Abstract: A semiconductor device includes a first metal region, a plurality of vias, a plurality of second metal regions, a plurality of openings and a third metal region. The first metal region conducts source/drain current. The second metal regions are electrically connected to the first metal region through the vias for conducting the source/drain current, in which each of the second metal regions is disposed in a distance from the adjacent second metal regions. The third metal region is electrically connected to the second metal regions through the openings, in which the resistance of the third metal region is smaller than the resistances of the first metal region and the second metal regions.

Abstract: A semiconductor device includes a first metal region, a plurality of vias, a plurality of second metal regions, a plurality of openings and a third metal region. The first metal region conducts source/drain current. The second metal regions are electrically connected to the first metal region through the vias for conducting the source/drain current, in which each of the second metal regions is disposed in a distance from the adjacent second metal regions. The third metal region is electrically connected to the second metal regions through the openings, in which the resistance of the third metal region is smaller than the resistances of the first metal region and the second metal regions.

Abstract: A semiconductor device has a plurality of drain metal blocks, a plurality of source metal blocks, a plurality of polysilicon strips, a first source metal strip, a first drain metal strip, and a plurality of first conductive wires. Each of the source metal blocks is disposed between two of the drain metal blocks, and at least two of the polysilicon strips are correspondingly disposed across one of the drain metal blocks and one of the source metal blocks. The first source metal strip, in the absence of the polysilicon strips, is electrically connected to some of the source metal blocks. The first drain metal strip, in the absence of the polysilicon strips, is electrically connected to some of the drain metal blocks. The first conductive wires, coupled to the polysilicon strips, form a plurality of grids.