Patents by Inventor Kuan Cheng Wu

Kuan Cheng Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12255217
    Abstract: A semiconductor device includes a first type of light sensing units, where each instance of the first type of light sensing units is operable to receive a first amount of radiation; and a second type of light sensing units, where each instance of the second type of light sensing units is operable to receive a second amount of radiation, and the second type of light sensing units is arranged in an array with the first type of light sensing units to form a pixel sensor. The first amount of radiation is smaller than the second amount of radiation, and at least a first instance of the first type of light sensing units is adjacent to a second instance first type of light sensing unit.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: March 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Li-Wen Huang, Chun-Lin Fang, Kuan-Ling Pan, Ping-Hao Lin, Kuo-Cheng Lee, Cheng-Ming Wu
  • Publication number: 20250046762
    Abstract: A display device is provided. The display device includes a substrate having a surface including a display area; a plurality of light-emitting diodes disposed on the display area of the substrate, wherein the light-emitting diode includes an electrode; and a plurality of bonding pads disposed on the substrate; a conductive element disposed between one of the plurality of bonding pads and the electrode of the at least one of the plurality of light-emitting diodes; and a first matrix element disposed on the substrate, wherein in a cross-sectional view, the first matrix element is disposed between adjacent two of the plurality of light-emitting diodes, and the electrode has a sidewall profile and at least a part of the sidewall profile of the electrode is in a shape of a curve.
    Type: Application
    Filed: October 18, 2024
    Publication date: February 6, 2025
    Inventors: Yuan-Lin WU, Kuan-Feng LEE, Wei-Cheng CHU
  • Patent number: 12135337
    Abstract: A sensor assembly and sensing method is provided for proximity detection for assessing an attachment state of a sensing probe with respect to a subject. A probe is coupled to an electronic probe controller. The probe includes a proximity sensor having a passive energy storing circuit element, and a biological sensor receptacle configured to receive a biological sensor for sensing a biological characteristic of an object. The electronic probe controller excites a circuit network incorporating the proximity sensor with an excitation signal and determines a characteristic of the circuit network that is excited by the excitation signal. The electronic probe controller further generates a proximity indication indicating whether the probe is attached to the object based on the characteristic of the circuit network.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: November 5, 2024
    Assignee: The General Hospital Corporation
    Inventors: Maria A. Franceschini, Adriano Peruch, Kuan Cheng Wu, Marco Renna
  • Publication number: 20210333308
    Abstract: A sensor assembly and sensing method is provided for proximity detection for assessing an attachment state of a sensing probe with respect to a subject. A probe is coupled to an electronic probe controller. The probe includes a proximity sensor having a passive energy storing circuit element, and a biological sensor receptacle configured to receive a biological sensor for sensing a biological characteristic of an object. The electronic probe controller excites a circuit network incorporating the proximity sensor with an excitation signal and determines a characteristic of the circuit network that is excited by the excitation signal. The electronic probe controller further generates a proximity indication indicating whether the probe is attached to the object based on the characteristic of the circuit network.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Inventors: Maria A. Franceschini, Adriano Peruch, Kuan Cheng Wu, Marco Renna