Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.

Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.

Abstract: A method includes: providing input information in an electronic format; converting the electronic input information into an optical input vector; optically transforming the optical input vector into an optical output vector based on an optical matrix multiplication; converting the optical output vector into an electronic format; and electronically applying a non-linear transformation to the electronically converted optical output vector to provide output information in an electronic format. For example, a set of input values are encoded on respective optical signals. For each of at least two subsets of optical signals, a copying module splits the subset into multiple copies of the optical signals. For each copy of a first subset of optical signals, a corresponding multiplication module multiplies the optical signals of the first subset by matrix element values using optical amplitude modulation. A summation module produces an electrical signal representing a sum of the results of the multiplication modules.

Abstract: A system includes a first unit configured to generate a plurality of modulator control signals, and a processor unit. The processor unit includes: a light source or port configured to provide a plurality of light outputs, and a first set of optical modulators coupled to the light source or port and the first unit. The optical modulators in the first set are configured to generate an optical input vector by modulating the plurality of light outputs provided by the light source or port based on digital input values corresponding to a first set of modulator control signals in the plurality of modulator control signals, the optical input vector comprising a plurality of optical signals. The processor unit also includes a matrix multiplication unit that includes a second set of optical modulators.

Abstract: Systems and methods that include: providing input information in an electronic format; converting at least a part of the electronic input information into an optical input vector; optically transforming the optical input vector into an optical output vector based on an optical matrix multiplication; converting the optical output vector into an electronic format; and electronically applying a non-linear transformation to the electronically converted optical output vector to provide output information in an electronic format. In some examples, a set of multiple input values are encoded on respective optical signals carried by optical waveguides. For each of at least two subsets of one or more optical signals, a corresponding set of one or more copying modules splits the subset of one or more optical signals into two or more copies of the optical signals.

Abstract: An optoelectronic computing system includes a first semiconductor die having a photonic integrated circuit (PIC) and a second semiconductor die having an electronic integrated circuit (EIC). The PIC includes optical waveguides, in which input values are encoded on respective optical signals carried by the optical waveguides. The PIC includes an optical copying distribution network having optical splitters. The PIC includes an array of optoelectronic circuitry sections, each receiving an optical wave from one of the output ports of the optical copying distribution network, and each optoelectronic circuitry section includes: at least one photodetector detecting at least one optical wave from the optoelectronic operation. The EIC includes electrical input ports receiving respective electrical values.

Abstract: Systems and methods that include: providing input information in an electronic format; converting at least a part of the electronic input information into an optical input vector; optically transforming the optical input vector into an optical output vector based on an optical matrix multiplication; converting the optical output vector into an electronic format; and electronically applying a non-linear transformation to the electronically converted optical output vector to provide output information in an electronic format. In some examples, a set of multiple input values are encoded on respective optical signals carried by optical waveguides. For each of at least two subsets of one or more optical signals, a corresponding set of one or more copying modules splits the subset of one or more optical signals into two or more copies of the optical signals.

Abstract: An apparatus having a segmented optical modulator includes an optical waveguide having three or more segments. Each of three or more optical modulators includes a corresponding waveguide segment and is configured to apply an optical modulation that is proportional to the length of the segment. Three or more electrical contacts receive respective bit values of binary values. Each binary value includes at least three bit values including a least significant bit (LSB) bit value, a most significant bit (MSB) bit value, and at least one intermediate bit (IB) bit value between the LSB bit value and the MSB bit value. At least one waveguide segment of a corresponding optical modulator receiving an LSB bit value is positioned between a first waveguide segment of a corresponding optical modulator receiving an MSB bit value and a second waveguide segment of a corresponding optical modulator receiving an IB bit value.

Abstract: Systems and methods that include: providing input information in an electronic format; converting at least a part of the electronic input information into an optical input vector; optically transforming the optical input vector into an optical output vector based on an optical matrix multiplication; converting the optical output vector into an electronic format; and electronically applying a non-linear transformation to the electronically converted optical output vector to provide output information in an electronic format. In some examples, a set of multiple input values are encoded on respective optical signals carried by optical waveguides. For each of at least two subsets of one or more optical signals, a corresponding set of one or more copying modules splits the subset of one or more optical signals into two or more copies of the optical signals.

Abstract: An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections.

Abstract: The present invention relates to a field of photonic integrated circuits, which provides a semiconductor device. In some embodiments, the semiconductor device includes: a PIC chip including a conductive structure in a via; a first electronic integrated circuit chip (i.e., first EIC chip) arranged on a first surface of the PIC chip; a second electronic integrated circuit chip (i.e., second EIC chip) arrange on a second surface of the PIC chip; wherein the first EIC chip is electrically connected to the second EIC chip through the conductive structure in the via of the PIC chip. The semiconductor device of the present invention optimizes wiring of the PIC chip and can suppress a voltage drop caused by quite a long wire, optimizing a package structure.

Abstract: A method for monitoring defects of a product implemented in an electronic device obtains product data in real time and determines whether a product is defective based on the product data; when the product is defective, outputting first warning information based on the number of defects of the product which satisfy a first preset condition; obtaining a rate of defects of the product every first preset time period, and outputting second warning information based on the rate of defects of the product when the rate of defects satisfies at least one of a second, third, and fourth preset conditions; when any warning information is output, analyzing distribution of the defects of the product; and predicting at least one cause of each defect of the product according to historical maintenance data of the product and a self-learning record of the electronic device.

Abstract: A system includes a first unit configured to generate a plurality of modulator control signals, and a processor unit. The processor unit includes: a light source or port configured to provide a plurality of light outputs, and a first set of optical modulators coupled to the light source or port and the first unit. The optical modulators in the first set are configured to generate an optical input vector by modulating the plurality of light outputs provided by the light source or port based on digital input values corresponding to a first set of modulator control signals in the plurality of modulator control signals, the optical input vector comprising a plurality of optical signals. The processor unit also includes a matrix multiplication unit that includes a second set of optical modulators.

Abstract: Computer-readable media, methods, and systems are disclosed for storing and analyzing dynamic data within a semantic data store. The dynamic data comprises one or more types of data having a normalized data schema. A dynamic data manager interfaces with the semantic data store to instruct storage of the data. The data may be received through an event service from either of an external data source or an internal data source.

Abstract: This application relates to the field of electronic device technologies, and in particular, to an electronic device. The electronic device includes a housing, a camera module, and a decorative part. The housing is provided with a mounting hole. The camera module includes a lens and a module body connected to the lens. The decorative part includes a decorative part body and a skirt structure connected to the decorative part body. The decorative part body is disposed on the periphery of the lens and disposed in the mounting hole. The skirt structure is provided with a notch. The notch is opposite to the module body. An orthographic projection of a part of the module body opposite to the notch onto a plane of the skirt structure does not fall into the skirt structure.

Abstract: A system includes a first unit configured to generate a plurality of modulator control signals, and a processor unit. The processor unit includes: a light source or port configured to provide a plurality of light outputs, and a first set of optical modulators coupled to the light source or port and the first unit. The optical modulators in the first set are configured to generate an optical input vector by modulating the plurality of light outputs provided by the light source or port based on digital input values corresponding to a first set of modulator control signals in the plurality of modulator control signals, the optical input vector comprising a plurality of optical signals. The processor unit also includes a matrix multiplication unit that includes a second set of optical modulators.

Abstract: The disclosure relates to the technical field of image processing, in particular to a pulse wave velocity measuring method and an ultrasound device. The method includes: acquiring a target blood vessel ultrasound image of a target body, the target blood vessel ultrasound image including at least two sampling areas; based on the target blood vessel ultrasound image, acquiring a distance between the at least two sampling areas; analyzing images in the at least two sampling areas to acquire a time difference of displacement of preset points in a cardiac cycle between the at least two sampling areas; and based on the above distance and time difference, determining a pulse wave velocity of the target body. According to the disclosure, the pulse wave velocity is acquired through quantitative calculation from the target blood vessel ultrasound image, and therefore the accuracy of determining the pulse wave velocity is improved.