Patents by Inventor Kuan-Min Wang

Kuan-Min Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240371715
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Application
    Filed: July 15, 2024
    Publication date: November 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Patent number: 12094792
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: September 17, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20230065147
    Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Min Wang, Chang-Jung Hsueh, Jui-Chang Chuang, Wei-Hung Lin, Kuo-Chin Chang
  • Publication number: 20130239318
    Abstract: A shower curtain has an inside sheet made of plastic with an attachment for attaching to a shower curtain rod and an inside sheet printed side having openings on an unprinted area. The opening density is at least ten per square centimeter. An outside sheet is substantially parallel to the inside sheet. A connection such as a thermal lamination is made between an inside layer top edge and an outside layer top edge. The outside sheet further includes an outside sheet printed side having a graphic print that has openings on an outside sheet unprinted area. The opening density is preferably at least ten per square centimeter. The openings are preferably less than 1 mm in diameter. The inside sheet is of a darker shade than the outside sheet, a gap between the inside sheet and the outside sheet.
    Type: Application
    Filed: January 9, 2013
    Publication date: September 19, 2013
    Inventor: Jason Kuan Min Wang