Abstract: A display panel having a display region and a lead out wiring region adjacent to each other is provided. The display panel includes a circuit substrate, light-emitting elements disposed at the display region and located on the circuit substrate, an encapsulation layer, and a sealing layer. The circuit substrate has opposite top and bottom surfaces and a first side surface connecting the top and bottom surfaces and extending from the display region to the lead out wiring region. The encapsulation layer is disposed at the display region and located between the circuit substrate and the light-emitting elements, where a first terminal surface of the encapsulation layer is aligned with the first side surface of the circuit substrate. The sealing layer covers the first side surface and the first terminal surface. A tiled display device including the above-mentioned display panel and a manufacturing method of the display panel are also provided.

Abstract: A first conductive pad disposed over a first side of a substrate in a first direction. A second conductive pad is disposed over a second side of the substrate in the first direction. A through-substrate via (TSV) extends into the substrate in the first direction. The TSV is disposed between the first conductive pad and the second conductive pad in the first direction. An air liner disposed between the TSV and the substrate in a second direction different from the first direction.

Abstract: A display apparatus includes a driving backplane, a plurality of light emitting devices, a first encapsulation pattern, and a second encapsulation pattern. The light emitting devices are disposed on the driving backplane and electrically connected to the driving backplane. The first encapsulation pattern includes a first portion and a second portion. The first portion is disposed on the driving backplane. The second portion is disposed on the first portion of the first encapsulation pattern, covers a plurality of sidewalls of the light emitting devices, and has a plurality of first openings overlapping a plurality of top surfaces of the light emitting devices. The second encapsulation pattern is disposed on the first portion of the first encapsulation pattern and has a plurality of second openings. The second openings are overlapped with the top surfaces of the light emitting devices and the second portion of the first encapsulation pattern.

Abstract: A display apparatus includes a display panel. The display panel includes a driving backplane, multiple light-emitting elements, an encapsulation layer, and a fixing glue. The light emitting elements are disposed on the driving backplane and electrically connected to the driving backplane. The encapsulation layer is disposed on the driving backplane and covers the light emitting elements. The encapsulation layer includes a protruding portion extending beyond the driving backplane. The fixing glue is disposed between the protruding portion of the encapsulation layer and a side wall of the driving backplane. In addition, a manufacturing method of the display panel is also proposed.

Abstract: Semiconductor devices and methods of forming the same are provided. A method according to the present disclosure includes providing a workpiece including a frontside and a backside. The workpiece includes a substrate, a first plurality of channel members over a first portion of the substrate, a second plurality of channel members over a second portion of the substrate, an isolation feature sandwiched between the first and second portions of the substrate. The method also includes forming a joint gate structure to wrap around each of the first and second pluralities of channel members, forming a pilot opening in the isolation feature, extending the pilot opening through the join gate structure to form a gate cut opening that separates the joint gate structure into a first gate structure and a second gate structure, and depositing a dielectric material into the gate cut opening to form a gate cut feature.

Abstract: Provided is a manufacturing method of an active device substrate including the following steps. A blind hole is formed in a substrate. A first conductive pattern and an active device are formed on a first surface of the substrate, where the first conductive pattern overlaps the blind hole. After the first conductive pattern and the active device are formed, an etching process is executed on the substrate to form a through hole penetrating the substrate at the position of the blind hole. A conductive material is filled into the through hole to form a conductive hole. The conductive hole is electrically connected to the first conductive pattern. A second conductive pattern is formed on a second surface of the substrate, where the second conductive pattern is electrically connected to the first conductive pattern through the conductive hole.

Abstract: A display apparatus includes a first display module including a substrate, an encapsulation layer, and a sealant. The substrate has a display surface, a bottom surface, and a side surface connected between the opposite display and bottom surfaces. The encapsulation layer is disposed on the display surface. The sealant includes a connection part, a bottom part contacting the bottom surface, and an extension part having an outer surface. The connection part has two opposite ends and opposite first and second surfaces. The bottom part and the extension part are respectively located at the two opposite ends and extended from the first and second surfaces in directions away from each other. The first surface contacts the side surface. The encapsulation layer contacts the connection part and the extension part and is coplanar with the outer surface. A horizontal distance between the outer surface and the second surface is greater than 0.

Abstract: A sanitary device for the urine glucose test includes a urine container formed on an inner wall of a main body, and a measuring module with an inner space mounted at a bottom of the urine container. Within the inner space, a lens attaches to the bottom of the urine container, a rail faces a bottom surface of the lens, and a driving module moves a light unit shooting a detection beam to a measuring surface of the lens along the rail. The measuring surface contacts urine in the urine container, and reflects the detection beam out of the bottom surface into a sensor. The sensor is electrically connected to a processor. The processor determines a urine glucose level and generates a urine glucose level data instantly from an angle of incidence of the detection beam on the measuring surface and from a beam intensity signal from the sensor.

Abstract: A light-emitting diode display includes a substrate, multiple light-emitting diodes, an under fill, and an encapsulant. The light-emitting diodes are disposed on the substrate. The under fill is disposed between the substrate and the light-emitting diodes. The under fill includes multiple portions, and the portions are respectively located between two adjacent ones of the light-emitting diodes. A height of at least one of the portions is different from the heights of the other portions. The encapsulant is disposed on the under fill and the light-emitting diodes.

Abstract: A package structure includes a circuit substrate, a light emitting diode array, a first encapsulant, and a sealant. The circuit substrate includes a top surface and a side surface of the circuit substrate. The light emitting diode array is disposed on the top surface of the circuit substrate. The first encapsulant is disposed above the circuit substrate. The first encapsulant includes a main portion and an extension portion, in which the main portion of the first encapsulant is disposed parallel to the top surface of the circuit substrate, and the extension portion of the first encapsulant extends to the side surface of the circuit substrate. The sealant is disposed below the extension portion of the first encapsulant, and the sealant contacts the first encapsulant and the circuit substrate. The first encapsulant and the sealant together form a coplanar surface.

Abstract: A display panel includes a package including a substrate, LEDs and a encapsulation adhesive. The substrate includes a bottom surface, a first side and a second side. The first side and the second side are opposite sides, and the bottom surface and the first side form a first angle, the bottom surface and the second side form a second angle. The LEDs are on the substrate. The encapsulation adhesive covers the first side, the second side and the light-emitting diodes. The encapsulation adhesive has a third side adjacent to the first side and a fourth side adjacent to the second side, and the bottom surface and the third side form a third angle, the bottom surface of the first substrate and the fourth side form a fourth angle. The third angle is greater than the first angle, and the fourth angle is smaller than the second angle.

Abstract: A display panel includes a substrate, light-emitting diodes, and a cured opaque encapsulant layer. The light-emitting diodes are disposed on a first surface of the substrate. The cured opaque encapsulant layer is disposed on the first surface and a side surface of the substrate, and surrounds the light emitting diodes. A second surface of the cured opaque encapsulant layer facing away from the substrate is a rough surface.

Abstract: Provided is a manufacturing method of an active device substrate including the following steps. A blind hole is formed in a substrate. A first conductive pattern and an active device are formed on a first surface of the substrate, where the first conductive pattern overlaps the blind hole. After the first conductive pattern and the active device are formed, an etching process is executed on the substrate to form a through hole penetrating the substrate at the position of the blind hole. A conductive material is filled into the through hole to form a conductive hole. The conductive hole is electrically connected to the first conductive pattern. A second conductive pattern is formed on a second surface of the substrate, where the second conductive pattern is electrically connected to the first conductive pattern through the conductive hole.

Abstract: A display device includes a pixel circuit and receiving antenna units. The pixel circuit is disposed in the active area, and the pixel circuit includes pixel units. The receiving antenna units are electrically connected to the pixel circuit. The receiving antenna units include a first receiving antenna unit and a second receiving antenna unit. The first receiving antenna unit is configured to provide a first data signal to the pixel units in a first part, and the pixel units in the first part are configured to illuminate at a first brightness. The second receiving antenna unit is configured to provide a second data signal to the pixel units in a second part, and the pixel units in the second part are configured to illuminate at a second brightness.

Abstract: A display device includes a pixel circuit and receiving antenna units. The pixel circuit is disposed in the active area, and the pixel circuit includes pixel units. The receiving antenna units are electrically connected to the pixel circuit. The receiving antenna units include a first receiving antenna unit and a second receiving antenna unit. The first receiving antenna unit is configured to provide a first data signal to the pixel units in a first part, and the pixel units in the first part are configured to illuminate at a first brightness. The second receiving antenna unit is configured to provide a second data signal to the pixel units in a second part, and the pixel units in the second part are configured to illuminate at a second brightness.

Abstract: A display device is provided. The display device includes a data signal transmitter and a display panel. The data signal transmitter is used to transmit data signals. A display area of the display panel is divided into sub-display areas. Each sub-display area includes light emitting diodes, a data line, column switches, and row switches. A portion of the data line is formed as a data induction coil to receive one of the data signals by wireless sensing. The display panel selects one of the light emitting diodes as a selected light emitting diode by the column switches and the row switches. The selected light emitting diode is coupled to the data line to form a closed loop. The closed loop generates an induced current according to the data signal and causes the selected light emitting diode to emit light according to the induced current.

Abstract: A display device is provided. The display device includes a data signal transmitter and a display panel. The data signal transmitter is used to transmit data signals. A display area of the display panel is divided into sub-display areas. Each sub-display area includes light emitting diodes, a data line, column switches, and row switches. A portion of the data line is formed as a data induction coil to receive one of the data signals by wireless sensing. The display panel selects one of the light emitting diodes as a selected light emitting diode by the column switches and the row switches. The selected light emitting diode is coupled to the data line to form a closed loop. The closed loop generates an induced current according to the data signal and causes the selected light emitting diode to emit light according to the induced current.

Abstract: A method of programming a nonvolatile memory cell is provided according to an embodiment of the invention. The nonvolatile memory cell includes a substrate; and a select transistor, a following gate transistor, and an anti-fuse transistor comprising a first gate oxide layer, disposed on the substrate and coupled in series with each other. The programming method includes applying to said nonvolatile memory cell a variable DC voltage source comprising at least one high voltage part for forming a trapping path within the first gate oxide layer and at least one low voltage part for crystallizing the trapping path into a silicon filament.

Abstract: A method of programming a nonvolatile memory cell is provided according to an embodiment of the invention. The nonvolatile memory cell includes a substrate; and a select transistor, a following gate transistor, and an anti-fuse transistor comprising a first gate oxide layer, disposed on the substrate and coupled in series with each other. The programming method includes applying to said nonvolatile memory cell a variable DC voltage source comprising at least one high voltage part for forming a trapping path within the first gate oxide layer and at least one low voltage part for crystallizing the trapping path into a silicon filament.

Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, first peripheral wires, and second peripheral wires. The first substrate has at least one first side surface. The second substrate is disposed opposite to the first substrate, and has at least one second side surface adjacent to the first side surface. Each first peripheral wire includes a first signal line, a first fan-out portion, and a first pad. The first signal lines are disposed between the first substrate and the second substrate, and the first fan-out portions are disposed on the first side surface of the first substrate. Each second peripheral wire includes a second signal line, a second fan-out portion, and a second pad. The second signal lines are disposed between the first substrate and the second substrate, and the second fan-out portions are disposed on the second side surface of the second substrate.