roller assembly which just picks up the one of the papers, when the speed discrepancy reaches a preset value set by the scanner, the scanner is triggered to start scanning.

Abstract: A paper outputting mechanism includes a frame, a motor mounted to the frame, a paper supply tray assembly, a gear assembly, a paper pressing element, a blocking element and a plurality of elastic elements. A rear of the frame has a receiving room, a front of the frame has a slope connected with the receiving room. The paper supply tray assembly includes a first paper supply tray slidably mounted to the frame and a second paper supply tray placed on the first paper supply tray. A gear assembly is driven by the motor, the gear assembly drives the first and second paper supply tray to move frontward and rearward. The paper pressing element is up and down movably mounted to the frame and located over the slope. The blocking element is front and down slidably mounted to the frame and in front of the paper pressing element.

Abstract: A paper outputting mechanism includes a frame, a motor mounted to the frame, a paper supply tray assembly, a gear assembly, a paper pressing element, a blocking element and a plurality of elastic elements. A rear of the frame has a receiving room, a front of the frame has a slope connected with the receiving room. The paper supply tray assembly includes a first paper supply tray slidably mounted to the frame and a second paper supply tray placed on the first paper supply tray. A gear assembly is driven by the motor, the gear assembly drives the first and second paper supply tray to move frontward and rearward. The paper pressing element is up and down movably mounted to the frame and located over the slope. The blocking element is front and down slidably mounted to the frame and in front of the paper pressing element.

Abstract: A duplex scanning apparatus capable of switching a scanning background includes a pair of glass plates, a pair of background boards pivoted to the glass plates and a driving mechanism. The glass plates are disposed in a frame and overlapped with each other. The two glass plates define two scanning areas face to face. A portion of the frame adjacent to an outer surface of the glass plate defines a first color area of the scanning background corresponding to the scanning area. One background board is positioned above one glass plate, and the other background board is positioned under the other glass plate and away from the one background board. Each background board defines a second color area of the scanning background corresponding to the scanning area. The driving mechanism mounted in the frame drives the background boards to turn over with respect to the corresponding glass plates.

Abstract: A scanning apparatus capable of switching a scanning background includes a pair of glass plates, a pair of background boards pivoted to the glass plates and a driving mechanism. The glass plates are disposed in a frame and overlapped with each other. The two glass plates define two scanning areas face to face. A portion of the frame adjacent to an outer surface of the glass plate defines a first color area of the scanning background corresponding to the scanning area. One background board is positioned above one glass plate, and the other background board is positioned under the other glass plate and away from the one background board. Each background board defines a second color area of the scanning background corresponding to the scanning area. The driving mechanism mounted in the frame drives the background boards to turn over with respect to the corresponding glass plates.