Patents by Inventor Kuan L. Chen

Kuan L. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally-enhanced lead frame with reduced thermal gap
    Patent number: 5914528
    Abstract: A lead frame structure includes a lead frame skeleton and at least one die bar connected between the lead frame skeleton and a non-quadrangular die attach paddle. Each of a plurality of leads has an outer edge connected to the lead frame skeleton and an inner edge disposed adjacent to but separated from the periphery of the die attach paddle. Preferably, the inner edge of each lead is separated from the periphery of the die attach paddle by about 5-10 mils.
    Type: Grant
    Filed: April 28, 1997
    Date of Patent: June 22, 1999
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Kuan L. Chen