Patents by Inventor Kuan-Da Pan

Kuan-Da Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11659686
    Abstract: A water cooling system includes a water block, a heat radiator, a pump, a circulating conduit and a water storage assembly. The pump is disposed between the water block and the heat radiator. The circulating conduit communicates with the water block, the heat radiator and the pump. The water storage assembly is configured to be a part of an integrated element. The integrated element includes one of the water block, the heat radiator and the pump. The water storage assembly includes a liquid storage chamber and a liquid guide. The liquid storage chamber has an inner wall. An end of the liquid guide has a protrusive tube end reaching to the liquid storage chamber. The protrusive tube end protrudes from the inner wall. An angular space is formed between the protrusive tube end and the inner wall.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 23, 2023
    Assignee: KUAN DING INDUSTRIAL CO., LTD.
    Inventors: Kuan-Da Pan, Ming-Cheng Peng
  • Publication number: 20220400578
    Abstract: A water cooling system includes a water block, a heat radiator, a pump, a circulating conduit and a water storage assembly. The pump is disposed between the water block and the heat radiator. The circulating conduit communicates with the water block, the heat radiator and the pump. The water storage assembly is configured to be a part of an integrated element. The integrated element includes one of the water block, the heat radiator and the pump. The water storage assembly includes a liquid storage chamber and a liquid guide. The liquid storage chamber has an inner wall. An end of the liquid guide has a protrusive tube end reaching to the liquid storage chamber. The protrusive tube end protrudes from the inner wall. An angular space is formed between the protrusive tube end and the inner wall.
    Type: Application
    Filed: August 25, 2021
    Publication date: December 15, 2022
    Inventors: Kuan-Da Pan, Ming-Cheng Peng
  • Patent number: 10866031
    Abstract: A liquid cooling device includes a base (1), a passive impeller (3) and a cold plate (4). The base (1) includes a division plate (11), a chamber (12) and a flow guiding pole (13). The division plate (11) divides the chamber (12) into a catchment portion and a heat exchanging portion (17). The flow guiding pole (13) communicates with both the catchment portion (16) and the heat exchanging portion (17). The passive impeller (3) is received in the chamber (12) and radially driven to rotate by the working fluid. The cold plate (4) is arranged correspondingly to the heat exchanging portion (17) and fastened to the base (1).
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: December 15, 2020
    Assignee: KUAN DING INDUSTRIAL CO., LTD.
    Inventors: Kuan-Da Pan, Neng-Chao Chang, Ming-Cheng Peng, Pei-Ching Chao
  • Publication number: 20200173728
    Abstract: A liquid cooling device includes a base (1), a passive impeller (3) and a cold plate (4). The base (1) includes a division plate (11), a chamber (12) and a flow guiding pole (13). The division plate (11) divides the chamber (12) into a catchment portion and a heat exchanging portion (17). The flow guiding pole (13) communicates with both the catchment portion (16) and the heat exchanging portion (17). The passive impeller (3) is received in the chamber (12) and radially driven to rotate by the working fluid. The cold plate (4) is arranged correspondingly to the heat exchanging portion (17) and fastened to the base (1).
    Type: Application
    Filed: March 20, 2019
    Publication date: June 4, 2020
    Inventors: Kuan-Da PAN, Neng-Chao CHANG, Ming-Cheng PENG, Pei-Ching CHAO
  • Patent number: 10455732
    Abstract: A liquid-cooled heat dissipation apparatus includes a water cooling module (1), a water pump set (2) and a reservoir tank (3). The water cooling module (1) includes a heat exchange unit (11) and a base (12) having a pump receiving slot (121) and a heat exchange chamber (T). The base (12) includes a water inlet channel (G1), drainage channel (G2) and first channel (G10). The water pump set (2) is arranged inside the pump receiving slot (121) and includes a rotor assembly (21) and a blade assembly (23). The blade assembly (23) is attached onto the rotor assembly (21) and includes a second channel (G20). The reservoir tank (3) is detachably stacked onto the water cooling module (1) and includes a water containing chamber (R) and a water supply channel (G3) formed thereon. Accordingly, the apparatus achieves the effects of independent reservoir, readily water supply and pipeline exhaust simultaneously.
    Type: Grant
    Filed: May 18, 2017
    Date of Patent: October 22, 2019
    Assignee: KUAN DING INDUSTRIAL CO., LTD.
    Inventor: Kuan-Da Pan
  • Publication number: 20170339802
    Abstract: A liquid-cooled heat dissipation apparatus includes a water cooling module (1), a water pump set (2) and a reservoir tank (3). The water cooling module (1) includes a heat exchange unit (11) and a base (12) having a pump receiving slot (121) and a heat exchange chamber (T). The base (12) includes a water inlet channel (G1), drainage channel (G2) and first channel (G10). The water pump set (2) is arranged inside the pump receiving slot (121) and includes a rotor assembly (21) and a blade assembly (23). The blade assembly (23) is attached onto the rotor assembly (21) and includes a second channel (G20). The reservoir tank (3) is detachably stacked onto the water cooling module (1) and includes a water containing chamber (R) and a water supply channel (G3) formed thereon. Accordingly, the apparatus achieves the effects of independent reservoir, readily water supply and pipeline exhaust simultaneously.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 23, 2017
    Inventor: KUAN-DA PAN
  • Publication number: 20100282444
    Abstract: The present invention relates to a heat-dissipating fin capable of increasing surface turbulence, which includes a first heat-dissipating fin and a second heat-dissipating fin. A first surface of the first heat-dissipating fin is provided with a plurality of first protrusions arranged at intervals. The second heat-dissipating fin has a second surface toward the first surface. The second surface is also provided with a plurality of second protrusions arranged at intervals. The second protrusions are arranged to correspond to the first protrusions. The second heat-dissipating fin is overlapped with the first heat-dissipating fin. With the arrangement of the first protrusions and the second protrusions, the heat-dissipating area of the first heat-dissipating fin and the second heat-dissipating fin can be increased so as to increase the surface turbulence. Thus, the heat-exchange efficiency can be enhanced.
    Type: Application
    Filed: July 30, 2009
    Publication date: November 11, 2010
    Inventors: Kuo-Len LIN, Chih-Hung Cheng, Kuan-Da Pan
  • Patent number: 6702007
    Abstract: A heat sink structure, having a heat sink and a thermal conductive block. The heat sink has a receiving slot recessed from a central portion of a bottom thereof. The thermal conductive block has a plurality of uneven surfaces thereon and a plurality of conical through holes therein. The thermal conductive block is pressed into the receiving slot while the heat sink is softened by heating, and the heat sink has a thermal expansion coefficient larger than the thermal conductive block, such that a wall of the receiving slot is partly extruded into or through the conical through holes, and the wall outside of the conical through holes is partly contracted into the conical holes in a cooling process after the thermal conductive block is pressed into the receiving slot. The conical through holes also provides the function of expelling gas, such that the thermal conductive block is firmly attached to the heat sink, and the heat dissipation effect is further enhanced.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: March 9, 2004
    Inventors: Kuan-Da Pan, Po-Chou Shih, Kuei-Yin Kuo, Chia-Min Chou