Abstract: A biomass treatment method includes steps as follows. A biomass and sodium percarbonate are provided, wherein the biomass includes hemicellulose, cellulose and/or lignin. The biomass and the sodium percarbonate are mixed.

Abstract: A photographing lens assembly includes, in order from an object side to an image side: a first, a second, a third, a fourth, a fifth and a sixth lens elements. The first lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, wherein the object-side surface has at least one convex critical point in an off-axis region thereof. The third lens element has an image-side surface being convex in a paraxial region thereof. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex critical point in an off-axis region thereof.

Abstract: The present disclosure provides an extreme ultraviolet (EUV) lithography system including a radiation source and an EUV control system integrated with the radiation source. The EUV control system includes a 3-dimensional diagnostic module (3DDM) designed to collect a laser beam profile of a laser beam from the radiation source in a 3-dimensional (3D) mode, an analysis module designed to analyze the laser beam profile, a database designed to store the laser beam profile, and an EUV control module designed to adjust the radiation source. The analysis module is coupled with the database and the EUV control module. The database is coupled with the 3DDM and the analysis module. The EUV control module is coupled with the analysis module and the radiation source.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: A catalyst is illustrated, which has 70-90 parts by weight of mica, 1-10 parts by weight of zeolite, 5-15 parts by weight of titanium dioxide, 1-10 parts by weight of aluminum oxide, 1-5 parts by weight of sodium oxide and 1-5 parts by weight of potassium oxide. The present disclosure also illustrates a pyrolysis device using the catalyst, and further illustrates a pyrolysis method using the catalyst and/or the pyrolysis device for thermally cracking an organic polymer.

Abstract: A catalyst is illustrated, which has 70-90 parts by weight of mica, 1-10 parts by weight of zeolite, 5-15 parts by weight of titanium dioxide, 1-10 parts by weight of aluminum oxide, 1-5 parts by weight of sodium oxide and 1-5 parts by weight of potassium oxide. The present disclosure also illustrates a pyrolysis device using the catalyst, and further illustrates a pyrolysis method using the catalyst and/or the pyrolysis device for thermally cracking an organic polymer.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: Among other things, one or semiconductor arrangements, and techniques for forming such semiconductor arrangements are provided. An etch sequence is performed to form a first etched region over a planar region of a semiconductor arrangement. The first etched region exposes a planar structure, such as an alignment mark used for alignment during semiconductor fabrication. The etch sequence forms a second etched region over a semiconductor fin region of the semiconductor arrangement. In an embodiment, the etch sequence forms a first trench, a first fin nub and a first pillar in the semiconductor fin region, where the first trench is formed in a semiconductor substrate of the semiconductor fin region. A multi-depth STI structure is formed over at least one of the first trench, the first fin nub, or the first pillar.

Abstract: The present disclosure provides a method and a system for scanning wafer. The system captures a defect image of a wafer, and generates a reference image corresponding to the first defect image based on a reference image generation model. The system generates a defect marked image based on the defect image and the reference image.

Abstract: The present invention discloses an automatic stock and requisition administration system and method for medical and nursing application. The system comprises a cloud platform, at least one intelligent handheld device, and at least one automatic material supply machine. The automatic material supply machine links to the cloud platform through a network. The cloud platform generates requisition forms automatically according to nursing requirements or physician orders and provides the requisition forms for the automatic material supply machine and the intelligent handheld devices according to nursing schedules in user information. The users confirmed by a user recognition process can fast pick required materials from the automatic material supply machine in correct types and quantities. The information of the picked materials is transmitted to the cloud platform, and the cloud platform undertakes statistics and administration of materials.

Abstract: A business transaction method enables customers to purchase products from vendors, and is implemented using a business transaction system that includes a membership module, an allocation module, and a rebate module. The business transaction method includes: a) configuring the membership module to enable the vendors to become alliance members and the customers to become club members, and to set a recruiter of each club member to be a first-degree upper-tier member of said each club member; b) when one of the club members makes a purchase of a transaction amount from one of the alliance members, configuring the allocation module to allocate a predetermined percentage of the transaction amount as a rebate; and c) configuring the rebate module to distribute a portion of the rebate to the club member who made the purchase and another portion of the rebate to the first-degree upper-tier member thereof.

Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.

Abstract: An exemplary liquid crystal panel (100) includes a first substrate (110), a second substrate (120) opposite to the first substrate, a liquid crystal layer (130) sandwiched between the first and second substrates, a plurality of drive integrated circuits (ICs) (114), and a plurality of anisotropic conductive film (ACF) units (115). The first substrate includes a source bonding region (117) and a gate bonding region (118) at the periphery thereof. Each of the source bonding region and the gate bonding region includes a plurality of connecting regions and a plurality of spacing regions each between two connecting regions. The ACF units are disposed on the connecting regions of the source bonding region and the gate bonding region, and are configured for bonding the drive ICs onto the first substrate.