Abstract: The present disclosure provides an integrated circuit (IC) structure that includes an IC packaging structure having an IC chip; and a thermoelectric self-cooling device (TESCD) integrated with the IC packaging structure. The TESCD further includes a thermoelectric cooling (TEC) device having a plurality of TEC units configured in an array and electrically connected to provide cooling effect to the IC packaging structure, and a liquid cooling module having a cooling liquid driving device and a generator coupled with the cooling liquid driving device to collectively generate an electrical power supplied to the TEC device with self-cooling function to the IC packaging structure.

Abstract: A liquid cooling system includes a thermoelectric cooler (TEC) between a radiator plate and a radiator, and a thermoelectric generator (TEG) at a location where the TEG is driven by heat from a chip package. The chip package is cooled by a cold plate of the liquid cooling system and the TEC is controlled by the TEG. The TEG may be between the chip package and the cold plate or elsewhere in or adjacent to the chip package. The TEG may control the TEC through a relay. The TEG automatically activates the TEC when the chip package is under peak load.

Abstract: A package structure includes a high-power package attached to a substrate; a first low-power package attached to the substrate; a first heat dissipation device attached to the first low-power package; a liquid cooling system attached to the high-power package; and a thermoelectric system sandwiched between the high-power package and the liquid cooling system, wherein the thermoelectric system is electrically connected to the first heat dissipation device, wherein the thermoelectric system provides the first heat dissipation device with electrical power during operation of the high-power package.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: A semiconductor package includes a substrate, a semiconductor die, a lid, and an adhesive layer. The semiconductor die is attached to the substrate. The lid is over the semiconductor die and the substrate. The adhesive layer is sandwiched between the lid and the semiconductor die. The adhesive layer includes a metallic thermal interface material (TIM) layer and a polymeric TIM layer adjacent to the metallic TIM layer. The polymeric TIM layer is located on corners of the semiconductor die from a top view.

Abstract: A shower curtain has an inside sheet made of plastic with an attachment for attaching to a shower curtain rod and an inside sheet printed side having openings on an unprinted area. The opening density is at least ten per square centimeter. An outside sheet is substantially parallel to the inside sheet. A connection such as a thermal lamination is made between an inside layer top edge and an outside layer top edge. The outside sheet further includes an outside sheet printed side having a graphic print that has openings on an outside sheet unprinted area. The opening density is preferably at least ten per square centimeter. The openings are preferably less than 1 mm in diameter. The inside sheet is of a darker shade than the outside sheet, a gap between the inside sheet and the outside sheet.