Abstract: An electronic device includes a flexible substrate, an anisotropic conductive film, and an electronic element. The flexible substrate includes an active area, a bonding pad, and a plurality of protrusions located on the bonding pad. The anisotropic conductive film includes a plurality of conductive particles. The conductive particles are in contact with the protrusions. The anisotropic conductive film is located between the bonding pad of the flexible substrate and the electronic element.

Abstract: An anti-counterfeiting method and a system for under-screen fingerprint identification are provided. A fingerprint sensing apparatus includes a display device and a fingerprint sensor, and the method includes the following steps. A fingerprint sensing image is captured for an object on the display device through the fingerprint sensor. The fingerprint sensing image is calibrated by using a color calibration parameter to generate a calibrated image. Whether the object is a real finger is determined by using an anti-counterfeiting algorithm and the calibrated image.

Abstract: An electronic apparatus and an operating method thereof are provided. The electronic apparatus includes an optical fingerprint sensor and a processor. The optical fingerprint sensor is configured to obtain a fingerprint image. The processor is coupled to the optical fingerprint sensor and analyzes the fingerprint image to calculate at least one of a color pixel ratio and a light reflectance corresponding to the fingerprint image. The processor searches a background database according to at least one of the color pixel ratio and the light reflectance to obtain a background image. The processor corrects the fingerprint image according to the background image to obtain a corrected fingerprint image.

Abstract: A display device includes a flexible display panel, a sealant, and a first reinforcing structure. The flexible display panel includes a lower substrate, an upper substrate, and a display medium layer disposed between the lower substrate and the upper substrate. Each of the lower substrate and the upper substrate has an edge region. A centerline of the flexible display panel is parallel to a short side of the flexible display panel. The sealant is disposed between the edge region of the lower substrate and the edge region of the upper substrate. The first reinforcing structure is disposed among the sealant, the edge region of the lower substrate, and the edge region of the upper substrate. The centerline of the flexible display panel passes through the first reinforcing structure, and the elastic modulus of the first reinforcing structure is greater than that of the sealant.

Abstract: An organic thin film transistor includes a substrate, a source/drain layer that is located on the substrate and has a source region and a drain region, a first buffer layer that is located between the source region and the drain region, a semiconductor layer that is located on the source/drain layer and the first buffer layer, a gate insulating layer, and a gate electrode. The first buffer layer covers at least one portion of the source region and at least one portion of the drain region. The first buffer layer is located among the semiconductor layer, the source region, the drain region, and the substrate. The gate insulating layer covers the source/drain layer and the semiconductor layer. The gate electrode is located on the gate insulating layer, and a portion of the gate insulating layer is located between the gate electrode and the semiconductor layer.

Abstract: A displaying device adapted to a screen is provided. The displaying device includes a transparent pyramid, a movable support, and an image conversion unit. The movable support is connected to the transparent pyramid to move the transparent pyramid between a first location and a second location which is different from the first location. The first location is the position on the screen. The image conversion unit is configured to receive image data. When the transparent pyramid moves to the first location, the image conversion unit converts the image data to a holographic image displayed on the screen, and the transparent pyramid generates a 3D hologram based on the holographic image.

Abstract: A carrier apparatus is adapted to carry a flexible substrate. The carrier apparatus includes two carrier plates, two adhesive layers, and two supporting units. The carrier plates have a gap with respect to each other, and each of the carrier plates has a first region and a second region, wherein the second regions of the carrier plates are adjacent to each other and are located between the first regions. The adhesive layers are respectively disposed in the first regions of the carrier plates. The supporting units are respectively disposed in the second regions of the carrier plates and are coplanar with the adhesive layers, wherein the flexible substrate is fixed on the carrier plates through the adhesive layers, and the supporting units are detachably attached to a bending zone of the flexible substrate by attractive force. A display including the carrier apparatus and a flexible display panel is provided.

Abstract: A flexible laminated structure includes a first protective layer, a plurality of patterned structures, and a second protective layer. The patterned structures are disposed on the first protective layer and expose a portion of the first protective layer. Each of the patterned structures has a first width adjacent to the first protective layer and a second width away from the first protective layer, and the first width is smaller than the second width. The second protective layer is disposed on the first protective layer and covers the patterned structures and the first protective layer.

Abstract: Provided is a light-emitting intensity control method, which is suitable for an electronic device. The electronic device includes a processing component, a light-emitting component, and a sensing module. The light-emitting component includes a fingerprint sensing region. The sensing module is disposed below the fingerprint sensing region. The light-emitting intensity control method includes the following steps: controlling, by the processing component, the fingerprint sensing region of the light-emitting component to emit an optimized illumination beam to a finger above the fingerprint sensing region according to optimized data. The light intensity distribution of the optimized illumination beam is non-uniform. The fingerprint sensing region is divided at least into a first region and a second region from the center to the periphery. The light intensity of the first region is smaller than the light intensity of the second region. Besides, an electronic device is also proposed.

Abstract: A flexible laminated structure includes a first protection layer, a second protection layer directly contacting the first protection layer and a flexible material layer. The second protection layer having a plurality of openings, which are used to expose a portion of the first protection layer. The flexible material layer is disposed on the second protection layer and extends into the openings, and directly contacts the first protection layer exposed by the openings. An adhesion between the flexible material layer and the first protection layer is greater than an adhesion between the second protection layer and the first protection layer.

Abstract: A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.

Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.

Abstract: A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.

Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.

Abstract: A flexible laminated structure includes a first protection layer, a second protection layer directly contacting the first protection layer and a flexible material layer. The second protection layer having a plurality of openings, which are used to expose a portion of the first protection layer. The flexible material layer is disposed on the second protection layer and extends into the openings, and directly contacts the first protection layer exposed by the openings. An adhesion between the flexible material layer and the first protection layer is greater than an adhesion between the second protection layer and the first protection layer.

Abstract: A flexible laminated structure includes a first protective layer, a plurality of patterned structures, and a second protective layer. The patterned structures are disposed on the first protective layer and expose a portion of the first protective layer. Each of the patterned structures has a first width adjacent to the first protective layer and a second width away from the first protective layer, and the first width is smaller than the second width. The second protective layer is disposed on the first protective layer and covers the patterned structures and the first protective layer.

Abstract: A carrier apparatus is adapted to carry a flexible substrate. The carrier apparatus includes two carrier plates, two adhesive layers, and two supporting units. The carrier plates have a gap with respect to each other, and each of the carrier plates has a first region and a second region, wherein the second regions of the carrier plates are adjacent to each other and are located between the first regions. The adhesive layers are respectively disposed in the first regions of the carrier plates. The supporting units are respectively disposed in the second regions of the carrier plates and are coplanar with the adhesive layers, wherein the flexible substrate is fixed on the carrier plates through the adhesive layers, and the supporting units are detachably attached to a bending zone of the flexible substrate by attractive force. A display including the carrier apparatus and a flexible display panel is provided.

Abstract: An organic thin film transistor includes a substrate, a source/drain layer that is located on the substrate and has a source region and a drain region, a first buffer layer that is located between the source region and the drain region, a semiconductor layer that is located on the source/drain layer and the first buffer layer, a gate insulating layer, and a gate electrode. The first buffer layer covers at least one portion of the source region and at least one portion of the drain region. The first buffer layer is located among the semiconductor layer, the source region, the drain region, and the substrate. The gate insulating layer covers the source/drain layer and the semiconductor layer. The gate electrode is located on the gate insulating layer, and a portion of the gate insulating layer is located between the gate electrode and the semiconductor layer.

Abstract: A flexible display device includes a flexible substrate, an inorganic barrier layer, a metal layer, an organic buffer layer, and an insulating layer. The inorganic barrier layer is located on the flexible substrate. The metal layer is located on the inorganic barrier layer and in contact with the inorganic barrier layer. The organic buffer layer covers the inorganic barrier layer and the metal layer, and has at least one conductive via connected to the metal layer. The insulating layer is located on the organic buffer layer.

Abstract: The present disclosure provides a contact window structure. In the contact window structure, a first insulating layer, having a first opening, is positioned on a first metal layer, wherein the first opening exposes a part of the first metal layer. A second metal layer covers the first opening and contacts with the first metal layer via the first opening. A second insulating layer, having a second opening, is positioned on the first insulating layer, wherein the second opening exposes a part of the second layer and the first insulating layer. The projection area of the second opening on the first metal layer covers the projection area of the first opening on the first metal layer. A pixel structure containing the contact window structure and a manufacturing method thereof are also provided herein.