Abstract: A method of transferring a thin film includes: providing a first element structure, wherein the first element structure includes a first substrate and a functional film layer formed on the first substrate; completely removing the first substrate, wherein steps of the completely removing the first substrate includes: conducting an etching step to erode the first substrate, and conducting a grinding step to planarize the eroded first substrate; and after completely removing the first substrate, attaching the functional film layer on a second substrate to form a second element structure.

Abstract: A multi-purpose tool assembly may comprise one or more body members. A body member may comprise a magnet, a main body and a bit. The main body may comprise various sides, one or more of which may include one or more apertures on its surface and one or more bits protruding therefrom. The bit may include a bit body and a bit head. The body members may include differently configured bits. Bits may be inserted into the apertures to connect the body members. The bit assembly may comprise one or more attachment members. An attachment member may attach two or more bits together.

Abstract: A method of transferring a thin film includes: providing a first element structure, wherein the first element structure includes a first substrate and a functional film layer formed on the first substrate; completely removing the first substrate, wherein steps of the completely removing the first substrate includes: conducting an etching step to erode the first substrate, and conducting a grinding step to planarize the eroded first substrate; and after completely removing the first substrate, attaching the functional film layer on a second substrate to form a second element structure.

Abstract: A multi-purpose bit assembly is shown and described herein. The tool assembly may comprise one or more body members. A body member may comprise a magnet, a main body and a bit. The main body may comprise various sides, one or more of which may include one or more apertures on its surface and one or more bits protruding therefrom. The bit may include a bit body and a bit head. The body members may include differently configured bits. Bits may be inserted into the apertures to connect the body members. The bit assembly may comprise one or more attachment members. An attachment member may attach two or more bits together.

Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.

Abstract: The present invention provides on IC test substrate for testing various signals, a combined flexible and rigid PCB included in the structure is applicable to perform a mission including for example: stabilizing power input/output, signal transfer by a connector; general, power, and high frequency signal transmission in preserved integrity state.