Abstract: A lid attach process includes dipping a periphery of a lid in a dipping tank of adhesive material such that the adhesive material attaches to the periphery of the lid. The lid attach process further includes positioning the lid over a die attached to a substrate using a lid carrier, wherein the periphery of the lid is aligned with a periphery of the lid carrier. The lid attach process further includes attaching the lid to the substrate with the adhesive material forming an interface with the substrate. The lid attach process further includes contacting a thermal interface material (TIM) on the die with the lid.

Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.

Abstract: Disclosed is a method for forming a crystalline protective polysilicon layer which does not create defective voids during subsequent processes so as to provide effective protection to devices underneath. In one embodiment, a method for forming a semiconductor device, includes: depositing a protective coating on a first polysilicon layer; forming an epitaxial layer on the protective coating; and depositing a second polysilicon layer over the epitaxial layer, wherein the protective coating comprises a third polysilicon layer, wherein the third polysilicon layer is deposited at a first temperature in a range of 600-700 degree Celsius, and wherein the third polysilicon layer in the protect coating is configured to protect the first polysilicon layer when the second polysilicon layer is etched.

Abstract: A double-sided display device includes a first panel, a second panel, a light guide plate and a light source. The second panel is arranged opposite to the first panel. The light guide plate is arranged between the first panel and the second panel, and includes a main body portion including a first surface and a second surface, a first pattern arranged on the first surface, and a second pattern arranged on the second surface. The light source is arranged adjacent to the light guide plate. The first pattern is different from the second pattern.

Abstract: The present invention discloses an electromagnetic air pump including an air chamber operable to be compressed or expanded. The air chamber is defined by a platform surface and a rubber cap operable to be pressed downward. The rubber cap includes a support and a cover. During the operation of the electromagnetic air pump, the cover is configured to bear against the support with the platform surface when the cover is pressed downward. When the air chamber is compressed or expanded, each pair of geometrically symmetrical parts of the cover corresponds to a pair of displacement changes relative to the platform surface, wherein a difference between the pair of displacement changes is not greater than 5%. Thus, the rubber cap is provided with an effect of a substantially uniform stress.

Abstract: The semiconductor structure includes a semiconductor device, a first metallization layer on the semiconductor device, a second metallization layer on the first metallization layer, and a third dielectric layer between the first metallization layer and the second metallization layer. The first metallization layer includes a first dielectric layer and a first metal layer disposed in the first dielectric layer, wherein the first metal layer has a first thickness, and the first metal layer comprises copper. The third dielectric layer has a second thickness, and a ratio of the second thickness of the third dielectric layer to the first thickness of the first metal layer is ranged from about 3 to about 20.

Abstract: The semiconductor structure includes a semiconductor device, a first metallization layer on the semiconductor device, a second metallization layer on the first metallization layer, and a third dielectric layer between the first metallization layer and the second metallization layer. The first metallization layer includes a first dielectric layer and a first metal layer disposed in the first dielectric layer, wherein the first metal layer has a first thickness, and the first metal layer comprises copper. The third dielectric layer has a second thickness, and a ratio of the second thickness of the third dielectric layer to the first thickness of the first metal layer is ranged from about 3 to about 20.

Abstract: A staple gun includes: a casing having a front blocking surface; a magazine disposed in the casing; and a staple delivery element and a resilient element disposed at the magazine. The magazine includes at least a staple cutting portion each having a top surface, a front end surface, and a guiding surface connected between the top surface and the front end surface. The front end surface and the guiding surface face the front blocking surface. A clearance for passing staples is disposed between the front end surface and the front blocking surface. The staple delivery element pushes staples in the magazine in a staple delivering direction. The resilient element enables staples to push the front end surface and the guiding surface of the staple cutting portion of the magazine, such that the magazine moves relative to the casing in a clearance adjustment direction opposite to the staple delivering direction.

Abstract: A conductive substrate comprises a substrate, a plurality of conductive patterns, and a plurality of optical compensation patterns. The conductive patterns extend along a first direction and are sequentially disposed on the substrate along a second direction. The optical compensation patterns are staggered from the conductive patterns along the second direction on the substrate. An edge of at least one of the conductive patterns extending along the first direction has a plurality of conductive protrusions, and an edge of at least one of the optical compensation patterns extending along the first direction has a plurality of optical compensation protrusions. A touch display device is also disclosed.

Abstract: Provided are improved semiconductor memory devices and method for manufacturing such semiconductor memory devices. A method may incorporate the formation of silicide regions in a semiconductor. The method may allow for a semiconductor with a silicide layer with improved resistance and reduced silicide bridge formation.

Abstract: Provided are improved semiconductor memory devices and method for manufacturing such semiconductor memory devices. A method may incorporate the formation of silicide regions in a semiconductor. The method may allow for a semiconductor with a silicide layer with improved resistance and reduced silicide bridge formation.

Abstract: A staple gun includes: a casing having a front blocking surface; a magazine disposed in the casing; and a staple delivery element and a resilient element disposed at the magazine. The magazine includes at least a staple cutting portion each having a top surface, a front end surface, and a guiding surface connected between the top surface and the front end surface. The front end surface and the guiding surface face the front blocking surface. A clearance for passing staples is disposed between the front end surface and the front blocking surface. The staple delivery element pushes staples in the magazine in a staple delivering direction. The resilient element enables staples to push the front end surface and the guiding surface of the staple cutting portion of the magazine, such that the magazine moves relative to the casing in a clearance adjustment direction opposite to the staple delivering direction.

Abstract: A charging base has a bottom case, a printed circuit board (PCB) and a top case. The bottom case includes at least one drainage hole. The PCB is mounted in the bottom case and includes a mounting hole, a positioning block and charging terminals. The positioning block is attached to the PCB and has through holes. The charging terminals are secured to the positioning block and have apertures. The top case covers the bottom case and includes terminal holes and a top enclosed wall. The top enclosed wall is secured around the positioning block. Therefore, when water accidentally enters the charging base via the terminal holes, the water will sequentially flow through the apertures of the charging terminals, the through holes of the positioning block and the mounting hole of the PCB and subsequently drain out of the drainage hole of the bottom case.

Abstract: A conductive substrate comprises a substrate, a plurality of conductive patterns, and a plurality of optical compensation patterns. The conductive patterns extend along a first direction and are sequentially disposed on the substrate along a second direction. The optical compensation patterns are staggered from the conductive patterns along the second direction on the substrate. An edge of at least one of the conductive patterns extending along the first direction has a plurality of conductive protrusions, and an edge of at least one of the optical compensation patterns extending along the first direction has a plurality of optical compensation protrusions. A touch display device is also disclosed.

Abstract: A hinge is mounted between a cover and a body of an electronic device and has an eccentric sleeve and a resisting assembly abutting against each other. When the cover is pivoted, the eccentric sleeve is rotated as well. Because the eccentric sleeve has sectors with varied radiuses, the resisting assembly is compressed to conduct various resisting forces when the eccentric sleeve is rotated. When the cover is opened to a normal visual angle, the hinge provides a constant largest torque. Therefore, the cover is held at the normal visual angle even though the user hits the touch panel on the cover.

Abstract: A charging base has a bottom case, a printed circuit board (PCB) and a top case. The bottom case includes at least one drainage hole. The PCB is mounted in the bottom case and includes a mounting hole, a positioning block and charging terminals. The positioning block is attached to the PCB and has through holes. The charging terminals are secured to the positioning block and have apertures. The top case covers the bottom case and includes terminal holes and a top enclosed wall. The top enclosed wall is secured around the positioning block. Therefore, when water accidentally enters the charging base via the terminal holes, the water will sequentially flow through the apertures of the charging terminals, the through holes of the positioning block and the mounting hole of the PCB and subsequently drain out of the drainage hole of the bottom case.

Abstract: A hinge is mounted in a sliding assembly for a portable device. The hinge has a hollow pintle, a first positioning ring, a second positioning ring and a resilient element. The positioning rings are mounted around the pintle and respectively have corresponding detents and protrusions to provide positioning function. The resilient element is mounted in the pintle and is mounted between the positioning rings to reduce the length of the hinge. When the second positioning ring is rotated, the second positioning ring also moves upward to lift the supporting panel of the sliding assembly and the cover of the portable device. Therefore, the cover is kept from bumping into the expanding parts of the portable device.

Abstract: A hinge is mounted in a portable device with two panels and has a flexible tube and a linking unit. The linking unit receives the flexible tube and is attached to the panels of the portable device. Since the flexible tube does not restrict the rotating angle, the panels can stay at any desired visual angle and are pivoted steplessly.

Abstract: A hinge is mounted between a cover and a body of an electronic device and has an eccentric sleeve and a resisting assembly abutting against each other. When the cover is pivoted, the eccentric sleeve is rotated as well. Because the eccentric sleeve has sectors with varied radius, the resisting assembly is compressed to conduct various resisting forces when the eccentric sleeve is rotated. When the cover is opened to normal visual angle, the hinge provides a constant largest torque. Therefore, the cover is held at the normal visual angle even though the user hits the touch panel on the cover.