Patents by Inventor Kuan Ching Woo

Kuan Ching Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including a solder barrier
    Patent number: 9640459
    Abstract: A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: May 2, 2017
    Assignee: Infineon Technologies AG
    Inventors: Wee Boon Tay, Kuan Ching Woo, Paul Armand Calo