Patents by Inventor Kuan-Hsien LEE

Kuan-Hsien LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978678
    Abstract: A display device includes a first substrate, a light-emitting element, a light conversion layer, and a color filter layer. The light-emitting element is disposed on the first substrate. The light conversion layer is disposed on the light-emitting element. In addition, the color filter layer is overlapped the light-emitting element and the light conversion layer.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: May 7, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tung-Kai Liu, Tsau-Hua Hsieh, Wei-Cheng Chu, Chun-Hsien Lin, Chandra Lius, Ting-Kai Hung, Kuan-Feng Lee, Ming-Chang Lin, Tzu-Min Yan, Hui-Chieh Wang
  • Publication number: 20240128420
    Abstract: A display panel including a circuit board, a plurality of bonding pads, a plurality of light emitting devices, and a plurality of solder patterns is provided. The bonding pads are disposed on the circuit board, and each includes a first metal layer and a second metal layer. The second metal layer is located between the first metal layer and the circuit board. The first metal layer includes an opening overlapping the second metal layer. A material of the first metal layer is different from a material of the second metal layer. The light emitting devices are electrically bonded to the bonding pads. Each of the solder patterns electrically connects one of the light emitting devices and one of the bonding pads. The solder patterns each contact the second metal layer through the opening of the first metal layer of one of the bonding pads to form a eutectic bonding.
    Type: Application
    Filed: December 6, 2022
    Publication date: April 18, 2024
    Applicant: AUO Corporation
    Inventors: Chia-Hui Pai, Tai-Tso Lin, Wen-Hsien Tseng, Wei-Chieh Chen, Kuan-Yi Lee, Chih-Chun Yang
  • Patent number: 11894319
    Abstract: Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Hsorng Shen, Kuan-Hsien Lee
  • Publication number: 20240030615
    Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point, and is coupled to a first grounding point on the ground element. A slot region is surrounded by the first radiation element and the ground element. The second radiation element is coupled to a second grounding point on the ground element. The third radiation element is coupled to the second grounding point. The third radiation element and the second radiation element substantially extend in opposite directions. The fourth radiation element and the fifth radiation element are disposed inside the slot region. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, and the fifth radiation element.
    Type: Application
    Filed: September 6, 2022
    Publication date: January 25, 2024
    Inventors: Chun-I CHENG, Chung-Ting HUNG, Chin-Lung TSAI, Kuan-Hsien LEE, Yu-Chen ZHAO, Kai-Hsiang CHANG
  • Publication number: 20240021988
    Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.
    Type: Application
    Filed: September 2, 2022
    Publication date: January 18, 2024
    Inventors: Yu-Chen ZHAO, Chung-Ting HUNG, Chin-Lung TSAI, Ying-Cong DENG, Kuan-Hsien LEE, Yi-Chih LO, Kai-Hsiang CHANG, Chun-I CHENG, Yan-Cheng HUANG
  • Publication number: 20230402741
    Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, and a sixth radiation element. The first radiation element has a feeding point. The first radiation element is coupled to the ground element. The third radiation element is coupled through the second radiation element to the first radiation element. The fourth radiation element is coupled through the second radiation element to the first radiation element. The fifth radiation element is coupled to the first radiation element. The sixth radiation element is coupled to the ground element. The sixth radiation element is adjacent to the fourth radiation element. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, the fifth radiation element, and the sixth radiation element.
    Type: Application
    Filed: July 22, 2022
    Publication date: December 14, 2023
    Inventors: Kai-Hsiang CHANG, Chung-Ting HUNG, Chin-Lung TSAI, Kuan-Hsien LEE, Yu-Chen ZHAO, Chun-I CHENG
  • Patent number: 11784397
    Abstract: A wearable device includes a first radiation element, a second radiation element, a third radiation element, and a dielectric substrate. The first radiation element has a feeding point. The second radiation element is coupled to a ground voltage, and is disposed adjacent to the first radiation element. The third radiation element is coupled to the ground voltage, and is disposed adjacent to the first radiation element. The third radiation element is at least partially surrounded by the first radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the dielectric substrate. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.
    Type: Grant
    Filed: July 22, 2022
    Date of Patent: October 10, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Kuan-Hsien Lee, Chung-Ting Hung, Chin-Lung Tsai, Yu-Chen Zhao, Kai-Hsiang Chang, Chun-I Cheng
  • Publication number: 20220359429
    Abstract: Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Shih-Hsorng Shen, Kuan-Hsien Lee
  • Patent number: 11444369
    Abstract: An antenna structure includes a metal mechanism element, a first radiation element, a second radiation element, a third radiation element, and a dielectric substrate. The metal mechanism element has a slot with a first closed end and a second closed end. The first radiation element has a feeding point. The second radiation element is coupled to the feeding point. The second radiation element and the first radiation element substantially extend away from each other. The third radiation element is coupled to a ground voltage. The third radiation element extends across the slot of the metal mechanism element. The dielectric substrate has a first surface and a second surface opposite to each other. The first radiation element, the second radiation element, and the third radiation element are disposed on the first surface of the dielectric substrate. The second surface of the dielectric substrate is adjacent to the slot.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: September 13, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Ling Tseng, Chin-Lung Tsai, Chung-Ting Hung, Kuan-Hsien Lee, Ying-Cong Deng
  • Patent number: 11361706
    Abstract: A micro-LED display system is disclosed. The micro-LED display system includes a host, a plurality of row/column drivers and a plurality of ?ICs. The row/column drivers are coupled to the host through serial interfaces and used to provide a plurality of row clock signals and a plurality of column data signals respectively. The ?ICs are arranged as a matrix including columns of ?ICs and rows of ?ICs receiving the column data signals and the row clock signals respectively. All ?ICs in the same column of ?ICs are cascaded in order and all ?ICs in the same row of ?ICs are cascaded in order.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: June 14, 2022
    Assignee: Raydium Semiconductor Corporation
    Inventors: Kuan-Hsien Lee, Chien-Yu Chan, Yann-Hsiung Liang, Yu-Lung Lo
  • Publication number: 20220037268
    Abstract: Embodiments include a wafer-on-wafer bonding where each wafer includes a seal ring structure around die areas defined in the wafer. Embodiments provide a further seal ring spanning the interface between the wafers. Embodiments may extend the existing seal rings of the wafers, provide an extended seal ring structure separate from the existing seal rings of the wafers, or combinations thereof.
    Type: Application
    Filed: January 15, 2021
    Publication date: February 3, 2022
    Inventors: Shih-Hsorng Shen, Kuan-Hsien Lee
  • Patent number: 11211708
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, and a dielectric substrate. The ground plane provides a ground voltage. The first radiation element includes a connection branch, a first branch, and a second branch. The connection branch has a feeding point. The first branch and the second branch substantially extend in opposite directions. The second radiation element is coupled to the feeding point. The second radiation element substantially surrounds a non-metal region, and is further coupled to the ground voltage. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the first radiation element. The first radiation element, the second radiation element, and the third radiation element are all disposed on the dielectric substrate.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: December 28, 2021
    Assignee: QUANTA COMPUTER INC
    Inventors: Chung-Hung Lo, Ying-Cong Deng, Kuan-Hsien Lee, Yi-Ling Tseng, Chung-Ting Hung, Chin-Lung Tsai
  • Patent number: 11171419
    Abstract: An antenna structure includes a nonconductive supporting element, a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, and a fourth radiation element. The first radiation element is coupled to a ground voltage. A first coupling gap is formed between the first radiation element and the feeding radiation element. The second radiation element is coupled to the first radiation element. A second coupling gap is formed between the second radiation element and the feeding radiation element. The third radiation element is coupled to the first radiation element. The fourth radiation element is coupled to the ground voltage. A third coupling gap is formed between the fourth radiation element and the feeding radiation element. The feeding radiation element, the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are all disposed on the nonconductive supporting element.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: November 9, 2021
    Assignee: QUANTA COMPUTER INC
    Inventors: Chin-Lung Tsai, Ying-Cong Deng, Chung-Hung Lo, Kuan-Hsien Lee, Yi-Ling Tseng, Chung-Ting Hung
  • Patent number: 11101574
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a dielectric substrate. The first radiation element has a feeding point. The second radiation element is coupled to the feeding point. The non-metal region is substantially surrounded by the first radiation element and the second radiation element. The third radiation element is coupled to a first shorting point on the ground plane. The third radiation element is adjacent to the first radiation element and the second radiation element. The fourth radiation element is coupled to a second shorting point on the ground plane. The fourth radiation element is adjacent to the second radiation element. The ground plane, the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are all disposed on the dielectric substrate.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: August 24, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chin-Lung Tsai, Ying-Cong Deng, Chung-Hung Lo, Kuan-Hsien Lee, Yi-Ling Tseng, Chung-Ting Hung
  • Patent number: 11095032
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, and a fourth radiation element. A closed slot is formed in the ground plane. The first radiation element has a feeding point. The first radiation element is coupled to a first shorting point on the ground plane. The second radiation element is coupled to a second shorting point on the ground plane. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the feeding point. The fourth radiation element is coupled to a third shorting point on the ground plane. The fourth radiation element is adjacent to the third radiation element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are all disposed inside the closed slot.
    Type: Grant
    Filed: January 20, 2020
    Date of Patent: August 17, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yi-Ling Tseng, Chung-Hung Lo, Chin-Lung Tsai, Kuan-Hsien Lee, Ying-Cong Deng, Chung-Ting Hung
  • Publication number: 20210217354
    Abstract: A micro-LED display system is disclosed. The micro-LED display system includes a host, a plurality of row/column drivers and a plurality of ?ICs. The row/column drivers are coupled to the host through serial interfaces and used to provide a plurality of row clock signals and a plurality of column data signals respectively. The ?ICs are arranged as a matrix including columns of ?ICs and rows of ?ICs receiving the column data signals and the row clock signals respectively. All ?ICs in the same column of ?ICs are cascaded in order and all ?ICs in the same row of ?ICs are cascaded in order.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 15, 2021
    Inventors: Kuan-Hsien Lee, Chien-Yu Chan, Yann-Hsiung Liang, Yu-Lung Lo
  • Patent number: 11050148
    Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a third radiation element, a first capacitor, and a second capacitor. The ground element has a notch region. The feeding radiation element has a feeding point. The first radiation element is coupled to the ground element. The first capacitor is coupled between the feeding radiation element and the first radiation element. The second radiation element is coupled to the ground element. The second capacitor is coupled between the first radiation element and the second radiation element. The third radiation element is coupled to the feeding radiation element. The feeding radiation element, the first radiation element, the second radiation element, the third radiation element, the first capacitor, and the second capacitor are all disposed inside the notch region of the ground element.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 29, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chung-Hung Lo, Yi-Ling Tseng, Chin-Lung Tsai, Ching-Hai Chiang, Kuan-Hsien Lee, Ying-Cong Deng, Chung-Ting Hung
  • Publication number: 20210167501
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, and a dielectric substrate. The ground plane provides a ground voltage. The first radiation element includes a connection branch, a first branch, and a second branch. The connection branch has a feeding point. The first branch and the second branch substantially extend in opposite directions. The second radiation element is coupled to the feeding point. The second radiation element substantially surrounds a non-metal region, and is further coupled to the ground voltage. The third radiation element is coupled to the ground voltage. The third radiation element is adjacent to the first radiation element. The first radiation element, the second radiation element, and the third radiation element are all disposed on the dielectric substrate.
    Type: Application
    Filed: January 20, 2020
    Publication date: June 3, 2021
    Inventors: Chung-Hung LO, Ying-Cong DENG, Kuan-Hsien LEE, Yi-Ling TSENG, Chung-Ting HUNG, Chin-Lung TSAI
  • Publication number: 20210167521
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a dielectric substrate. The first radiation element has a feeding point. The second radiation element is coupled to the feeding point. The non-metal region is substantially surrounded by the first radiation element and the second radiation element. The third radiation element is coupled to a first shorting point on the ground plane. The third radiation element is adjacent to the first radiation element and the second radiation element. The fourth radiation element is coupled to a second shorting point on the ground plane. The fourth radiation element is adjacent to the second radiation element. The ground plane, the first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are all disposed on the dielectric substrate.
    Type: Application
    Filed: January 20, 2020
    Publication date: June 3, 2021
    Inventors: Chin-Lung TSAI, Ying-Cong DENG, Chung-Hung LO, Kuan-Hsien LEE, Yi-Ling TSENG, Chung-Ting HUNG
  • Publication number: 20210167499
    Abstract: An antenna structure includes a ground plane, a first radiation element, a second radiation element, a third radiation element, and a fourth radiation element. A closed slot is formed in the ground plane. The first radiation element has a feeding point. The first radiation element is coupled to a first shorting point on the ground plane. The second radiation element is coupled to a second shorting point on the ground plane. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to the feeding point. The fourth radiation element is coupled to a third shorting point on the ground plane. The fourth radiation element is adjacent to the third radiation element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are all disposed inside the closed slot.
    Type: Application
    Filed: January 20, 2020
    Publication date: June 3, 2021
    Inventors: Yi-Ling TSENG, Chung-Hung LO, Chin-Lung TSAI, Kuan-Hsien LEE, Ying-Cong DENG, Chung-Ting HUNG