Patents by Inventor Kuan-Hsiung Wei

Kuan-Hsiung Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11736316
    Abstract: An Ethernet network is composed of one or more network infrastructure devices, such as a hubs, repeaters, switches or routers, which provides data interconnection and may provide operational power, or some part thereof, to remote network data terminal equipment such as a wireless access point, IP telephone, IP camera or network end station. Most Ethernet networks operate over a combination of the pairs in an unshielded twisted pair (UTP) or shielded twisted pair (STP) cable, or in some cases may operate over fiber optic cables. The individual links of Ethernet network, between the network infrastructure device and the Data Terminal Equipment (DTE) may be able to operate at one or more data rates such as 10 Mb/s, 100 Mb/s, 1 Gb/s, 2.5 Gb/s, 5 Gb/s and 10 Gb/s, or any combination thereof. The invention discloses an Ethernet Physical Layer (PHY) circuit, in combination with an Integrated Connector Module (ICM), which may reside inside the network equipment at either end of the Ethernet link.
    Type: Grant
    Filed: June 5, 2022
    Date of Patent: August 22, 2023
    Assignee: KinnexA, Inc.
    Inventors: Ian Crayford, Kuan-Hsiung Wei, Shin-Hao Chien
  • Publication number: 20230253148
    Abstract: A signal coupling device comprises a low-frequency circuit including a magnetic ring having an opening and a high-frequency circuit including a rod-shaped magnet. A first-level circuit is formed around the magnetic ring and extends between a first-level circuit input and a first-level circuit output. A second-level circuit is formed around the magnetic ring and extends between a second-level circuit input and a second-level circuit output. The high-frequency circuit includes a third-level circuit formed around the rod-shaped magnet and extends between a third-level circuit input and a third-level circuit output. A fourth-level circuit is formed around the rod-shaped magnet and extends between a fourth-level circuit input and a fourth-level circuit output. The first-level circuit output is coupled to the third-level circuit input and the second-level circuit output is coupled to the fourth-level circuit input.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 10, 2023
    Applicant: Quantage, Inc.
    Inventors: Jeremy S. Chiu, Kuan-Hsiung Wei, Farid Hamidy
  • Publication number: 20220303155
    Abstract: An Ethernet network is composed of one or more network infrastructure devices, such as a hubs, repeaters, switches or routers, which provides data interconnection and may provide operational power, or some part thereof, to remote network data terminal equipment such as a wireless access point, IP telephone, IP camera or network end station. Most Ethernet networks operate over a combination of the pairs in an unshielded twisted pair (UTP) or shielded twisted pair (STP) cable, or in some cases may operate over fiber optic cables. The individual links of Ethernet network, between the network infrastructure device and the Data Terminal Equipment (DTE) may be able to operate at one or more data rates such as 10 Mb/s, 100 Mb/s, 1 Gb/s, 2.5 Gb/s, 5 Gb/s and 10 Gb/s, or any combination thereof. The invention discloses an Ethernet Physical Layer (PHY) circuit, in combination with an Integrated Connector Module (ICM), which may reside inside the network equipment at either end of the Ethernet link.
    Type: Application
    Filed: June 5, 2022
    Publication date: September 22, 2022
    Applicant: KinnexA, Inc.
    Inventors: Ian CRAYFORD, Kuan-Hsiung WEI, Shin-Hao CHIEN
  • Patent number: 11424953
    Abstract: An Ethernet network is composed of one or more network infrastructure devices, such as a hubs, repeaters, switches or routers, which provides data interconnection and may provide operational power, or some part thereof, to remote network data terminal equipment such as a wireless access point, IP telephone, IP camera or network end station. Most Ethernet networks operate over a combination of the pairs in an unshielded twisted pair (UTP) or shielded twisted pair (STP) cable, or in some cases may operate over fiber optic cables. The individual links of Ethernet network, between the network infrastructure device and the Data Terminal Equipment (DTE) may be able to operate at one or more data rates such as 10 Mb/s, 100 Mb/s, 1 Gb/s, 2.5 Gb/s, 5 Gb/s and 10 Gb/s, or any combination thereof. The invention discloses an Ethernet Physical Layer (PHY) circuit, in combination with an Integrated Connector Module (ICM), which may reside inside the network equipment at either end of the Ethernet link.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: August 23, 2022
    Inventors: Ian Crayford, Kuan-Hsiung Wei, Shin-Hao Chien
  • Publication number: 20200204399
    Abstract: An Ethernet network is composed of one or more network infrastructure devices, such as a hubs, repeaters, switches or routers, which provides data interconnection and may provide operational power, or some part thereof, to remote network data terminal equipment such as a wireless access point, IP telephone, IP camera or network end station. Most Ethernet networks operate over a combination of the pairs in an unshielded twisted pair (UTP) or shielded twisted pair (STP) cable, or in some cases may operate over fiber optic cables. The individual links of Ethernet network, between the network infrastructure device and the Data Terminal Equipment (DTE) may be able to operate at one or more data rates such as 10 Mb/s, 100 Mb/s, 1 Gb/s, 2.5 Gb/s, 5 Gb/s and 10 Gb/s, or any combination thereof. The invention discloses an Ethernet Physical Layer (PHY) circuit, in combination with an Integrated Connector Module (ICM), which may reside inside the network equipment at either end of the Ethernet link.
    Type: Application
    Filed: November 26, 2019
    Publication date: June 25, 2020
    Applicant: KinnexA, Inc.
    Inventors: Ian CRAYFORD, Kuan-Hsiung WEI, Shin-Hao CHIEN
  • Publication number: 20150213939
    Abstract: A structure of an Ethernet SMD type signal transformer connector includes a substrate, at least one first SMD signal transformer, and at least one second SMD common-mode inductor. The substrate has a surface on which a plurality of first conductive wires and second conductive wires are formed. The first SMD signal transformer includes a first SMD-first contact section, a first SMD-second contact section, a first SMD-third contact section, and a first SMD-fourth contact section formed in each end thereof. The second SMD common-mode inductor is connected, via the first conductive wires, to the first SMD-first contact section and the first SMD-fourth contact section. The first SMD-second contact section and the first SMD-third contact section are electrically connected by the second conductive wires. With the above-described arrangement, the overall consumption of material is reduced and the manufacturing process simplified so as to achieve the purposes of saving material and simplifying manufacture.
    Type: Application
    Filed: January 27, 2014
    Publication date: July 30, 2015
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20150206649
    Abstract: An improved structure of an SMD (Surface Mount Device) includes a magnetic core and a plurality of conductive wire. The magnetic core has two ends each forming a connection portion and the connection portion has a side forming at least four soldering sections. The conductive wires are wound around the magnetic core and two ends of each of the conductive wires are respectively soldered to the soldering sections. The conductive wires are subjected to a mechanized automatic winding operation. The magnetic core is an SMD core. With such an arrangement, the volume of the signal transformer can be greatly reduced. Further, an advantage of human-labor-free manufacture can be achieved with the mechanized winding operation and also, the quality of the signal transformer is made more stable to increase the throughput. Advantages including stable electric characteristics, fully automatized manufacture, and high throughput, can be achieved.
    Type: Application
    Filed: January 23, 2014
    Publication date: July 23, 2015
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20150093942
    Abstract: A structure of a connector combination includes at least one first RJ45 connector, a second RJ45 connector, and a positioning member. The first RJ45 connector has at least one side forming a first coupling section. The second RJ45 connector has at least one side forming a second coupling section that is jointable to the first coupling section. As such, the first RJ45 connectors and the second RJ45 connectors can be combined with each other through the first coupling sections and the second coupling sections thereof according to a desired number of connectors, so that saving of mold cost can be achieved in respect of quantity. On the other hand, individual replacement of a broken connector is possible in a maintenance operation so as to achieve advantages of efficient maintenance and reducing maintenance-related cost.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 2, 2015
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Patent number: 8887389
    Abstract: The present invention relates to a method for winding wires of electrical connector, which includes adopting a unique process to wind wires around a ring body, wherein first and second wire groups each including four different color wires are respectively wound around upper and lower half portions of the ring body and respectively forming first and second input terminal wires and first and second output terminal wires. The first and second input terminal wires are twisted with corresponding ones to thereby achieve reduction of reluctance and better application to high frequency signals.
    Type: Grant
    Filed: June 3, 2011
    Date of Patent: November 18, 2014
    Inventor: Kuan-Hsiung Wei
  • Publication number: 20140320233
    Abstract: A transmission match structure is arranged in an RJ connector and includes two substrates, a plurality of signal transmission sets and a plurality of signal transformers mounted to the substrates, and two coupling devices arranged between the substrates. The signal transmission sets are formed by respectively connecting in series a plurality of capacitors and inductors. The signal transformers includes a plurality of magnetic coils connected respectively in series with each of the capacitors and each of the inductors to form electrical connection. Each of the coupling devices is electrically connected, via each of the substrates, to each of the signal transmission sets and each of the signal transformers. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability can be achieved.
    Type: Application
    Filed: July 19, 2013
    Publication date: October 30, 2014
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20140322931
    Abstract: A structure of a printed circuit board of an electrical connector generally includes a plurality of circuit boards, which provides a network signal transmission matching function and a plurality of coupling modules, which includes arrayed pins embedded therein. Each of the circuit boards is fixedly mounted to one side of each of the coupling modules and is electrically connected to ends of the arrayed pins and forms a channel. As such, the technical feature of the present invention that uses circuit boards to serve as bridge connection allows the circuit boards to be assembled to the coupling modules in such a way that additional wiring is not needed and connection can be established through soldering applied to the arrayed pins, thereby achieving the advantages that assembling can be carried out in an easy, fast, and time-efficient manner.
    Type: Application
    Filed: July 19, 2013
    Publication date: October 30, 2014
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20140320232
    Abstract: A network signal transmission match device includes at least a substrate, at least a signal transmission component set, and at least a signal transformer connected in series with the signal transmission component set. The signal transmission component set is formed of at least a capacitor and an inductor connected in series and is mounted through SMT to the substrate. The signal transformer is electrically connected with the signal transmission component set. With the above structure, when the device is put into use, due to the correspondence and collaboration between the capacitor and the inductor, there is no impedance matching problem and the IEEE property is made better so as to greatly improve the operation characteristics thereof. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability are achieved.
    Type: Application
    Filed: July 19, 2013
    Publication date: October 30, 2014
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20140321574
    Abstract: A network signal transmission match device includes at least a substrate, at least a signal transmission component set, and at least a signal transformer connected in series with the signal transmission component set. The signal transmission component set is formed of at least a capacitor and an inductor connected in series and is mounted through SMT to the substrate. The signal transformer is electrically connected with the signal transmission component set. The inductor has a resistance of 75 ohms. With the above structure, when the device is put into use, due to the correspondence and collaboration between the capacitor and the inductor, there is no impedance matching problem and the IEEE property is made better so as to greatly improve the operation characteristics thereof. As such, practical improvements of having excellent IEEE and EMI properties, being free of impedance matching problem, and providing efficient and stable manufacturability are achieved.
    Type: Application
    Filed: July 19, 2013
    Publication date: October 30, 2014
    Applicant: KINNEXA, INC.
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20130171874
    Abstract: The connector contains a port member, a base board electrically connected to the port member, and a filtering module electrically connected to the base board. The filtering module contains a number of vertically stacked circuit boards. There are a number of layout areas on each circuit board. Between a pair of adjacent circuit boards, an amorphous ring core is configured correspondingly to each layout area. Through the conduction between the amorphous ring core and the circuits in the layout areas, the amorphous ring cores are capable of filtering. The connector does not require manual winding, and have advantages such as stable quality and reduced production time.
    Type: Application
    Filed: January 3, 2012
    Publication date: July 4, 2013
    Inventor: KUAN-HSIUNG WEI
  • Publication number: 20120304462
    Abstract: The present invention relates to a method for winding wires of electrical connector, which includes adopting a unique process to wind wires around a ring body, wherein first and second wire groups each including four different color wires are respectively wound around upper and lower half portions of the ring body and respectively forming first and second input terminal wires and first and second output terminal wires. The first and second input terminal wires are twisted with corresponding ones to thereby achieve reduction of reluctance and better application to high frequency signals.
    Type: Application
    Filed: June 3, 2011
    Publication date: December 6, 2012
    Inventor: KUAN-HSIUNG WEI
  • Patent number: 8157583
    Abstract: A tongue grounding structure is provided for a connector. The connector includes a connector body, at least one circuit board, and a metal shell. The circuit board is received in the connector body. The circuit board includes conductive traces formed thereon. The conductive traces are extended to form a contact point. The metal shell encloses the connector body, and includes at least one clamping section extending therefrom. The clamping section includes a first clamp plate and a second clamp plate. With the above described arrangement, to assemble the connector, the clamping section is set to resiliently clamp the contact point of the circuit board received in the connector body in order to realize electrical connection between a grounding wire and the metal shell.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: April 17, 2012
    Inventor: Kuan-Hsiung Wei
  • Patent number: 7575478
    Abstract: A high frequency connector having a CMC is provided. The high frequency connector includes an insulating housing, a plurality of interconnection terminals and a plurality of transmitting terminals. The insulating housing includes an interconnection slot for receiving a part of the interconnection electronic apparatus inserted therein. The insulating housing includes a circuit board receiving slot, which is adapted for fixing the circuit board in the high frequency connector. The interconnection terminals are respectively fixed at the insulating housing. The interconnection terminals extend through the interconnection slot and the circuit board receiving slot of the insulating housing, so as to electrically connect the interconnection slot and a circuitry of the circuit board. The circuitry at least includes a CMC having at least one grounded central tapped wire.
    Type: Grant
    Filed: March 17, 2008
    Date of Patent: August 18, 2009
    Assignee: Speed Tech Corp.
    Inventor: Kuan-Hsiung Wei