Patents by Inventor Kuan-Hui HSU

Kuan-Hui HSU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128216
    Abstract: A bonding structure that may be used to form 3D-IC devices is formed using first oblong bonding pads on a first substrate and second oblong bonding pads one a second substrate. The first and second oblong bonding pads are laid crosswise, and the bond is formed. Viewed in a first cross-section, the first bonding pad is wider than the second bonding pad. Viewed in a second cross-section at a right angle to the first, the second bonding pad is wider than the first bonding pad. Making the bonding pads oblong and angling them relative to one another reduces variations in bonding area due to shifts in alignment between the first substrate and the second substrate. The oblong shape in a suitable orientation may also be used to reduce capacitive coupling between one of the bonding pads and nearby wires.
    Type: Application
    Filed: January 4, 2023
    Publication date: April 18, 2024
    Inventors: Hao-Lin Yang, Kuan-Chieh Huang, Wei-Cheng Hsu, Tzu-Jui Wang, Ching-Chun Wang, Hsiao-Hui Tseng, Chen-Jong Wang, Dun-Nian Yaung
  • Publication number: 20240099030
    Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.
    Type: Application
    Filed: April 20, 2023
    Publication date: March 21, 2024
    Inventors: Kuan-Yu Huang, Sung-Hui Huang, Kuo-Chiang Ting, Chia-Hao Hsu, Hsien-Pin Hsu, Chih-Ta Shen, Shang-Yun Hou
  • Patent number: 11828915
    Abstract: In one aspect, the present disclosure relates to a contact lens comprising a disclosed lubricious surface layer. In a further aspect, the lubricious surface layer comprises a polyacrylamide, e.g., a poly(N,N-dimethylacrylamide. In various aspects, the lubricious surface layer is formed at the surface of a contact lens. In a further aspect, the lens can be a hydrogel lens. In a further aspect, the lens can be a silicone hydrogel lens. The present disclosure also pertains to methods of forming the disclosed lubricious surface layers on a surface of a contact lens. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: November 28, 2023
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Anuj Chauhan, Kuan-Hui Hsu, Yifan Yu
  • Publication number: 20220413189
    Abstract: In one aspect, the present disclosure relates to a contact lens comprising a disclosed lubricious surface layer. In a further aspect, the lubricious surface layer comprises a polyacrylamide, e.g., a poly(N,N-dimethylacrylamide. In various aspects, the lubricious surface layer is formed at the surface of a contact lens. In a further aspect, the lens can be a hydrogel lens. In a further aspect, the lens can be a silicone hydrogel lens. The present disclosure also pertains to methods of forming the disclosed lubricious surface layers on a surface of a contact lens. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
    Type: Application
    Filed: September 2, 2022
    Publication date: December 29, 2022
    Inventors: Anuj Chauhan, Kuan-Hui Hsu, Yifan Yu
  • Patent number: 11480714
    Abstract: In one aspect, the present disclosure relates to a contact lens comprising a disclosed lubricious surface layer. In a further aspect, the lubricious surface layer comprises a polyacrylamide, e.g., a poly(N,N-dimethylacrylamide. In various aspects, the lubricious surface layer is formed at the surface of a contact lens. In a further aspect, the lens can be a hydrogel lens. In a further aspect, the lens can be a silicone hydrogel lens. The present disclosure also pertains to methods of forming the disclosed lubricious surface layers on a surface of a contact lens. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: October 25, 2022
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Anuj Chauhan, Kuan-Hui Hsu, Yifan Yu
  • Publication number: 20220000662
    Abstract: A BAK removal device is constructed as a plug of microparticles of a hydrophilic polymeric gel that displays a hydraulic permeability greater than 0.01 Da. The polymer hydrophilic polymeric gel comprises poly(2-hydroxyethyl methacrylate) (pHEMA). The particles are 2 to 100 ?m and the plug has a surface area of 30 mm2 to 2 mm2 and a length of 2 mm to 25 mm and wherein the microparticles of a hydrophilic polymeric gel has a pore radius of 3 to 60 ?m.
    Type: Application
    Filed: June 2, 2021
    Publication date: January 6, 2022
    Inventors: Anuj Chauhan, Kuan-Hui Hsu
  • Patent number: 11051976
    Abstract: A BAK removal device is constructed as a plug of microparticles of a hydrophilic polymeric gel that displays a hydraulic permeability greater than 0.01 Da. The polymer hydrophilic polymeric gel comprises poly(2-hydroxyethyl methacrylate) (pHEMA). The particles are 2 to 100 ?m and the plug has a surface area of 30 mm2 to 2 mm2 and a length of 2 mm to 25 mm and wherein the microparticles of a hydrophilic polymeric gel has a pore radius of 3 to 60 ?m.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: July 6, 2021
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Anuj Chauhan, Kuan-Hui Hsu
  • Publication number: 20200284951
    Abstract: In one aspect, the present disclosure relates to a contact lens comprising a disclosed lubricious surface layer. In a further aspect, the lubricious surface layer comprises a polyacrylamide, e.g., a poly(N,N-dimethylacrylamide. In various aspects, the lubricious surface layer is formed at the surface of a contact lens. In a further aspect, the lens can be a hydrogel lens. In a further aspect, the lens can be a silicone hydrogel lens. The present disclosure also pertains to methods of forming the disclosed lubricious surface layers on a surface of a contact lens. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.
    Type: Application
    Filed: October 4, 2018
    Publication date: September 10, 2020
    Inventors: Anuj Chauhan, Kuan-Hui Hsu, Yifan Yu
  • Publication number: 20190117450
    Abstract: A BAK removal device is constructed as a plug of microparticles of a hydrophilic polymeric gel that displays a hydraulic permeability greater than 0.01 Da. The polymer hydrophilic polymeric gel comprises poly(2-hydroxyethyl methacrylate) (pHEMA). The particles are 2 to 100 ?m and the plug has a surface area of 30 mm2 to 2 mm2 and a length of 2 mm to 25 mm and wherein the microparticles of a hydrophilic polymeric gel has a pore radius of 3 to 60 ?m.
    Type: Application
    Filed: October 22, 2018
    Publication date: April 25, 2019
    Inventors: Anuj Chauhan, Kuan-Hui Hsu
  • Patent number: 10123904
    Abstract: A BAK removal device is constructed as a plug of microparticles of a hydrophilic polymeric gel that displays a hydraulic permeability greater than 0.01 Da. The polymer hydrophilic polymeric gel comprises poly(2-hydroxyethyl methacrylate) (pHEMA). The particles are 2 to 100 ?m and the plug has a surface area of 30 mm2 to 2 mm2 and a length of 2 mm to 25 mm and wherein the microparticles of a hydrophilic polymeric gel has a pore radius of 3 to 60 ?m.
    Type: Grant
    Filed: August 12, 2015
    Date of Patent: November 13, 2018
    Assignee: University of Florida Research Foundation, Inc.
    Inventors: Anuj Chauhan, Kuan-Hui Hsu
  • Publication number: 20170224531
    Abstract: A BAK removal device is constructed as a plug of microparticles of a hydrophilic polymeric gel that displays a hydraulic permeability greater than 0.01 Da. The polymer hydrophilic polymeric gel comprises poly(2-hydroxyethyl methacrylate) (pHEMA). The particles are 2 to 100 ?m and the plug has a surface area of 30 mm2 to 2 mm2 and a length of 2 mm to 25 mm and wherein the microparticles of a hydrophilic polymeric gel has a pore radius of 3 to 60 ?m.
    Type: Application
    Filed: August 12, 2015
    Publication date: August 10, 2017
    Inventors: Anuj CHAUHAN, Kuan-Hui HSU