Patents by Inventor Kuan Teng Lo

Kuan Teng Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Clustering for prediction models in process control and for optimal dispatching
    Patent number: 10054938
    Abstract: A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity.
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: August 21, 2018
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung Cheng Ko, Tzu-Yu Wang, Kewei Zuo, Kuan Teng Lo, Chien Rhone Wang, Chih-Wei Lai
  • Clustering for Prediction Models in Process Control and for Optimal Dispatching
    Publication number: 20150241876
    Abstract: A first embodiment is a method for semiconductor process control comprising clustering processing tools of a processing stage into a tool cluster based on processing data and forming a prediction model for processing a semiconductor wafer based on the tool cluster. A second embodiment is a method for semiconductor process control comprising providing cluster routes between first stage tool clusters and second stage tool clusters, assigning a comparative optimization ranking to each cluster route, and scheduling processing of wafers. The comparative optimization ranking identifies comparatively which cluster routes provide for high wafer processing uniformity.
    Type: Application
    Filed: May 7, 2015
    Publication date: August 27, 2015
    Inventors: Jung Cheng Ko, Tzu-Yu Wang, Kewei Zuo, Kuan Teng Lo, Chien Rhone Wang, Chih-Wei Lai