Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.

Abstract: A speaker is provided and includes a first speaker body, a second speaker body, a speaker component, and a sound transmission member. The first speaker body has a first chamber. The second speaker body has a second chamber. The second speaker body is received in the first chamber and defines a resonant cavity in the first chamber. The speaker component is disposed on the second speaker body and includes a supporting member, a magnet, a coil, and a diaphragm. Two ends of the supporting member are respectively inserted into the second chamber and fixed on the second speaker body. The magnet is disposed in the supporting member. The diaphragm is disposed on the supporting member and abuts against the second speaker body. The coil is received in the magnet and is connected to the diaphragm. The sound transmission member is coaxially disposed in the resonant cavity with the speaker component.

Abstract: A sound-receiving device includes a housing, a connecting cavity, a sound-receiving assembly, and a signal processing circuit. An outer surface of the housing is provided with a first sound-receiving hole and a second sound-receiving hole. The connecting cavity is provided in an internal space of the housing. The connecting cavity includes a connecting channel. A first hole and a second hole are respectively provided at two ends of the connecting channel. The first hole is connected to the first sound-receiving hole, and the second hole is connected to the second sound-receiving hole. The sound-receiving assembly includes a first sound-receiving diaphragm and a second sound-receiving diaphragm. The sound-receiving assembly is disposed between the first hole and the first sound-receiving hole. The signal processing circuit is electrically connected to the sound-receiving assembly. The signal processing circuit generates an output result according to the first sound and the second sound.

Abstract: A speaker apparatus includes an enclosure, a speaker unit, and a bass reinforcement unit. The enclosure includes an inner cavity, where a cavity volume of the inner cavity is in a range of 0.5 milliliter to 1 milliliter, the enclosure has a cavity acoustic compliance value, and the cavity acoustic compliance value is obtained by dividing the cavity volume by a product of air density and a sound velocity squared. The speaker unit includes a diaphragm and a surround, the speaker unit has a speaker acoustic compliance value and an effective sound outlet area, and the speaker acoustic compliance value is a product of a mechanical compliance value of the surround and the effective sound outlet area squared, and a ratio of the speaker acoustic compliance value to the cavity acoustic compliance value is less than or equal to 1. The bass reinforcement unit outputs a low-frequency response frequency.