Abstract: An electronic device may have a display overlapped by a display cover layer. Portions of the surface of the display and cover layer may have curved profiles. For example, a display cover layer may have transparent sidewall portions with curved surface profiles. The transparent sidewall portions of the display cover layer may include rounded corners having areas of compound curvature. A flexible display panel may be pressed over a mold to impart desired curvature (such as compound curvature) to the flexible display panel. To mitigate wrinkling in a flexible display panel molded to have compound curvature, a backfilm may be included that absorbs compressive strains in the display panel. The backfilm may have a coefficient of thermal expansion that is higher than that of the display panel. Instead or in addition, the backfilm may have portions with different Young's modulus magnitudes or different thickness magnitudes.

Abstract: Conformable transfer devices and micro-transfer printing methods are described. In an embodiment, a conformable transfer devices includes first and second arrays of transfer heads with differential lengths to support a micro-transfer printing sequence including a single pick operation and multiple placement operations.

Abstract: A display may include light-emitting components such as light-emitting diodes on a transparent substrate. Conductive signal paths between the light-emitting components, driver integrated circuits for controlling the light-emitting components, and the light-emitting components themselves may be opaque. To mitigate diffraction artifacts caused by the opaque components, the opaque footprint of the display may be selected to include non-periodic portions. The non-periodic portions increase randomness and reduce periodicity within the opaque footprint, which mitigates perceptible diffraction artifacts when viewing the display. One or both of the component mounting portions and interconnect portions of the opaque footprint may be non-periodic. The component mounting portions may have random shapes. The interconnect portions may follow random paths between the component mounting portions.

Abstract: An electronic device may have a display overlapped by a display cover layer. Portions of the surface of the display and cover layer may have curved profiles. For example, a display cover layer may have transparent sidewall portions with curved surface profiles. The transparent sidewall portions of the display cover layer may include rounded corners having areas of compound curvature. A flexible display panel may be pressed over a mold to impart desired curvature (such as compound curvature) to the flexible display panel. To mitigate wrinkling in a flexible display panel molded to have compound curvature, a film may be included that absorbs force in the display panel. The film may have a coefficient of thermal expansion that is different than that of the display panel. Instead or in addition, the film may have portions with different Young's modulus magnitudes or different thickness magnitudes.

Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: A tiling display system has multiple display panels. The display panels may be positioned by positioners that are coupled to the display panels. In an untiled operating mode, the display panels of the tiling display system are moved apart. In this mode, each display panel can display different content such as different static images of artwork. In a tiled operating mode, the display panels of the tiling system are moved together to form a single display that displays a single still or moving image. Components on the backs of the display panels and/or along the edges of the display panels may be used to facilitate panel-to-panel alignment, to help couple adjacent panels together, and to support the transfer of power and/or data signals among the panels. The components may include optical and/or electrical alignment sensors, magnets for alignment and coupling, and transmitters and receivers for transmitting and receiving signals.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

Abstract: An electronic device such as a voice-controlled speaker device may have a cylindrical shape with upper and lower ends that have surface regions of compound curvature. The electronic device may have a display formed form an array of light-emitting devices such as light-emitting diodes. To provide the display with desired curvature (such as compound curvature), the display may be thermoformed. A flexible substrate for the display may be attached to a separate thermoplastic substrate. During a thermoforming process, the display may be heated such that the thermoplastic substrate softens into a pliable state. The display may then be molded into a desired shape. The display is then cooled to harden the thermoplastic substrate and secure the flexible substrate and light-emitting diodes in the desired shape. The thermoformed display may be stacked with additional functional layers such as a thermoformed touch-sensitive layer and/or a thermoformed lens layer.

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.