Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: An injection molding apparatus including an injection device, a mold, a gas supply device, and a temperature control device is provided. The mold has a mold cavity, wherein the injection device is adapted to inject a material into the mold cavity. The gas supply device is adapted to supply a gas to the mold cavity such that the pressure in the mold cavity is increased. The temperature control device is adapted to control the temperature in the mold cavity. In addition, an injection molding method is also provided.

Abstract: A system for metal injection and counter pressure has: a particle providing assembly; and a forming unit having a melting module, a counter pressure module and a mold module; wherein, the particle providing assembly provides particles with metal powder and a binding agent to the melting module, the particles are formed into melted flow by the melting module, the melted flow is provided to the mold module, the counter pressure module provides a counter gas with predetermined pressure to the mold module, the melted flow forms into a green part inside of the mold module.

Abstract: An injection molding apparatus including a mold, an injection device and a gas supply device is provided. The injection device is adapted to inject a ceramic powder material into the mold. The gas supply device is adapted to provide a gas into the mold to form a cavity in the ceramic powder material by the gas. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus including a ceramic powder material injection device, a mold, and a gas providing device is provided. The ceramic powder material injection device is adapted to contain a ceramic powder material. The mold has a molding concavity, wherein the ceramic powder material injection device is adapted to inject at least the ceramic powder material into the molding concavity. The gas providing device is adapted to provide a gas into the molding concavity to increase a pressure in the molding concavity to increase a density of the ceramic powder material in the molding concavity. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus including a ceramic powder material injection device, a supercritical fluid providing device, and a mold is provided. The ceramic powder material injection device is adapted to contain a ceramic powder material. The supercritical fluid providing device is adapted to provide a supercritical fluid to the ceramic powder material injection device. The mold has a molding concavity, wherein the ceramic powder material injection device is adapted to mix the ceramic powder material and the supercritical fluid to form a mixed material and inject the mixed material into the molding concavity. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus including a mold, a gas supply device, and an injection device is provided. The mold has a molding cavity. The gas supply device is adapted to supply a gas into the molding cavity to adjust a pressure in the molding cavity from a non-pressurized state to a pressurized state by the gas. The injection device is adapted to inject a material into the molding concavity. The material includes a foaming material, the foaming material is prevented from being gasified in the pressurized state, and the foaming material is gasified in the non-pressurized state. In addition, an injection molding method is also provided.

Abstract: An injection molding apparatus including a mold and an injection device is provided. The mold includes a fixed portion and a movable portion. A molding concavity is formed between the fixed portion and the movable portion, and the movable portion is adapted to move relative to the fixed portion to change a volume of the molding cavity, so that a pressure inside the molding concavity is adjusted between a pressurized state and a non-pressurized state. The injection device is adapted to inject a material into the molding concavity. The material includes a supercritical fluid, the supercritical fluid is prevented from being gasified in the pressurized state, and the supercritical fluid is gasified in the non-pressurized state. In addition, an injection molding method is also provided.

Abstract: A control system and a control method of manufacturing injection molding products are provided. The control system includes an injection molding machine, an information input interface, a computing server and a data conversion device. At first, product information is inputted through the information input interface. The product information is transmitted to the computing server, and then the computing server determines injection molding parameters according to the product information. The injection molding parameters are transmitted to the information input interface. After data conversion through the data conversion device, the injection molding machine is controlled to manufacture the injection molding products according to the converted injection molding parameters.

Abstract: A control system and a control method of manufacturing injection molding products are provided. The control system includes an injection molding machine, an information input interface, a computing server and a data conversion device. At first, product information is inputted through the information input interface. The product information is transmitted to the computing server, and then the computing server determines injection molding parameters according to the product information. The injection molding parameters are transmitted to the information input interface. After data conversion through the data conversion device, the injection molding machine is controlled to manufacture the injection molding products according to the converted injection molding parameters.

Abstract: A molding structure comprising a first mold body, a second mold body suited for combining with the first mold body, a molding core, a first heating element, and a second heating element is provided. A mold cavity is formed between the first mold body and the second mold body when the first mold body and the second mold body are joined together. The molding core is disposed in the mold cavity, wherein the molding core comprises a body, an inner surface, and an outer surface. The first heating member is disposed through the body to heat the molding core. The second heating element is movably disposed on the outer surface of the molding core to preheat the molding core.

Abstract: A system for metal injection and counter pressure has: a particle providing assembly; and a forming unit having a melting module, a counter pressure module and a mold module; wherein, the particle providing assembly provides particles with metal powder and a binding agent to the melting module, the particles is formed into melted flow by the melting module, the melted flow is provided to the mold module, the counter pressure module provides a counter gas with predetermined pressure to the mold module, the melted flow forms into a green part inside of the mold module.

Abstract: A control system and a control method of manufacturing injection molding products are provided. The control system includes an injection molding machine, an information input interface, a computing server and a data conversion device. At first, product information is inputted through the information input interface. The product information is transmitted to the computing server, and then the computing server determines injection molding parameters according to the product information. The injection molding parameters are transmitted to the information input interface. After data conversion through the data conversion device, the injection molding machine is controlled to manufacture the injection molding products according to the converted injection molding parameters.

Abstract: A symmetric electrical connection system for balancing impedance between a first node and a third node and impedance between a second node and a fourth node. The system includes a first conducting wire, a third conducting wire, a fifth conducting wire, and a seventh conducting wire all installed in a first layer. The system further includes a second conducting wire, a fourth conducting wire, a sixth conducting wire, and an eighth conducting wire all installed in a second layer. The first conducting wire and the eighth conducting wire are crossed but electrically insulated. The second conducting wire and the third conducting wire are crossed but electrically insulated. The fourth conducting wire and the fifth conducting wire are crossed but electrically insulated. The sixth conducting wire and the seventh conducting wire are crossed but electrically insulated. In a preferred embodiment, the appearances and the materials of the conducting wires are essentially equivalent.

Abstract: A symmetric electrical connection system for balancing impedance between a first node and a third node and impedance between a second node and a fourth node. The system includes a first conducting wire, a third conducting wire, a fifth conducting wire, and a seventh conducting wire all installed in a first layer. The system further includes a second conducting wire, a fourth conducting wire, a sixth conducting wire, and an eighth conducting wire all installed in a second layer. The first conducting wire and the eighth conducting wire are crossed but electrically insulated. The second conducting wire and the third conducting wire are crossed but electrically insulated. The fourth conducting wire and the fifth conducting wire are crossed but electrically insulated. The sixth conducting wire and the seventh conducting wire are crossed but electrically insulated. In a preferred embodiment, the appearances and the materials of the conducting wires are essentially equivalent.