Abstract: A coated substrate for an electronic device can include a substrate, a basecoat layer on the substrate, and an anti-fingerprint topcoat layer on the basecoat layer. The substrate can include a metal or metal alloy. The basecoat layer can include pigment particles and a first one-part thermally cured polymeric resin. The anti-fingerprint topcoat layer can include a second one-part thermally cured polymeric resin and an anti-fingerprint material. The anti-fingerprint material can include a fluoropolymer, a silane, or a combination thereof. The basecoat layer can be cured before applying the anti-fingerprint topcoat layer on the basecoat layer.

Abstract: Disclosed is a graphene printed circuit pattern structure including a substrate excellent in electrical insulation and a graphene printed circuit layer provided on the substrate. The graphene printed circuit layer is electrically conductive and has a circuit pattern like an electrical circuit on the circuit board. The graphene printed circuit layer includes surface-modified nanographene platelets, a carrier resin and a filler. The ratio of the particle size of the filler to the thickness of the surface-modified nanographene platelet is 2-1000, and the surface-modified nanographene platelets are dispersed in the carrier resin. The filler is uniformly placed among the surface-modified nanographene platelets so as to enhance effective contact for the surface-modified nanographene platelets. The graphene printed circuit pattern structure provides excellent electrical properties and heat dissipation to achieve protection by preventing electrical elements from overheat.

Abstract: Disclosed is a graphene printed circuit pattern structure including a substrate excellent in electrical insulation and a graphene printed circuit layer provided on the substrate. The graphene printed circuit layer is electrically conductive and has a circuit pattern like an electrical circuit on the circuit board. The graphene printed circuit layer includes surface-modified nanographene platelets, a carrier resin and a filler. The ratio of the particle size of the filler to the thickness of the surface-modified nanographene platelet is 2-1000, and the surface-modified nanographene platelets are dispersed in the carrier resin. The filler is uniformly placed among the surface-modified nanographene platelets so as to enhance effective contact for the surface-modified nanographene platelets. The graphene printed circuit pattern structure provides excellent electrical properties and heat dissipation to achieve protection by preventing electrical elements from overheat.

Abstract: Disclosed is a graphene dissipation structure including a substrate and a graphene dissipation layer. The substrate has at least two surfaces. One of the surfaces contacts at least one heat source, and another one is not in contact with the heat source and provided with the graphene dissipation layer, which includes surface-modified graphene nanometer sheets, a carrier resin and a filler. The surface-modified graphene nanometer sheets are well dispersed in the carrier resin, and enhanced to contact each other through the filler to form a thermal conductive network. The ratio of the particle size of the filler and the thickness of the graphene nanometer sheets is about 2 to 100. Therefore, the heat absorbed by the substrate from the heat source is transferred to the graphene dissipation layer, and further dissipated to the outside through thermal conduction or radiation, thereby achieving the function of heat dissipation.