Abstract: Multi-gate devices and methods for fabricating such are disclosed herein. An exemplary method includes forming a semiconductor stack on a substrate, wherein the semiconductor stack includes a first semiconductor layers and a second semiconductor layers alternatively disposed, the first semiconductor layers and the second semiconductor layers being different in composition; patterning the semiconductor stack to form a semiconductor fin; forming a dielectric fin next to the semiconductor fin; forming a first gate stack on the semiconductor fin and the dielectric fin; etching to a portion of the semiconductor fin within a source/drain region, resulting in a source/drain recess; and epitaxially growing a source/drain feature in the source/drain recess, defining an airgap spanning between a sidewall of the source/drain feature and a sidewall of the dielectric fin.

Abstract: A storage environment monitoring device is capable of measuring and/or monitoring various parameters of an environment inside a storage area, such as airflow, temperature, and humidity, to increase the storage quality of semiconductor components stored in the storage area. The storage environment monitoring device is capable of measuring and/or monitoring the parameters of the environment inside the storage area without having to open an enclosure that is storing the semiconductor components in the storage area. This reduces exposure of the semiconductor components to contamination and other environmental factors.

Abstract: The present invention provides a novel dielectric filter, which comprises a dielectric body, N+4 through holes, and an end surface metal layer, wherein the end surface metal layer comprises a first metal block, a second metal block, N middle metal blocks, a penultimate metal block, a last metal block, a first metal sideline, a second metal line segment, a third metal line segment, a fourth metal line segment, and a fifth metal line segment; the first metal block, the second metal block, the N middle metal blocks, the penultimate metal block and the last metal block are respectively formed on peripheral sides of a first resonance hole, a second resonance hole, N middle resonance holes, a penultimate resonance hole and a last resonance hole.

Abstract: A storage environment monitoring device is capable of measuring and/or monitoring various parameters of an environment inside a storage area, such as airflow, temperature, and humidity, to increase the storage quality of semiconductor components stored in the storage area. The storage environment monitoring device is capable of measuring and/or monitoring the parameters of the environment inside the storage area without having to open an enclosure that is storing the semiconductor components in the storage area. This reduces exposure of the semiconductor components to contamination and other environmental factors.

Abstract: An electronic device may have a display overlapped by a display cover layer. Portions of the surface of the display and cover layer may have curved profiles. For example, a display cover layer may have transparent sidewall portions with curved surface profiles. The transparent sidewall portions of the display cover layer may include rounded corners having areas of compound curvature. A flexible display panel may be pressed over a mold to impart desired curvature (such as compound curvature) to the flexible display panel. To mitigate wrinkling in a flexible display panel molded to have compound curvature, a backfilm may be included that absorbs compressive strains in the display panel. The backfilm may have a coefficient of thermal expansion that is higher than that of the display panel. Instead or in addition, the backfilm may have portions with different Young's modulus magnitudes or different thickness magnitudes.

Abstract: The disclosure relates to an ultra-wide passband five-order band-pass filter based on an LTCC process. The ultra-wide passband five-order band-pass filter comprises a ceramic substrate, a bottom input electrode, a bottom output electrode and a bottom grounding electrode. Five parallel resonators, a grounding polar plate, two series connection capacitors, two series connection inductors, a cross-coupling capacitor and a parallel inductor are arranged in the ceramic substrate; the two series connection capacitors comprise a first series capacitor and a second series capacitor; the two series connection inductors comprise a first series inductor and a second series inductor; and according to the filter, a five-order parallel resonance structure is adopted, out-of-band suppression is deepened through the five parallel resonance units, a cross coupling capacitor, a parallel inductor and two series connection inductors are innovatively introduced.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a gate dielectric layer on the fin-shaped structure; forming a gate electrode on the fin-shaped structure; performing a nitridation process to implant ions into the gate dielectric layer adjacent to two sides of the gate electrode; and forming an epitaxial layer adjacent to two sides of the gate electrode.

Abstract: An electrostatic discharge (ESD) protection device includes a semiconductor substrate, a gate structure, a source doped region, a drain doped region, source silicide patterns, and drain silicide patterns. The gate structure is disposed on the semiconductor substrate. The source doped region and the drain doped region are disposed in the semiconductor substrate and located at two opposite sides of the gate structure in a first direction, respectively. The source silicide patterns are disposed on the source doped region. The source silicide patterns are arranged in a second direction and separated from one another. The drain silicide patterns are disposed on the drain doped region. The drain silicide patterns are arranged in the second direction and separated from one another. The source silicide patterns and the drain silicide patterns are arranged misaligned with one another in the first direction.

Abstract: The disclosure relates to an ultra-wide passband five-order band-pass filter based on an LTCC process. The ultra-wide passband five-order band-pass filter comprises a ceramic substrate, a bottom input electrode, a bottom output electrode and a bottom grounding electrode. Five parallel resonators, a grounding polar plate, two series connection capacitors, two series connection inductors, a cross-coupling capacitor and a parallel inductor are arranged in the ceramic substrate; the two series connection capacitors comprise a first series capacitor and a second series capacitor; the two series connection inductors comprise a first series inductor and a second series inductor; and according to the filter, a five-order parallel resonance structure is adopted, out-of-band suppression is deepened through the five parallel resonance units, a cross coupling capacitor, a parallel inductor and two series connection inductors are innovatively introduced.

Abstract: Disclosed is a biofiber dental implant, comprising a fixture having a groove, for osseointegrating into a bone of a jaw or a skull; a peripheral junction having a through hole, connected to the fixture by the groove, for connecting an abutment supporting a dental prosthesis; and a middle member is disposed through the fixture and peripheral junction by the through hole. The fixture, the peripheral junction and middle member are made of multiple biofibers which consist a single bare fiber or a single constructed fiber. The single constructed fiber consists a core and either a single cladding or multiple claddings, and the clad and core are fused together to form the single constructed fiber.

Abstract: A single-piece multi-frequency infrared light-emitting-diode (LED) and a multi-frequency high-precision object recognition system formed by using the same. The LED mentioned is formed by a first infrared light-emitting-die and a second infrared light-emitting-die space apart, having two different wavelengths with their ranges between 850 nm and 1050 nm, to serve as light source for the multi-frequency high-precision object recognition system, to obtain a 3-dimension stereoscopic relief image speedily. In addition, the system is less liable to be affected by the variations of ambient lights, so that the recognition precision for the entire object can be raised effectively. The single-piece multi-frequency infrared light-emitting-diode (LED) can be used extensively in security monitoring, industrial monitoring, human face recognition, image recognition for door opening of a vehicle.

Abstract: A multi-frequency high-precision object recognition method is disclosed, wherein a multi-frequency light emitting unit is used to emits lights of different frequencies onto an object-to-be-tested, and a multi-frequency image sensor unit is used to fetch the image of lights reflected from the object-to-be-tested. In an X axis and a Y axis is a single-piece planar image, while lights of different frequencies is used to form image depth in a Z axis. The sample light in the Z axis includes two infrared light narrow range image signals, each having wavelength between 850 nm and 1050 nm, and wavelength width between 10 nm and 60 nm. Calculate to obtain a plurality of single-piece planar images in the X axis and the Y axis as sampled by different wavelength widths in the Z axis, superimpose the plurality of single-piece planar images into a 3-dimension stereoscopic relief image for precise comparison and recognition.

Abstract: A multi-frequency high-precision object recognition method is disclosed, wherein a multi-frequency light emitting unit is used to emits lights of different frequencies onto an object-to-be-tested, and a multi-frequency image sensor unit is used to fetch the image of lights reflected from the object-to-be-tested. In an X axis and a Y axis is a single-piece planar image, while lights of different frequencies is used to form image depth in a Z axis. The sample light in the Z axis includes two infrared light narrow range image signals, each having wavelength between 850 nm and 1050 nm, and wavelength width between 10 nm and 60 nm. Calculate to obtain a plurality of single-piece planar images in the X axis and the Y axis as sampled by different wavelength widths in the Z axis, superimpose the plurality of single-piece planar images into a 3-dimension stereoscopic relief image for precise comparison and recognition.

Abstract: An image sensor capable of enhancing image recognition and application of the same, wherein the image sensor includes: a photosensitive pixel array, connected to a packaging circuit, that is used to drive the photosensitive pixel array to capture outside light, and convert outside light into combined image signal, the photosensitive pixel array captures full color RGB visible light and infrared (IR) invisible light, to perform photoelectric conversion; the packaging circuit is connected electrically to the photosensitive pixel array; and an image enhanced process unit, embedded in the packaging circuit, to control and regulate the image captured by the photosensitive pixel array. The captured image includes: a full color RGB visible light wide range image signal, and at least two Infrared (IR) invisible lights narrow range image signals. The two kinds of image signals are superimposed and combined into clear output image having stereoscopic sense of layers.

Abstract: A woven fiber optics dental post includes a post body and a woven fiber component. The post body includes a post face, an irradiation receiving portion, and a bottom. The woven fiber component is provided within the post body. The woven fiber component is formed by intertwining a plurality of fiber optics members. A light receiving end portion and a light emitting end portion are respectively composed of a plurality of light receiving ends and light emitting ends of the fiber optics members. The light receiving end portion is appeared on the irradiation receiving portion of the post body for having the woven fiber component receiving a light irradiated at the irradiation receiving portion, and the light emitting end portion is appeared on the post face and/or the bottom of the post body for having the light received by the woven fiber component transmitting to the light emitting end portion to be emitted out of the post face and/or the bottom.

Abstract: A stable manufacturing efficiency generating method includes the steps: generating a real-time grouping parameter set according to a plurality of historical efficiency values; grouping a plurality of real-time efficiency values corresponding to a product to generate a plurality of real-time efficiency groups according to the real-time grouping parameter set; selecting one of the real-time efficiency groups having most real-time efficiency values as a stable efficiency group; and generating a stable manufacturing efficiency value according to an average value of the real-time efficiency values in the stable efficiency group.

Abstract: A woven fiber optics dental post includes a post body and a woven fiber component. The post body includes a post face, an irradiation receiving portion, and a bottom. The woven fiber component is provided within the post body. The woven fiber component is formed by intertwining a plurality of fiber optics members. A light receiving end portion and a light emitting end portion are respectively composed of a plurality of light receiving ends and light emitting ends of the fiber optics members. The light receiving end portion is appeared on the irradiation receiving portion of the post body for having the woven fiber component receiving a light irradiated at the irradiation receiving portion, and the light emitting end portion is appeared on the post face and/or the bottom of the post body for having the light received by the woven fiber component transmitting to the light emitting end portion to be emitted out of the post face and/or the bottom.

Abstract: The present invention provides a bone connection material that includes an internal layer. The internal layer is formed by braiding a plurality of filaments. The internal layer that is formed by braiding filaments is resistant to lateral shearing forces and may provide flexibility so as to achieve wide applications. Further, the present invention overcomes the drawback of the conventionally used metallic materials that are rigid and inelastic and also overcomes the problem of polylactic acid material of being brittle. Thus, the bone formed according to the present invention is close to a natural bone and is more suitable for uses in portions where frequent movements are made and scaffolds of stem cells.

Abstract: Disclosed is a bioglass fiber dental implant with fiber material and structure including a fixture and a peripheral junction. The fixture is arranged for osseointegrating a bone of the jaw or skull. The peripheral junction is connected to the fixture and is arranged for connecting an abutment supporting a dental prosthesis. The fixture and the peripheral junction are constituted of fiber-enhanced resin. The fibers in the fiber-enhanced resin form a woven fiber structure which includes a center fiber shaft provided straightly through the woven fiber structure and includes a plurality of braided fiber shafts interlaced-knitted around the center fiber shaft. Each fiber in the fiber-enhanced resin has one or more layers.

Abstract: The present invention provides a bone connection material that includes an internal layer. The internal layer is formed by braiding a plurality of filaments. The internal layer that is formed by braiding filaments is resistant to lateral shearing forces and may provide flexibility so as to achieve wide applications. Further, the present invention overcomes the drawback of the conventionally used metallic materials that are rigid and inelastic and also overcomes the problem of polylactic acid material of being brittle. Thus, the bone formed according to the present invention is close to a natural bone and is more suitable for uses in portions where frequent movements are made and scaffolds of stem cells.