Patents by Inventor Kuan-Chun Tseng

Kuan-Chun Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10115848
    Abstract: A method of transferring a thin film includes: providing a first element structure, wherein the first element structure includes a first substrate and a functional film layer formed on the first substrate; completely removing the first substrate, wherein steps of the completely removing the first substrate includes: conducting an etching step to erode the first substrate, and conducting a grinding step to planarize the eroded first substrate; and after completely removing the first substrate, attaching the functional film layer on a second substrate to form a second element structure.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: October 30, 2018
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Yu-Lun Chueh, Kuan-Chun Tseng, Yu-Ting Yen
  • Patent number: 9943947
    Abstract: A multi-purpose tool assembly may comprise one or more body members. A body member may comprise a magnet, a main body and a bit. The main body may comprise various sides, one or more of which may include one or more apertures on its surface and one or more bits protruding therefrom. The bit may include a bit body and a bit head. The body members may include differently configured bits. Bits may be inserted into the apertures to connect the body members. The bit assembly may comprise one or more attachment members. An attachment member may attach two or more bits together.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: April 17, 2018
    Assignee: Allium LLC
    Inventor: Kuan-Chun Tseng
  • Publication number: 20170092794
    Abstract: A method of transferring a thin film includes: providing a first element structure, wherein the first element structure includes a first substrate and a functional film layer formed on the first substrate; completely removing the first substrate, wherein steps of the completely removing the first substrate includes: conducting an etching step to erode the first substrate, and conducting a grinding step to planarize the eroded first substrate; and after completely removing the first substrate, attaching the functional film layer on a second substrate to form a second element structure.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 30, 2017
    Inventors: YU-LUN CHUEH, KUAN-CHUN TSENG, YU-TING YEN
  • Publication number: 20170074308
    Abstract: A multi-purpose bit assembly is shown and described herein. The tool assembly may comprise one or more body members. A body member may comprise a magnet, a main body and a bit. The main body may comprise various sides, one or more of which may include one or more apertures on its surface and one or more bits protruding therefrom. The bit may include a bit body and a bit head. The body members may include differently configured bits. Bits may be inserted into the apertures to connect the body members. The bit assembly may comprise one or more attachment members. An attachment member may attach two or more bits together.
    Type: Application
    Filed: September 10, 2015
    Publication date: March 16, 2017
    Inventor: Kuan-Chun Tseng
  • Patent number: 8264249
    Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.
    Type: Grant
    Filed: August 2, 2009
    Date of Patent: September 11, 2012
    Assignee: Chunghwa Precision Test Tech. Co., Ltd.
    Inventors: Wen-Tsung Lee, Kuan-Chun Tseng
  • Publication number: 20110025357
    Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.
    Type: Application
    Filed: August 2, 2009
    Publication date: February 3, 2011
    Inventors: Wen-Tsung LEE, Kuan-Chun Tseng
  • Patent number: D790311
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: June 27, 2017
    Assignee: ALLIUM LLC
    Inventor: Kuan-Chun Tseng