Abstract: In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Abstract: A semiconductor device includes a first substrate, an electronic component, and a lid. The first substrate includes a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a connector structure. The electronic component is coupled to the first substrate top side and coupled to the connector structure. The lid includes a wall part including a ring part coupled to the first substrate top side, a first part of an overhang part coupled to the first substrate lateral side, and a second part of the overhang part extending from the first part of the overhang part away from the first substrate lateral side.

Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: A temperature controlling method is provided, which is suitable for a communication system including a plurality of communication chips. The temperature controlling method includes the following operations: calculating an average temperature of each communication chip; if a first flag parameter corresponding to a first chip of the plurality of communication chips is a predetermined value, adjusting a first transmission rate of the first chip according to the average temperature of the first chip; and if the first flag parameter corresponding to the first chip is different from the predetermined value, adjusting the first transmission rate according to the average temperature of a second chip of the plurality of communication chips.

Abstract: A temperature controlling method is provided, which is suitable for a communication system including a plurality of communication chips. The temperature controlling method includes the following operations: calculating an average temperature of each communication chip; if a first flag parameter corresponding to a first chip of the plurality of communication chips is a predetermined value, adjusting a first transmission rate of the first chip according to the average temperature of the first chip; and if the first flag parameter corresponding to the first chip is different from the predetermined value, adjusting the first transmission rate according to the average temperature of a second chip of the plurality of communication chips.

Abstract: A network connection device includes a wired network module, for connecting an electronic apparatus to a wired network; and a wireless network module, serving as a wireless network client to connect the electronic apparatus to a wireless network. The network connection device operates in a router mode, an AP mode or a repeater mode, and automatically switches between different modes.