Patents by Inventor Kuan-Fu Chang

Kuan-Fu Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
    Patent number: 6679765
    Abstract: A slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus. The slurry supply system includes a wafer carrier configured to hold a semiconductor wafer to be polished; a supporting arm to support the wafer carrier; a slurry supplier connected to the supporting arm and located on the front edge of the rotating direction of the rotating platen so that the slurry supplier is positioned opposite the wafer carrier; and a plurality of openings formed on the slurry supplier to feed chemical mechanical polishing fluids, each of the openings individually supplied with individual control of the chemical mechanical polishing fluids.
    Type: Grant
    Filed: July 26, 2002
    Date of Patent: January 20, 2004
    Assignee: Promos Technologies, Inc.
    Inventors: Jen-Chieh Tung, Yu-Wei Chin, Kuan-Fu Chang, Sheng-Jan Chang
  • Slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus
    Publication number: 20030139117
    Abstract: A slurry supply system disposed above the rotating platen of a chemical mechanical polishing apparatus. The slurry supply system includes a wafer carrier configured to hold a semiconductor wafer to be polished; a supporting arm to support the wafer carrier; a slurry supplier connected to the supporting arm and located on the front edge of the rotating direction of the rotating platen so that the slurry supplier is positioned opposite the wafer carrier; and a plurality of openings formed on the slurry supplier to feed chemical mechanical polishing fluids, each of the openings individually supplied with individual control of the chemical mechanical polishing fluids.
    Type: Application
    Filed: July 26, 2002
    Publication date: July 24, 2003
    Inventors: Jen-Chieh Tung, Yu-Wei Chih, Kuan-Fu Chang, Sheng-Jan Chang