Patents by Inventor KUAN-KAI HUANG

KUAN-KAI HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220310871
    Abstract: A method of manufacturing a semiconductor structure includes: forming a light-absorption layer in a substrate; forming a first doped region of a first conductivity type and a second doped region of a second conductivity type in the light-absorption layer adjacent to the first doped region; depositing a first patterned mask layer over the light-absorption layer, wherein the first patterned mask layer includes an opening exposing the second doped region and covers the first doped region; forming a first silicide layer in the opening on the second doped region; depositing a barrier layer over the first doped region; and annealing the barrier layer to form a second silicide layer on the first doped region.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 29, 2022
    Inventors: YI-SHIN CHU, HSIANG-LIN CHEN, YIN-KAI LIAO, SIN-YI JIANG, KUAN-CHIEH HUANG
  • Publication number: 20220302336
    Abstract: Germanium-based sensors are disclosed herein. An exemplary germanium-based sensor includes a germanium photodiode and a junction field effect transistor (JFET) formed from a germanium layer disposed in a silicon substrate, in some embodiments, or on a silicon substrate, in some embodiments. A doped silicon layer, which can be formed by in-situ doping epitaxially grown silicon, is disposed between the germanium layer and the silicon substrate. In embodiments where the germanium layer on the silicon substrate, the doped silicon layer is disposed between the germanium layer and an oxide layer. The JFET has a doped polysilicon gate, and in some embodiments, a gate diffusion region is disposed in the germanium layer under the doped polysilicon gate. In some embodiments, a pinned photodiode passivation layer is disposed in the germanium layer. In some embodiments, a pair doped region pair in the germanium layer is configured as an e-lens of the germanium-based sensor.
    Type: Application
    Filed: July 23, 2021
    Publication date: September 22, 2022
    Inventors: Jhy-Jyi Sze, Sin-Yi Jiang, Yi-Shin Chu, Yin-Kai Liao, Hsiang-Lin Chen, Kuan-Chieh Huang
  • Publication number: 20220271080
    Abstract: The present disclosure provides a semiconductor structure, including a substrate including a first material, wherein the first material generates electrical signals from radiation within a first range of wavelengths, an image sensor element including a second material, wherein the second material generates electrical signals from radiation within a second range of wavelengths, the second range is different from first range, a transparent layer proximal to a light receiving surface of the image sensor element, wherein the transparent layer is transparent to radiation within the second range of wavelength, and an interconnect structure connected to a signal transmitting surface of the image sensor element.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Inventors: JHY-JYI SZE, SIN-YI JIANG, YI-SHIN CHU, YIN-KAI LIAO, HSIANG-LIN CHEN, KUAN-CHIEH HUANG, JUNG-I LIN
  • Publication number: 20210111310
    Abstract: A light emitting chip and associated package structure are provided. The light emitting chip includes a substrate, a first type layer, an active layer, a second type layer, a first type electrode and a second type electrode. A second portion of the first type layer is located over the substrate. A first portion of the first type layer is located over the second portion of the first type layer. The active layer is located over the first portion of the first type layer. The second type layer is located over the active layer. The first type electrode is contacted with a top surface and a sidewall of the second portion of the first type layer and contacted with a portion of a sidewall of the substrate. The second type electrode is contacted with the second type layer.
    Type: Application
    Filed: November 30, 2020
    Publication date: April 15, 2021
    Inventors: Chang-Da TSAI, Wei-Che WU, Kuan-Kai HUANG
  • Patent number: 10675921
    Abstract: A tire pressure detector disposed at a wheel, wherein the wheel includes a rim and a tire mounted around the rim, with a pressure space formed between the tire and the rim. The rim includes an air tap connected with the pressure space. The tire pressure detector includes a main body movably disposed in the pressure space and provided with a housing space, and a detection module disposed in the housing space. The detection module further includes a sensing unit for sensing the air pressure in the pressure space and producing a pressure signal. A central processing unit of the detection module receives the pressure signal and wirelessly transmits the pressure signal through the wireless transmission unit. Therefore, vibration and waving issue due to imbalance weight is avoided, thus balancing the wheel.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: June 9, 2020
    Assignee: CUB ELECPARTS INC.
    Inventors: San-Chuan Yu, Yuan-Tung Hung, Kuo-Ting Lee, Kuan-Kai Huang
  • Publication number: 20190355888
    Abstract: A light emitting chip and associated package structure are provided. The light emitting chip includes a substrate, a first type layer, an active layer, a second type layer, a first type electrode and a second type electrode. A second portion of the first type layer is located over the substrate. A first portion of the first type layer is located over the second portion of the first type layer. The active layer is located over the first portion of the first type layer. The second type layer is located over the active layer. The first type electrode is contacted with a sidewall of the second portion of the first type layer and contacted with a sidewall of the substrate. The second type electrode is contacted with the second type layer.
    Type: Application
    Filed: December 17, 2018
    Publication date: November 21, 2019
    Inventors: Chang-Da TSAI, Wei-Che WU, Kuan-Kai HUANG
  • Publication number: 20190111740
    Abstract: A tire pressure detector disposed at a wheel, wherein the wheel includes a rim and a tire mounted around the rim, with a pressure space formed between the tire and the rim. The rim includes an air tap connected with the pressure space. The tire pressure detector includes a main body movably disposed in the pressure space and provided with a housing space, and a detection module disposed in the housing space. The detection module further includes a sensing unit for sensing the air pressure in the pressure space and producing a pressure signal. A central processing unit of the detection module receives the pressure signal and wirelessly transmits the pressure signal through the wireless transmission unit. Therefore, vibration and waving issue due to imbalance weight is avoided, thus balancing the wheel.
    Type: Application
    Filed: February 23, 2018
    Publication date: April 18, 2019
    Inventors: SAN-CHUAN YU, YUAN-TUNG HUNG, KUO-TING LEE, KUAN-KAI HUANG