Abstract: A hinge includes a first fixing bracket, a shaft and a swivel bracket. The first fixing bracket includes two first support pieces and a first connection piece. The two first support pieces are arranged in parallel to each other, and the first connection piece is connected to the two second support pieces. The two first support pieces are respectively provided with a shaft hole and the shaft holes are arranged coaxially along a central axis. At least one of the first support pieces is provided with one limiting extension portion extending in a direction in parallel to the central axis at an upper front end of the first support piece and extending towards the other first support piece. The shaft is inserted into the shaft hole.

Abstract: A hinge includes a seat, a shaft, a swivel bracket and at least one limiting bar. The seat includes two support portions. An accommodation area is defined between the two support portions. The two support portions are respectively provided with a shaft hole. The two shaft holes are arranged coaxially and connected to the accommodation area. The shaft includes a coupling section and two pivoting sections. The coupling section is located between the two pivoting sections. The two pivoting sections are respectively provided in one of the two shaft holes in a rotatable manner, and the coupling section is in the accommodation area. The swivel bracket includes a mounting plate, a sleeve piece and at least one extension portion. The mounting plate includes an inner surface, an outer surface, and a bottom edge. The sleeve piece extends from the bottom edge of the mounting plate and is wound at a side corresponding to the inner surface.

Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: A water treatment composition for treating organic wastewater is provided. The water treatment composition includes a bulk catalytic material and an oxidant. The bulk catalytic material includes iron atoms or ions, manganese atoms or ions, and magnesium atoms or ions.

Abstract: A low complexity motion compensating beamforming system utilizes a probe array to fire for beamforming by synthetic apertures. The beamforming range of each firing is a region of interest (ROI), and the common area of adjacent ROI's forms the common ROI. The central image beam of the common ROI is used to generate image beam vectors, in order to analyze the cross-correlation for the corresponding low resolution images (LRI's). The analysis result is used to compute an offset for sequentially compensating and combining the LRI's to form a high resolution image (HRI). The mechanism helps improve the quality of ultrasonic beamforming and the frame rate.