Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.

Abstract: A method of fabricating a device includes forming a dummy gate over a plurality of fins. Thereafter, a first portion of the dummy gate is removed to form a first trench that exposes a first hybrid fin and a first part of a second hybrid fin. The method further includes filling the first trench with a dielectric material disposed over the first hybrid fin and over the first part of the second hybrid fin. Thereafter, a second portion of the dummy gate is removed to form a second trench and the second trench is filled with a metal layer. The method further includes etching-back the metal layer, where a first plane defined by a first top surface of the metal layer is disposed beneath a second plane defined by a second top surface of a second part of the second hybrid fin after the etching-back the metal layer.

Abstract: A method of forming a semiconductor device includes forming semiconductor strips protruding above a substrate and isolation regions between the semiconductor strips; forming hybrid fins on the isolation regions, the hybrid fins comprising dielectric fins and dielectric structures over the dielectric fins; forming a dummy gate structure over the semiconductor strip; forming source/drain regions over the semiconductor strips and on opposing sides of the dummy gate structure; forming nanowires under the dummy gate structure, where the nanowires are over and aligned with respective semiconductor strips, and the source/drain regions are at opposing ends of the nanowires, where the hybrid fins extend further from the substrate than the nanowires; after forming the nanowires, reducing widths of center portions of the hybrid fins while keeping widths of end portions of the hybrid fins unchanged, and forming an electrically conductive material around the nanowires.

Abstract: A memory device, an error correction device and an error correction method thereof are provided. The error correction device includes a first error correction decoder and a second error correction decoder. The first error correction decoder performs at least one iteration of a first error correction operation on a data chunk, calculates a counting number of syndrome values equal to a set logic value generated in the at least one iteration of the first error correction operation, and generates a control signal according to the counting number. The second error correction decoder receives the control signal and determines whether to be activated to perform a second error correction operation on the data chunk or not according to the control signal. An error correction ability of the second error correction decoder is higher than an error correction ability of the first error correction decoder.

Abstract: A device structure according to the present disclosure may include a first die having a first substrate and a first interconnect structure, a second die having a second substrate and a second interconnect structure, and a third die having a third interconnect structure and a third substrate. The first interconnect structure is bonded to the second substrate via a first plurality of bonding layers. The second interconnect structure is bonded to the third interconnect structure via a second plurality of bonding layers. The third substrate includes a plurality of photodiodes and a first transistor. The second die includes a second transistor having a source connected to a drain of the first transistor, a third transistor having a gate connected to drain of the first transistor and the source of the second transistor, and a fourth transistor having a drain connected to the source of the third transistor.

Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor including first chip and a second chip. The first chip includes a first substrate, a plurality of photodetectors disposed in the first substrate, a first interconnect structure disposed on a front side of the first substrate, and a first bond structure disposed on the first interconnect structure. The second chip underlies the first chip. The second chip includes a second substrate, a plurality of semiconductor devices disposed on the second substrate, a second interconnect structure disposed on a front side of the second substrate, and a second bond structure disposed on the second interconnect structure. A first bonding interface is disposed between the second bond structure and the first bond structure. The second interconnect structure is electrically coupled to the first interconnect structure by way of the first and second bond structures.

Abstract: A memory device, an error correction device and an error correction method thereof are provided. The error correction device includes a first error correction decoder and a second error correction decoder. The first error correction decoder performs at least one iteration of a first error correction operation on a data chunk, calculates a counting number of syndrome values equal to a set logic value generated in the at least one iteration of the first error correction operation, and generates a control signal according to the counting number. The second error correction decoder receives the control signal and determines whether to be activated to perform a second error correction operation on the data chunk or not according to the control signal. An error correction ability of the second error correction decoder is higher than an error correction ability of the first error correction decoder.

Abstract: A solid state disk, a data transmitting method and an intermediary controller thereof are provided. The solid state disk includes at least two flash memories, a SSD controller and an intermediary controller. The intermediary controller is connected between the flash memories and the SSD controller. The intermediary controller includes at least two flash interfaces, a customized interface and a data buffering unit. The flash interfaces are connected to the flash memories. The customized interface is connected to the SSD controller. The intermediary controller has a first clock domain and a second clock domain. The first clock domain is used for transmitting data from the flash memories to the data buffering unit. The second clock domain is used for transmitting data from the data buffering unit to the SSD controller. A frequency of the second clock domain is higher than a frequency of the first clock domain.

Abstract: A solid state disk, a data transmitting method and an intermediary controller thereof are provided. The solid state disk includes at least two flash memories, a SSD controller and an intermediary controller. The intermediary controller is connected between the flash memories and the SSD controller. The intermediary controller includes at least two flash interfaces, a customized interface and a data buffering unit. The flash interfaces are connected to the flash memories. The customized interface is connected to the SSD controller. The intermediary controller has a first clock domain and a second clock domain. The first clock domain is used for transmitting data from the flash memories to the data buffering unit. The second clock domain is used for transmitting data from the data buffering unit to the SSD controller. A frequency of the second clock domain is higher than a frequency of the first clock domain.

Abstract: Methods, devices, systems, and apparatus including computer-readable mediums for managing error correction coding in memory systems are provided. In one aspect, a memory system includes a system controller configured to communicate with a host device, and a memory device coupled to the system controller. The memory device includes at least one memory and a memory controller coupled to the at least one memory. The memory controller includes an error correction code (ECC) circuit configured to perform error correction coding for data received from at least one of the system controller or the at least one memory.

Abstract: Methods, devices, systems, and apparatus including computer-readable mediums for managing error correction coding in memory systems are provided. In one aspect, a memory system includes a system controller configured to communicate with a host device, and a memory device coupled to the system controller. The memory device includes at least one memory and a memory controller coupled to the at least one memory. The memory controller includes an error correction code (ECC) circuit configured to perform error correction coding for data received from at least one of the system controller or the at least one memory.

Abstract: Methods, devices, systems, and apparatus including computer-readable mediums for managing error correction coding in memory systems are provided. In one aspect, a memory system includes a system controller configured to communicate with a host device, and a memory device coupled to the system controller. The memory device includes at least one memory and a memory controller coupled to the at least one memory. The memory controller includes an error correction code (ECC) circuit configured to perform error correction coding for data received from at least one of the system controller or the at least one memory.

Abstract: A pharmaceutical composition for use in promoting wound healing and/or accelerating closure of an open wound in a subject in need thereof is disclosed. The composition comprises a therapeutically effective amount of a recombinant polypeptide comprising an amino acid sequence that is at least 80% identical to the amino acid sequence of SEQ ID NO: 2; and a pharmaceutically acceptable vehicle, carrier, diluent, excipients, and/or salt.

Abstract: A pharmaceutical composition for use in promoting wound healing and/or accelerating closure of an open wound in a subject in need thereof is disclosed. The composition comprises a therapeutically effective amount of a recombinant polypeptide comprising an amino acid sequence that is at least 80% identical to the amino acid sequence of SEQ ID NO: 2; and a pharmaceutically acceptable vehicle, carrier, diluent, excipients, and/or salt.

Abstract: An electronic device for finding error locations in a codeword includes a plurality of power control units configured to find error locations in the codeword. The plurality of power control units are coupled in parallel. Each of the plurality of power control units includes a plurality of corresponding input control circuits to individually turn on or off the corresponding power control unit.

Abstract: An electronic device for finding error locations in a codeword includes a plurality of power control units configured to find error locations in the codeword. The plurality of power control units are coupled in parallel. Each of the plurality of power control units includes a plurality of corresponding input control circuits to individually turn on or off the corresponding power control unit.

Abstract: A method of dynamic resource allocation for a virtual machine cluster is to calculate the resource usage weight of the respective virtual machine, the resource usage weight of the respective physical machine, and the average resource usage weight of the physical machines, to pick the physical machine with the greatest resource usage weight as the migration source machine, to pick the physical machine with the least resource usage weight as the migration object machine, and to move the virtual machine in the migration source machine with the resource usage weight thereof being closest to the migration difference value to the migration object machine to achieve the effect of load balancing.

Abstract: A light emitting diode display panel includes a substrate and a plurality of pixels. The substrate includes a plurality of transverse signal lines and a plurality of longitudinal signal lines crossing each other. The pixels are mounted on the substrate in a matrix form. Each pixel includes a plurality of LEDs. The LEDs are electrically connected to one of the transverse signal lines and one of the longitudinal signal lines.

Abstract: A method for managing green power determines if how many physical machines should run or be shut off with the gross occupied resource weight ratio of the virtual machine cluster. The standby physical machine in the non-running physical machines is elected and woke up to join as one of the running physical machines; one of the running physical machines is elected as a migration physical machine with the virtual machines therein being moved to other running physical machines, and then shut off. The resource allocation process is conducted to distribute loads of the running physical machines such that the total numbers of the running physical machines are capable of being dispatched flexibly to achieve the object of green power management.