Patents by Inventor Kuan Luen Chen

Kuan Luen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices
    Patent number: 5825084
    Abstract: The present invention discloses a new substrate with two metal layer circuit structure and layout for semiconductor packaging. The speed and performance characteristics of the semiconductor device are optimized while the packaging structure is simplified by utilizing only one dielectric layer and conventional printed circuit board fabrication process. The difficulties encountered due to the complexities and higher cost of production required for the multiple layer and high density configuration are thus avoided. The improved circuit structure is achieved by implementing a segmented ring on one side of a substrate and a split plane on the other side thus forming a single layer substrate structure. The edges of the substrate are coated with metal layer to provide inter-layer connections.
    Type: Grant
    Filed: February 11, 1997
    Date of Patent: October 20, 1998
    Assignee: Express Packaging Systems, Inc.
    Inventors: John H. Lau, Yung Shih Chen, Tai-Yu Chou, Frank H. Wu, Kuan Luen Chen, Wei H. Koh