Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.

Abstract: A dynamic nameplate is provided, which includes: a base disposed on a circuit board; and a rotating member disposed on the base through a bearing, so that the rotating member can rotate relative to the base. The dynamic nameplate can provide dynamic effects without using a conventional motor.

Abstract: A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

Abstract: A dynamic nameplate is provided, which includes: a base disposed on a circuit board; and a rotating member disposed on the base through a bearing, so that the rotating member can rotate relative to the base. The dynamic nameplate can provide dynamic effects without using a conventional motor.

Abstract: A rotatable water-cooling tube and an electronic device with the water-cooling tube are provided. The water-cooling tube includes a first tube body, a second tube body, a third tube body, a first connector and a second connector. The first tube body is in communication with the second tube body and the third tube body through the first connector and the second connector. The first tube body is rotatable with the first connector and the second connector. Consequently, the first tube body can be freely rotated to a proper position. The technology of the present invention is helpful to assemble and disassemble the heat generation component under the rotatable water-cooling tube.

Abstract: A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

Abstract: A rotatable water-cooling tube and an electronic device with the water-cooling tube are provided. The water-cooling tube includes a first tube body, a second tube body, a third tube body, a first connector and a second connector. The first tube body is in communication with the second tube body and the third tube body through the first connector and the second connector. The first tube body is rotatable with the first connector and the second connector. Consequently, the first tube body can be freely rotated to a proper position. The technology of the present invention is helpful to assemble and disassemble the heat generation component under the rotatable water-cooling tube.