Patents by Inventor Kuan Ming Kan

Kuan Ming Kan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stackable power semiconductor package system
    Patent number: 7598600
    Abstract: The present invention provides a method of making a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.
    Type: Grant
    Filed: January 27, 2006
    Date of Patent: October 6, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • Thermally enhanced power semiconductor package system
    Patent number: 7557432
    Abstract: The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: July 7, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • THERMALLY ENHANCED POWER SEMICONDUCTOR PACKAGE SYSTEM
    Publication number: 20070108564
    Abstract: The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and forming a lower lead frame below the power semiconductor die, wherein the upper lead frame and the lower lead frame are provided in an offset configuration relative to each other to provide two heat dissipation paths.
    Type: Application
    Filed: January 31, 2006
    Publication date: May 17, 2007
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • STACKABLE POWER SEMICONDUCTOR PACKAGE SYSTEM
    Publication number: 20070108560
    Abstract: The present invention provides a stackable power semiconductor package system comprising forming a lower lead frame, having an upward bent source lead and an upward bent gate lead, mounting a power semiconductor device on the lower lead frame utilizing interconnect structures and forming an upper lead frame wherein the upper lead frame is on the power semiconductor device.
    Type: Application
    Filed: January 27, 2006
    Publication date: May 17, 2007
    Applicant: STATS ChipPAC Ltd.
    Inventors: Wai Kwong Tang, You Yang Ong, Kuan Ming Kan, Larry Lewellen
  • Method for manufacturing a semiconductor package on a leadframe
    Patent number: 6436736
    Abstract: A method of forming a semiconductor package (30) on a leadframe (20) trimmed from strip (10). Encapsulant (34) forms plastic tie bars (40) linking the semiconductor package (30) and the strip (10), to mechanically support, but electrically isolate, the semiconductor die (31) for functionality testing.
    Type: Grant
    Filed: November 13, 2000
    Date of Patent: August 20, 2002
    Assignee: Semiconductor Components Industries LLC
    Inventors: Saat Shukri Embong, Hou Boon Tan, Kuan Ming Kan