Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A hotkey management system and a method executes hotkey function of an electronic device having a touch panel. The system can define a number of virtual blocks of the touch panel and divide a plurality of virtual block sets and set the hotkey functions corresponding to the virtual block sets. Different combination of virtual blocks represent different hotkey functions. The user contacts some virtual blocks of the touch panel and the virtual block set is active by analyzing the at least two coordinate values according to the contacts. The hotkey management system can execute the corresponding function according to the analyzed coordinate values.

Abstract: An apparatus for testing an IEEE1394 port of a motherboard test device includes an IEEE1394 connector, a cable transceiver arbiter connected to the IEEE1394 connector, a first converting chip connected to the cable transceiver arbiter, a second converting chip connected to the first converting chip, and a flash chip connected to the second converting chip. The controller receives IEEE1394 signals from the connector, the first converting chip and second converting chip cooperate to convert the IEEE1394 signals to flash signals, the flash signals are stored in the flash chip. The first converting chip and the second converting chip also cooperate to convert the flash signals to the IEEE1394 signals, the connector outputs the IEEE1394 signals through the controller. A method for testing an IEEE1394 port of a motherboard test device is also provided.