Abstract: A method for re-triggering wakeup to handle time skew between a scalar operation and a vector operation is provided. The method includes: initiating, before a Load-Store (LST) pipeline completes an execution of a load operation corresponding to a vector micro-operation (uop) dispatched to a baler issue queue, a respective load operation in a Load (LD) pipeline corresponding to the vector uop; triggering a speculative wakeup from the LD pipeline during an execution of the respective load operation; triggering a second wakeup corresponding to the speculative wakeup from the LD pipeline; and waking up, based on the second wakeup, the vector micro-operation in the baler issue queue of the baler unit.

Abstract: A method of forming a semiconductor device is provided. The method includes mounting a semiconductor die on a die pad of a leadframe. The die pad includes a central opening configured to expose a central portion of the semiconductor die. A first end of a bond wire is attached to a bond pad of the semiconductor die and a second end of the bond wire is attached to a lead of the leadframe. An encapsulant encapsulates the semiconductor die and the leadframe. A portion of the lead and a portion of the die pad are exposed and protruded through the encapsulant.

Abstract: An apparatus and a method for pipeline control are provided. The apparatus includes a preload predictor, an arithmetic logic unit (ALU) and a data buffer. The preload predictor is configured to determine whether a load instruction conforms to at least one specific condition, to generate a preload determination result. The ALU is configured to perform arithmetic logic operations, and the data buffer is configured to provide data for being used by the ALU. When the preload determination result indicates that the load instruction conforms to the at least one specific condition, the data buffer fetches preload data from a cache memory according to information carried by the load instruction and stores the preload data in the data buffer, where the preload data is data requested by a subsequent load instruction.

Abstract: A method for re-triggering wakeup to handle time skew between a scalar operation and a vector operation is provided. The method includes: initiating, before a Load-Store (LST) pipeline completes an execution of a load operation corresponding to a vector micro-operation (uop) dispatched to a baler issue queue, a respective load operation in a Load (LD) pipeline corresponding to the vector uop; triggering a speculative wakeup from the LD pipeline during an execution of the respective load operation; triggering a second wakeup corresponding to the speculative wakeup from the LD pipeline; and waking up, based on the second wakeup, the vector micro-operation in the baler issue queue of the baler unit.

Abstract: An auxiliary installation tool for a vehicle radar includes an angle ruler. The angle ruler includes a first reference section, a second reference section, and a radar installation section. The first reference section and the second reference section are connected and intersect at a right angle, wherein during measurement, the first reference section is configured for aligning with a vehicle body horizontal line, the second reference section is configured for aligning with or parallel to a vehicle rear horizontal line, the vehicle body horizontal line and the vehicle rear horizontal line respectively extend along the body and the rear of a vehicle and intersect at a corner of the vehicle. The radar installation section is correspondingly located at the corner of the vehicle, and the radar installation section and the second reference section are connected and intersect at a radar installation angle.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.

Abstract: A method of manufacturing a semiconductor device is provided. The method includes placing a package substrate on a carrier substrate, forming a frame on the package substrate, and affixing an active side of a semiconductor die on the package substrate. The semiconductor die together with the frame and the package substrate form a cavity between the semiconductor die and the package substrate. At least a portion of the semiconductor die and the package substrate are encapsulated with an encapsulant. The frame is configured to prevent the encapsulant from entering the cavity.

Abstract: A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.

Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

Abstract: An apparatus and a method for pipeline control are provided. The apparatus includes a preload predictor, an arithmetic logic unit (ALU) and a data buffer. The preload predictor is configured to determine whether a load instruction conforms to at least one specific condition, to generate a preload determination result. The ALU is configured to perform arithmetic logic operations, and the data buffer is configured to provide data for being used by the ALU. When the preload determination result indicates that the load instruction conforms to the at least one specific condition, the data buffer fetches preload data from a cache memory according to information carried by the load instruction and stores the preload data in the data buffer, where the preload data is data requested by a subsequent load instruction.

Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.

Abstract: A method of semiconductor die singulation is provided. The method includes forming a first trench along a singulation lane of a semiconductor wafer. A second trench is formed extending from a bottom of the first trench. A portion of the semiconductor wafer remains between a bottom of the second trench and a backside of the semiconductor wafer. A cut is formed by way of a laser to singulate die of the semiconductor wafer. The cut extends through the portion of the semiconductor wafer remaining between the bottom of the second trench and the backside of the semiconductor wafer.

Abstract: A liquid-cooling heat dissipation structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. A radiating fin unit and a stop section are disposed in the heat exchange chamber. The stop section serves to first divide a cooling liquid entering the heat exchange chamber, whereby the cooling liquid first flows through the periphery of the radiating fin unit and then flow into the middle of the radiating fin unit so that the cooling liquid is prevented from straightly passing through the radiating fin unit. Multiple cooperative flow-stopping protrusions are disposed in the periphery of the radiating fin unit to help the cooling liquid to uniformly flow through the radiating fin unit. By means of the structural design of the liquid-cooling heat dissipation structure, the heat exchange efficiency is greatly enhanced.

Abstract: A water block reinforcement structure includes a substrate and a cover body mated with the substrate to define a heat exchange chamber therebetween. At least one radiating fin assembly and at least one reinforcement section are disposed in the heat exchange chamber. The reinforcement section has an upper end connected with the inner face of the cover body by a connection means.

Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.

Abstract: A knockdown water-cooling module latch device structure is assembled and connected with a water-cooling module. The knockdown water-cooling module latch device structure includes a latch device assembly having multiple latch members. The multiple latch members are correspondingly assembled and connected with each other around the water-cooling module to form the knockdown water-cooling module latch device structure, whereby the water-cooling module is framed in the latch device assembly. The knockdown water-cooling module latch device structure can be conveniently assembled and has high assembling freeness and better structural strength.

Abstract: A knockdown water-cooling unit latch device structure includes a latch device assembly having multiple latch members. The latch members are correspondingly assembled with each other around a water-cooling unit. The latch members are connected with each other via at least one connection member. Alternatively, the latch members are directly assembled with each other by means of engagement or lap joint. The latch members of the latch device assembly are assembled with the water-cooling unit so that when the latch device assembly is assembled with the water-cooling unit, the latch members will not interfere with the water-cooling unit.

Abstract: A flexible display apparatus includes a flexible display unit, a flexible film and a molding compound. The flexible display unit has a first region and a second region surrounding the first region, and the flexible film is disposed on the flexible display unit and at least located within the first region. The flexible film has a circumferential surface and at least one accommodating groove, the accommodating groove is sunken from the circumferential surface, and the flexible film exposes the second region of the flexible display unit. The molding compound is disposed on the flexible display unit, covers the circumferential surface and the second region exposed by the flexible film and fills the accommodating groove. A thickness of the molding compound filling the accommodating groove is the same as the thickness of the flexible film.