Abstract: Semiconductor dies of a semiconductor die package are directly bonded, and a top metal region may be formed over the semiconductor dies. A plurality of conductive terminals may be formed over the top metal region. The conductive terminals are formed of copper (Cu) or another material that enables low-temperature deposition process techniques, such as electroplating, to be used to form the conductive terminal. In this way, the conductive terminals of the semiconductor die packages described herein may be formed at a relatively low temperature. This reduces the likelihood of thermal deformation of semiconductor dies in the semiconductor die packages. The reduced thermal deformation reduces the likelihood of warpage, breakage, and/or other types of damage to the semiconductor dies of the semiconductor die packages, which may increase performance and/or increase yield of semiconductor die packages.

Abstract: Messaging service interoperability methods. A client implements a messaging service version (X.Y), in which X is a major version number and Y is a minor version number. The client sends a PDU (Protocol Data Unit) with version (X.Y) to a server. If the PDU with version (X.Y) is not accepted by the server, the client reselects a messaging service version (Z.H), and sends a PDU with the reselected version (Z.H) to the server. Reselection of the messaging service version and sending of a PDU with the reselected version are repeated until the PDU is accepted by the server or all possible reselected versions have been selected.

Abstract: Disclosed is a method for designing public key cryptosystems against fault-based attacks in which secret information stored in a tamperfree device is revealed during the encryption/decryption or signature generation processes due to fault-based attacks. A new fault-resistant system which enables any fault existing in modular multiplications and exponential computations to be detected with a very high probability based on a coding approach. This method can be used to implement all cryptosystems whose basic operations are modular multiplications for resisting both memory and computational fault-based attacks with a very low computational overhead.