Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A bicycle stop light including a lamp assembly mounted on the rear fender of the bicycle and consisting of a flash lamp set and a battery, and a control switch mounted around the brake cable of the bicycle's rear brake, the control switch consisting of two opposite caps and a bellows tube connected between the caps and a metal spring received inside the bellows tube and fixed to one cap, wherein when the brake cable is pulled to stop the bicycle, the metal spring is forced to contact two metal contacts, which are made on one cap and connected to the two opposite terminals of the battery, causing the flash lamp set turned on to give a flashing light.