Patents by Inventor Kuan-Wei Chen
Kuan-Wei Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12355170Abstract: A modular riser card, an electronic device having a modular riser card, and a method of determining a type of modular riser card pin connection are disclosed. The modular riser card includes a circuit board and a removable connector assembly. The circuit board includes a first receptacle having a plurality of first pins. The removable connector assembly includes a connector body defining a second receptacle having a plurality of second pins, and an opening formed in the connector body adjacent to the second receptacle. The connector body is mounted on the circuit board such that the first receptacle protrudes through the opening and is aligned with the second receptacle. The first and second receptacles form a riser card connector that is configured to removably receive an expansion card of an electronic device.Type: GrantFiled: December 14, 2022Date of Patent: July 8, 2025Assignee: Hewlett Packard Enterprise Development LPInventors: Kuan-Wei Chen, Vincent Nguyen, Ku-Hsu Nien, Jui Lin Chen, Hsueh Yu Chao
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Publication number: 20250215292Abstract: An adhesive and multilayer structure are provided. The adhesive includes a polyimide, wherein the polyimide is a reaction product of a reactant (a) and a reactant (b). The reactant (a) is a first diamine or the reactant (a) includes of a first diamine and a second diamine, and the reactant (b) includes of a first dianhydride and a second dianhydride. The first diamine is a diphenyl-ether-moiety-containing diamine, the first dianhydride is a diphenyl-ether-moiety-containing dianhydride, the second diamine is not a diphenyl-ether-moiety-containing diamine, and the second dianhydride is not a diphenyl-ether-moiety-containing dianhydride. The total weight percentage of the first diamine and the first dianhydride is 55 wt % to 94 wt %, based on the total weight of the reactant (a) and the reactant (b).Type: ApplicationFiled: August 21, 2024Publication date: July 3, 2025Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jauder Jeng, Yuan-Chang Huang, Kuan-Wei Chen, Jheng-Ying Li
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Publication number: 20240364062Abstract: A cable system includes a printed circuit board (PCB) comprising a set of connector pin pads and a card-side connector, with the card-side connector comprising a housing attached to the PCB and a set of pins. A first subset of the set of pins is soldered on and electrically coupled to the connector pin pads. The cable system includes first and second cables electrically coupled to the card-side connector. The first cable includes a first end soldered onto the connector pin pads to couple to the first subset of the pins and a second end coupled to a first host-side connector. The second cable includes a first end soldered onto a second subset of the set of pins of the card-side connector and a second end coupled to a second host-side connector, thereby facilitating electrical coupling between the card-side connector and the first and second host-side connectors.Type: ApplicationFiled: April 27, 2023Publication date: October 31, 2024Inventors: Ku-Hsu Nien, Vincent Nguyen, Kuan-Wei Chen
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Patent number: 12133349Abstract: One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.Type: GrantFiled: August 16, 2022Date of Patent: October 29, 2024Assignee: Hewlett Packard Enterprise Development LPInventors: Vincent Nguyen, Minh H. Nguyen, Kuan-Wei Chen
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Publication number: 20240316718Abstract: A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotation of the main roller to contact and brush the copper foil surface, each metallic-glass particle as cushioned by the main roller may simultaneously polish and grind the copper foil surface for efficiently reducing roughness of copper foil.Type: ApplicationFiled: March 20, 2024Publication date: September 26, 2024Inventors: Kuan-Wei Chen, Kuan-Yu Chen, Jason Shian-Ching Jang
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Patent number: 12043568Abstract: A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.Type: GrantFiled: February 8, 2021Date of Patent: July 23, 2024Assignee: TACHI METAL MATERIAL TECHNOLOGY CO., LTD.Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang
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Publication number: 20240204433Abstract: A modular riser card, an electronic device having a modular riser card, and a method of determining a type of modular riser card pin connection are disclosed. The modular riser card includes a circuit board and a removable connector assembly. The circuit board includes a first receptacle having a plurality of first pins. The removable connector assembly includes a connector body defining a second receptacle having a plurality of second pins, and an opening formed in the connector body adjacent to the second receptacle. The connector body is mounted on the circuit board such that the first receptacle protrudes through the opening and is aligned with the second receptacle. The first and second receptacles form a riser card connector that is configured to removably receive an expansion card of an electronic device.Type: ApplicationFiled: December 14, 2022Publication date: June 20, 2024Inventors: Kuan-Wei Chen, Vincent Nguyen, Ku-Hsu Nien, Jui Lin Chen, Hsueh Yu Chao
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Publication number: 20240064919Abstract: One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.Type: ApplicationFiled: August 16, 2022Publication date: February 22, 2024Inventors: Vincent Nguyen, Minh H. Nguyen, Kuan-Wei Chen
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Patent number: 11780054Abstract: A cutting method by applying a particle beam of metallic glass onto a substrate to cut or partially cut the substrate with high production efficiency, low production cost and better environmental protection.Type: GrantFiled: August 18, 2021Date of Patent: October 10, 2023Assignee: TAICHI METAL MATERIAL TECHNOLOGY CO., LTD.Inventors: Kuan-Wei Chen, Kuan-Yu Chen
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Patent number: 11771760Abstract: The present invention relates to a fusion protein having formula (I) X1?Y?X2??(I), wherein X1 and X2 comprise each four to six allergen fragments or variants thereof fused to each other, wherein said allergen fragments are derived from at least two allergens of the genus Dermatophagoides, and wherein Y is a carrier protein.Type: GrantFiled: May 17, 2019Date of Patent: October 3, 2023Assignee: WORG PHARMACEUTICALS (ZHEJIANG) CO., LTD.Inventors: Rudolf Valenta, Mirela Curin, Kuan-Wei Chen, Susanne Vrtala
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Patent number: 11736998Abstract: A communications apparatus and associated method communicating with at least one cellular network includes a radio transceiver and a processor. The communications apparatus includes a radio transceiver, capable of transmitting or receiving wireless radio frequency signals to or from a cellular network; and a processor. The processor is configured to: receive an incoming call request message that will trigger a Circuit Switch Fall Back (CSFB) procedure or a Evolved Packet System Fall Back (EPS FB) procedure from the cellular network via the radio transceiver, query a user to accept or reject the incoming call request before triggering the CSFB procedure or the EPS FB procedure, and determine whether to trigger the CSFB procedure or the EPS FB procedure based on a response to the query from the user.Type: GrantFiled: September 3, 2021Date of Patent: August 22, 2023Assignee: MEDIATEK INC.Inventors: Guan-Jie Huang, Tzu-Wen Chang, Kuan-Wei Chen, Yu-Hua Huang, Teng Ma, Sheng-Kai Chang
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Publication number: 20230168510Abstract: A head-mounted display device including a camera, a processor, and a displayer is disclosed. The camera is configured to capture a specific image of a specific object within an environment. The processor is coupled to the camera, and the processor is configured to: obtain several feature points of the specific image, and each of several feature points includes a world coordinate; generate a view coordinate according to the world coordinate of each of the plurality of feature points; and generate a projection coordinate of the environment according to the view coordinate of each of the feature points. The displayer is coupled to the processor, and the displayer is configured to display a virtual image including a transformed specific image.Type: ApplicationFiled: July 21, 2022Publication date: June 1, 2023Inventor: Kuan-Wei CHEN
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Publication number: 20230054463Abstract: A cutting method by applying a particle beam of metallic glass onto a substrate to cut or partially cut the substrate with high production efficiency, low production cost and better environmental protection.Type: ApplicationFiled: August 18, 2021Publication date: February 23, 2023Inventors: Kuan-Wei Chen, Kuan-Yu Chen
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Publication number: 20220250974Abstract: A process for making anti-reflective optical glass comprises the steps of: A. implementing an abrading tool including a carrier having a plurality of diamond cutting wires formed on the carrier; and B. centrifugally and resiliently abrading a substrate of optical glass by the abrading tool to form a plurality of microscopic protuberances or moth-eye like structures on the substrate to thereby reduce the light reflection from the substrate and increase the light transmission in the substrate.Type: ApplicationFiled: February 8, 2021Publication date: August 11, 2022Inventors: Kuan-Wei Chen, Jason Shian-Ching Jang
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Patent number: 11330715Abstract: An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.Type: GrantFiled: April 26, 2020Date of Patent: May 10, 2022Assignee: Wiwynn CorporationInventors: Tzu-Yu Wei, Yi-Tang Chen, Yi-Shian Chen, Chi-Hsiang Hung, Kuan-Wei Chen
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Publication number: 20210400550Abstract: A communications apparatus and associated method communicating with at least one cellular network includes a radio transceiver and a processor. The communications apparatus includes a a radio transceiver, capable of transmitting or receiving wireless radio frequency signals to or from a cellular network; and a processor. The processor is configured to: receive an incoming call request message that will trigger a Circuit Switch Fall Back (CSFB) procedure or a Evolved Packet System Fall Back (EPS FB) procedure from the cellular network via the radio transceiver, query a user to accept or reject the incoming call request before triggering the CSFB procedure or the EPS FB procedure, and determine whether to trigger the CSFB procedure or the EPS FB procedure based on a response to the query from the user.Type: ApplicationFiled: September 3, 2021Publication date: December 23, 2021Inventors: Guan-Jie HUANG, Tzu-Wen CHANG, Kuan-Wei CHEN, Yu-Hua HUANG, Teng MA, Sheng-Kai CHANG
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Publication number: 20210373069Abstract: A signal testing device and a signal testing method are provided. The method includes: obtaining, through a probe, a first frequency response corresponding to a test fixture and a device under test (DUT); obtaining, through the probe, a second frequency response corresponding to the test fixture; and generating a frequency response corresponding to the DUT according to the first frequency response, the second frequency response, a de-embedding algorithm, and an empirical mode decomposition algorithm.Type: ApplicationFiled: July 20, 2020Publication date: December 2, 2021Applicant: Wiwynn CorporationInventors: Kuan-Wei Chen, Tzu-Yu Wei, Yi-Shian Chen, Yi-Tang Chen, Chi-Hsiang Hung, Ting-Kai Wang
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Patent number: 11140593Abstract: A communications apparatus communicating with at least one cellular network includes a radio transceiver and a processor. The radio transceiver is capable of transmitting or receiving wireless radio frequency signals to or from an air interface in the cellular network. The processor is configured to determine whether an inter-RAT change will be triggered in a subsequent procedure when the communications apparatus is in a connected mode. When the processor determines that an inter-RAT change procedure will be triggered, the processor is configured to selectively perform a predetermined procedure instead of the subsequent procedure to avoid the inter-RAT change.Type: GrantFiled: July 17, 2019Date of Patent: October 5, 2021Assignee: MEDIATEK INC.Inventors: Guan-Jie Huang, Tzu-Wen Chang, Kuan-Wei Chen, Yu-Hua Huang, Teng Ma, Sheng-Kai Chang
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Publication number: 20210286744Abstract: A system manages communication between a host device and an end device. The system includes a programmable input/output (I/O) port associated with the host device. The host device is connectable through the programmable I/O port and a cable to a plurality of different types of end devices that are respectively associated with different types of protocols. The system further includes a port manager to detect a signal from an end device interface associated with the end device and determine a type of the end device based on the detected signal. The port manager directs the programmable I/O port to present signals that correspond to a protocol associated with the determined type of the end device to allow the host device to communicate with the end device.Type: ApplicationFiled: March 16, 2020Publication date: September 16, 2021Inventors: John Norton, Ku-Hsu Nien, Vincent Nguyen, Kuan-WeI Chen
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Publication number: 20210267059Abstract: An electronic device includes a motherboard, a bridging device, and an add-in card. The motherboard includes a processor, a first circuit board, and a first connector. The processor is coupled to the first connector through the first circuit board. The bridging device includes a second circuit board and a second connector and is disposed on the motherboard and coupled to the first connector. The second connector is coupled to the first connector through the second circuit board. The add-in card includes a third circuit board and a peripheral circuit and is disposed on the bridging device and coupled to the second connector. The peripheral circuit is coupled to the second connector through the third circuit board. The processor is coupled to the peripheral circuit through a signal path including the first circuit board, the first connector, the second circuit board, the second connector, and the third circuit board.Type: ApplicationFiled: April 26, 2020Publication date: August 26, 2021Applicant: Wiwynn CorporationInventors: Tzu-Yu Wei, Yi-Tang Chen, Yi-Shian Chen, Chi-Hsiang Hung, Kuan-Wei Chen