Patents by Inventor Kuan-Hsiao Lin

Kuan-Hsiao Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal plating apparatus and method using solenoid coil
    Patent number: 9809897
    Abstract: A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: November 7, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsili Chen, Kuan-Hsiao Lin, Chung-Yen Yang, Shao-Chien Yang
  • Electroplating systems and methods
    Patent number: 7837850
    Abstract: An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: November 23, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ming-Da Guo, Pin-Chieh Hu, Hung-Cheng Chen, Kuan-Hsiao Lin, Wen-Chang Peng, Hsiao-Pin Shih, Chyi-Shyuan Chern
  • Electroplating systems and methods
    Publication number: 20070068818
    Abstract: An electroplating system is provided. The system comprises a reaction tank, a tube, and a video bubble detector. The reaction tank, having a first diameter, contains a plating solution. The tube, connecting to the reaction tank, comprises an inflow tube and a branch, wherein the inflow tube inputs the plating solution into the reaction tank, and the branch has an enlarged part having the first diameter. The video bubble detector, mounted on the enlarged part of the branch, detects the presence of a bubble in the plating solution flowing through the branch.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 29, 2007
    Inventors: Ming-Da Guo, Pin-Chieh Hu, Hung-Cheng Chen, Kuan-Hsiao Lin, Wen-Chang Peng, Hsiao-Pin Shih, Chyi-Shyuan Chern