Patents by Inventor Kuan LIU

Kuan LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12275364
    Abstract: The present invention relates to a steering wheel component (2) and a steering wheel assembly comprising the steering wheel component (2). The steering wheel component (2) comprises an airbag door cover (21), wherein the airbag door cover (21) has an integral panel (210), wherein the panel (210) has a first area (31) for closing an airbag housing (22) and a second area (32), which is arranged beside the first area (31) and is configured as an operating surface for a multifunction switch (3).
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: April 15, 2025
    Assignee: Yanfeng International Automotive Technology Co., Ltd.
    Inventors: Cheng Liu, Zhiyuan Chen, Lei Yang, Kuan Liu
  • Publication number: 20250101163
    Abstract: The invention provides a carbon dioxide-based polyurethane elastomer with damping and anti-fatigue aging properties and its preparation method. It is obtained from Component A and Component B; Component A includes: PTMG-1000 45˜60 parts, carbon dioxide-based polyol 25˜30 parts, poly-DOPO-ITA-pentanediol ester 10˜20 parts, BDO 3˜5 parts, water 0.3˜0.5 parts, N-methylimidazole 0.5˜0.8 parts, bis(2-dimethylaminoethyl) ether 0.1˜0.2 parts, needle-shaped nano-titanium dioxide 0.5 parts, hindered phenol 0.2˜0.5 parts, dibutyltin dilaurate 0.1˜0.3 parts, strontium chloride 0.005˜0.01 parts, rhodium chloride 0.02˜0.03 parts, foaming agent 0.2˜0.5 parts; Component B includes: carbon dioxide-based polyol 50˜55 parts, MDI-50 45˜50 parts, organic zinc 0.01˜0.02 parts, organic bismuth 0.01˜0.02 parts.
    Type: Application
    Filed: November 8, 2023
    Publication date: March 27, 2025
    Inventors: Quanxiao Dong, Peng Qiu, Xueliang Cui, Yubao Guo, Xingxu Bao, Songran Liu, Ruixue Niu, Simeng Yan, Yitong Shen, Huihui Xu, Songqi Zhang, Yuanqing Zhang, Junheng Xiao, Xianhong Wang, Hongming Zhang, Haitao Liu, Weibin Liu, Fengxiang Gao, Yanlei Dong, Zirui Li, Huan Zhang, Yanshan Li, Chengliang Li, Minxiao Zhang, Tiantian Song, Zhi Liu, Yongwang Wei, Xiaoru Liu, Linheng Bao, Lifen Li, Ruolin Jiang, Xiaozhao Yu, Cheng Qiu, Li Zhang, Kuan Liu, Yuqing Wen, Hang Zhao, Liting Dong, Qiang Zhao, Ning Zhang, Hongsong Guan, Ling Gao, Huitong Pei
  • Publication number: 20250063667
    Abstract: An electronic assembly includes a substrate, a chip configured on the substrate, a cover component configured on the chip, a capacitance element configured on the substrate, and a sealing structure surrounding the chip and sealing a gap between the cover component and the substrate. The sealing structure includes an insulating gel encapsulating the capacitance element. In addition, a manufacturing method of the electronic assembly is also provided.
    Type: Application
    Filed: June 27, 2024
    Publication date: February 20, 2025
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Chih-Kuan Liu, Xu Wang
  • Publication number: 20240217470
    Abstract: The present invention relates to a steering wheel component (2) and a steering wheel assembly comprising the steering wheel component (2). The steering wheel component (2) comprises an airbag door cover (21), wherein the airbag door cover (21) has an integral panel (210), wherein the panel (210) has a first area (31) for closing an airbag housing (22) and a second area (32), which is arranged beside the first area (31) and is configured as an operating surface for a multifunction switch (3).
    Type: Application
    Filed: July 28, 2022
    Publication date: July 4, 2024
    Applicant: Yanfeng International Automotive Technology Co., Ltd.
    Inventors: Cheng LIU, Zhiyuan CHEN, Lei YANG, Kuan LIU
  • Publication number: 20240128093
    Abstract: A manufacturing method of an electronic device includes that a chip package is mounted on a circuit board. And an exposed surface of the chip package is bombarded with plasma to clean the surface. The manufacturing method of the electronic device of the application can effectively clean the chip package without reducing the reliability of the electronic device.
    Type: Application
    Filed: December 2, 2022
    Publication date: April 18, 2024
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Xu Wang, Chih-Kuan Liu
  • Patent number: 11044806
    Abstract: A multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: June 22, 2021
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Patent number: 10691804
    Abstract: A password power switch circuit for an electronic device includes a thermal energy conversion circuit and a programmable control chip. The thermal energy conversion circuit is used for generating a plurality of sensing temperatures. The programmable control chip is coupled to the thermal energy conversion circuit for storing a password and generating a power-on signal to a central processing device of the electronic device according to a plurality of locations corresponding to the plurality of sensing temperatures and a plurality of locations corresponding to the password. The central processing device determines at least one operation associated with the electronic device according to the power-on signal.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: June 23, 2020
    Assignee: Wistron Corporation
    Inventors: Chen-Yi Liang, Chun-Kuan Liu
  • Patent number: 10651679
    Abstract: This invention provides a wireless input device, including a primary battery set, a backup battery, an electricity generating device, an energy-storage/charging device, and a switching device. The primary battery set provides electricity to the wireless input device. The backup battery provides electricity to the wireless input device when the primary battery set does not have sufficient electricity. The electricity generating device generates electricity in response to clicking/pressing operations to the wireless input device. The energy-storage/charging device is coupled to the backup battery and the electricity generating device. The energy-storage/charging device stores the electricity generated by the electricity generating device and charges the backup battery when the stored electricity has reached a predetermined volume. The switching device is coupled to the primary battery set and the backup battery.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: May 12, 2020
    Assignee: WISTRON CORP.
    Inventors: Chen-Yi Liang, Chun-Kuan Liu
  • Publication number: 20200128662
    Abstract: A manufacturing method for a multi-layer circuit board capable of being applied with electrical testing is provided. According to the multi-layer circuit board manufactured by the method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom-layer circuit structure, the delivery loading plate exposes the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Patent number: 10548214
    Abstract: A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: January 28, 2020
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Patent number: 10455694
    Abstract: A manufacturing method for a multi-layer circuit board is provided. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: October 22, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Patent number: 10432775
    Abstract: An emergency call circuit for an electronic device includes a dial button, a wireless communication module, an emergency call button and a logic circuit. The wireless communication module is used for dialing an emergency call according to a dial signal generated by the dial button when the wireless communication device is shut down. The logic circuit is used for transmitting an emergency call detecting signal generated by the emergency call button to the wireless communication module and a power circuit of the electronic device, wherein the power circuit supplies a first power source to the logic circuit and the wireless communication module when the electronic device is shut down.
    Type: Grant
    Filed: March 22, 2018
    Date of Patent: October 1, 2019
    Assignee: Wistron Corporation
    Inventors: Chen-Yi Liang, Chun-Kuan Liu
  • Publication number: 20190269008
    Abstract: A manufacturing method for a multi-layer circuit board is provided. According to the multi-layer circuit board manufactured by the manufacturing method, the multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer, the delivery loading plate and the patterned metal interface layer expose the conductive corrosion-barrier layer, and the top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. Therefore, before the multi-layer circuit board is delivered to the assembly company or before the multi-layer circuit board is packaged with chips, an electrical testing can be applied to the multi-layer circuit board to check if the multi-layer circuit board can be operated normally or not.
    Type: Application
    Filed: May 9, 2019
    Publication date: August 29, 2019
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Publication number: 20190236450
    Abstract: Multimodal data sets of a given entity (e.g., a user) can be processed using a plurality of different machine learning schemes, such as a recurrent neural network and a fully connected neural network. Representations generated by the networks can be combined in an additive layer and further in a multiplicative layer that emphasizes informative modalities and tolerates less informative modalities.
    Type: Application
    Filed: December 21, 2018
    Publication date: August 1, 2019
    Inventors: Yanen Li, Kuan Liu, Ning Xu
  • Patent number: 10334719
    Abstract: A multi-layer circuit board capable of being applied with electrical testing includes a patterned metal-interface layer, a metallic delivery loading plate, an electrical connection layer, a conductive corrosion-barrier layer, a bottom dielectric layer, and a multi-layer circuit structure. The multi-layer circuit structure is disposed on the delivery loading plate through the bottom dielectric layer. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the bottom-layer circuit and the electrical connection layer. The delivery loading plate and the patterned metal-interface layer expose the conductive corrosion-barrier layer. Therefore, before the multi-layer circuit board is packaged, an electrical testing can be applied to the multi-layer circuit board to check if it can be operated normally.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: June 25, 2019
    Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang
  • Publication number: 20190173993
    Abstract: An emergency call circuit for an electronic device includes a dial button, a wireless communication module, an emergency call button and a logic circuit. The wireless communication module is used for dialing an emergency call according to a dial signal generated by the dial button when the wireless communication device is shut down. The logic circuit is used for transmitting an emergency call detecting signal generated by the emergency call button to the wireless communication module and a power circuit of the electronic device, wherein the power circuit supplies a first power source to the logic circuit and the wireless communication module when the electronic device is shut down.
    Type: Application
    Filed: March 22, 2018
    Publication date: June 6, 2019
    Inventors: Chen-Yi Liang, Chun-Kuan Liu
  • Publication number: 20190170542
    Abstract: The present disclosure is related a technology of confirming a position using an optical sensor to detect reflected light coming through a through hole formed at a predetermined position on a rotation device. In the present disclosure, the optical sensor and a light source are formed at the same side of a rotatable element so as to reduce the occupied space and simplify the manufacturing process.
    Type: Application
    Filed: March 29, 2018
    Publication date: June 6, 2019
    Inventors: CHUNG-TING YANG, KAI-HO TSAI, SHIH-KUAN LIU
  • Publication number: 20190087579
    Abstract: A password power switch circuit for an electronic device includes a thermal energy conversion circuit and a programmable control chip. The thermal energy conversion circuit is used for generating a plurality of sensing temperatures. The programmable control chip is coupled to the thermal energy conversion circuit for storing a password and generating a power-on signal to a central processing device of the electronic device according to a plurality of locations corresponding to the plurality of sensing temperatures and a plurality of locations corresponding to the password. The central processing device determines at least one operation associated with the electronic device according to the power-on signal.
    Type: Application
    Filed: January 4, 2018
    Publication date: March 21, 2019
    Inventors: Chen-Yi Liang, Chun-Kuan Liu
  • Publication number: 20190074712
    Abstract: This invention provides a wireless input device, including a primary battery set, a backup battery, an electricity generating device, an energy-storage/charging device, and a switching device. The primary battery set provides electricity to the wireless input device. The backup battery provides electricity to the wireless input device when the primary battery set does not have sufficient electricity. The electricity generating device generates electricity in response to clicking/pressing operations to the wireless input device. The energy-storage/charging device is coupled to the backup battery and the electricity generating device. The energy-storage/charging device stores the electricity generated by the electricity generating device and charges the backup battery when the stored electricity has reached a predetermined volume. The switching device is coupled to the primary battery set and the backup battery.
    Type: Application
    Filed: December 22, 2017
    Publication date: March 7, 2019
    Inventors: Chen-Yi LIANG, Chun-Kuan LIU
  • Publication number: 20190059154
    Abstract: A multi-layer circuit board capable of being applied with electrical testing includes a metallic delivery loading plate, a bottom-layer circuit structure, a conductive corrosion-barrier layer, and a multi-layer circuit structure. The bottom-layer circuit structure is overlapping on the delivery loading plate. The conductive corrosion-barrier layer is disposed on the bottom dielectric layer. The multi-layer circuit structure is overlapping on the bottom-layer circuit structure. The top-layer circuit of the multi-layer circuit structure is electrically connected to the conductive corrosion-barrier layer through the inner-layer circuit of the multi-layer circuit structure and the bottom-layer circuit of the bottom-layer circuit structure. The delivery loading plate and the bottom dielectric layer of the bottom-layer circuit structure expose the conductive corrosion-barrier layer.
    Type: Application
    Filed: November 30, 2017
    Publication date: February 21, 2019
    Inventors: Chin-Kuan Liu, Chao-Lung Wang, Shuo-Hsun Chang, Yu-Te Lu, Chin-Hsi Chang