Patents by Inventor Kuan-Te Lin

Kuan-Te Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942372
    Abstract: In some embodiments, the present disclosure relates to a method for manufacturing an integrated chip. The method includes forming a transistor structure over a substrate. The transistor structure comprises a pair of source/drain regions and a gate electrode between the source/drain regions. A lower inter-level dielectric (ILD) layer is formed over the pair of source/drain regions and around the gate electrode. A gate capping layer is formed over the gate electrode. A selective etch and deposition process is performed to form a dielectric protection layer on the gate capping layer while forming a contact opening within the lower ILD layer. A lower source/drain contact is formed within the contact opening.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Da Huang, Hao-Heng Liu, Li-Te Lin
  • Patent number: 10672570
    Abstract: A keyswitch structure includes a base plate, a keycap, a first support, and a second support. The keycap is located above the base plate. The first support is connected to and between the keycap and the base plate and has an upper connection portion, a lower connection portion, and a protruding limitation portion. The upper connection portion is located between the lower connection portion and the protruding limitation portion. The first support is rotatably connected to the keycap and the base plate through the upper connection portion and the lower connection portion respectively. The protruding limitation portion is located close to and under the cap body. The second support is connected to and between the keycap and the base plate. The keycap moves up and down relative to the base plate through the first support and the second support.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: June 2, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Chih-Hao Chen, Po-Wei Tsai, Chun-Yuan Wang, Kuan-Te Lin, Shao-Wei Yang, Ling-Hsi Chao
  • Publication number: 20190221384
    Abstract: A keyswitch structure includes a base plate, a keycap, a first support, and a second support. The keycap is located above the base plate. The first support is connected to and between the keycap and the base plate and has an upper connection portion, a lower connection portion, and a protruding limitation portion. The upper connection portion is located between the lower connection portion and the protruding limitation portion. The first support is rotatably connected to the keycap and the base plate through the upper connection portion and the lower connection portion respectively. The protruding limitation portion is located close to and under the cap body. The second support is connected to and between the keycap and the base plate. The keycap moves up and down relative to the base plate through the first support and the second support.
    Type: Application
    Filed: January 10, 2019
    Publication date: July 18, 2019
    Inventors: Chih-Hao Chen, Po-Wei Tsai, Chun-Yuan Wang, Kuan-Te Lin, Shao-Wei Yang, Ling-Hsi Chao