Patents by Inventor Kuan-You CHEN

Kuan-You CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD
    Publication number: 20240071849
    Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
  • Electrical device and buffer member thereof
    Patent number: 10082841
    Abstract: A buffer member includes a first buffer portion, a pin, a bending portion and a second buffer portion. The pin is located on the first buffer portion. The bending portion is connected with the first buffer portion. The second buffer portion is connected with the bending portion, and the first buffer portion is connected with the second buffer portion via the bending portion. A reinforcing member is located inside the pin for raising the rigidity of the pin. The pin is used for fixing a vibration source. The first buffer portion and the second buffer portion reduce the transmission of the vibration energy from the vibration source.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: September 25, 2018
    Assignee: WISTRON CORP.
    Inventors: Yun-Ping Lee, Hsiang-Ming Lu, Kuan-You Chen, Wenlong Chen, Min-Hung Chen
  • Buffer member, buffer frame and electrical device
    Patent number: 9891673
    Abstract: A buffer member includes a first buffer portion, a pin, a bending portion and a second buffer portion. The pin is located on the first buffer portion. The bending portion is connected with the first buffer portion. The second buffer portion is connected with the bending portion, and the first buffer portion is connected with the second buffer portion via the bending portion. A reinforcing member is located inside the pin for raising the rigidity of the pin. The pin is used for fixing a vibration source. The first buffer portion and the second buffer portion reduce the transmission of the vibration energy from the vibration source.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: February 13, 2018
    Assignee: WISTRON CORP.
    Inventors: Yun-Ping Lee, Hsiang-Ming Lu, Kuan-You Chen, Wenlong Chen, Min-Hung Chen
  • ELECTRICAL DEVICE AND BUFFER MEMBER THEREOF
    Publication number: 20180032111
    Abstract: A buffer member includes a first buffer portion, a pin, a bending portion and a second buffer portion. The pin is located on the first buffer portion. The bending portion is connected with the first buffer portion. The second buffer portion is connected with the bending portion, and the first buffer portion is connected with the second buffer portion via the bending portion. A reinforcing member is located inside the pin for raising the rigidity of the pin. The pin is used for fixing a vibration source. The first buffer portion and the second buffer portion reduce the transmission of the vibration energy from the vibration source.
    Type: Application
    Filed: October 10, 2017
    Publication date: February 1, 2018
    Applicant: WISTRON CORP.
    Inventors: Yun-Ping LEE, Hsiang-Ming LU, Kuan-You CHEN, Wenlong CHEN, Min-Hung CHEN
  • BUFFER MEMBER, BUFFER FRAME AND ELECTRICAL DEVICE
    Publication number: 20150117696
    Abstract: A buffer member includes a first buffer portion, a pin, a bending portion and a second buffer portion. The pin is located on the first buffer portion. The bending portion is connected with the first buffer portion. The second buffer portion is connected with the bending portion, and the first buffer portion is connected with the second buffer portion via the bending portion. A reinforcing member is located inside the pin for raising the rigidity of the pin. The pin is used for fixing a vibration source. The first buffer portion and the second buffer portion reduce the transmission of the vibration energy from the vibration source.
    Type: Application
    Filed: January 31, 2014
    Publication date: April 30, 2015
    Applicant: Wistron Corp.
    Inventors: Yun-Ping LEE, Hsiang-Ming LU, Kuan-You CHEN, Wenlong CHEN, Min-Hung CHEN