Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary semiconductor device comprises a substrate; semiconductor layers over the substrate, wherein the semiconductor layers are separate from each other and are stacked up along a direction generally perpendicular to a top surface of the substrate; a dielectric feature over and separate from the semiconductor layers; and a gate structure wrapping around each of the semiconductor layers, the gate structure having a gate dielectric layer and a gate electrode layer, wherein the gate dielectric layer interposes between the gate electrode layer and the dielectric feature and the dielectric feature is disposed over at least a part of the gate electrode layer.

Abstract: Techniques and systems for automatic net grouping and routing are described. Some embodiments can determine a set of net groups by automatically grouping nets that have (1) a same pin count, (2) a pin direction type that is in a predefined set of pin direction types, and (3) a pin order type that is in a predefined set of pin order types. Next, the embodiments can generate routing guidance by performing trunk planning for each net group. The embodiments can then perform detailed routing for each net in each net group by using the routing guidance.