Abstract: A circuit layout for improving the power supply rejection ratio includes a radio frequency (RF) choke and an inductor. The RF choke receives a supply voltage and includes: a first choke coil positioned in an ultra-thick metal (UTM) layer, the coil including a first choke electrode; and a second choke coil positioned in a redistribution layer (RDL), the coil including a second choke electrode. The inductor belongs to a main circuit and includes: a primary-side coil surrounding the first choke coil in the UTM layer, and being coupled to the first/second chock electrode and the main circuit's signal input circuit; and a secondary-side coil surrounding the first choke coil in the UTM layer and surrounding the second choke coil in the RDL, and being used for signal output. The inductor and the RF choke jointly form mutual induction to suppress the noise of the supply voltage.

Abstract: A gate structure includes a substrate divided into an N-type transistor region and a P-type transistor region. An interlayer dielectric covers the substrate. A first trench is embedded in the interlayer dielectric within the N-type transistor region. A first gate electrode having a bullet-shaped profile is disposed in the first trench. A gate dielectric contacts the first trench. An N-type work function layer is disposed between the gate dielectric layer and the first gate electrode. A second trench is embedded in the interlayer dielectric within the P-type transistor region. A second gate electrode having a first mushroom-shaped profile is disposed in the second trench. The gate dielectric layer contacts the second trench. The N-type work function layer is disposed between the gate dielectric layer and the second gate electrode. A first P-type work function layer is disposed between the gate dielectric layer and the N-type work function layer.

Abstract: A semiconductor device includes a source/drain feature over a semiconductor substrate, channel layers over the semiconductor substrate and connected to the source/drain feature, a gate portion between vertically adjacent channel layers, and an inner spacer between the source/drain feature and the gate portion and between adjacent channel layers. The semiconductor device further includes an air gap between the inner spacer and the source/drain feature.

Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.

Abstract: A speaker device includes a housing body, a speaker driver and a passive radiator. The housing body is formed with a first sound hole and a second sound hole respectively opening in two opposite directions. The speaker driver is disposed in the housing body, is located adjacent to the first sound hole, and is adapted to generate sound. The passive radiator is disposed in the housing body, is located adjacent to the second sound hole, and is adapted to generate sound. The first sound hole and the second sound hole are adapted for respectively allowing the sound generated by the speaker driver and the sound generated by the passive radiator to travel out from the housing body respectively in two opposite directions therethrough.

Abstract: A forming die with a flexible blank holder is provided. The forming die includes an upper die set, a lower die set, and a blank holder with a flexible pad. The upper die set has an upper die base and an upper die insert provided on the upper die base and has a cavity surface. The lower die set has a lower die base, an elastic member on the lower die base, and a lower die punch on the lower die base. Guide posts are provided between the upper die set and the lower die set to define relative positions of the two die sets. Through relative movement of the upper and the lower die sets, a blank placed on the blank holder there between is formed by forming. During the forming, the flexible pad is tightly pressed against the blank under the pressing force of the elastic member.

Abstract: A forming die with a flexible blank holder is provided. The forming die includes an upper die set, a lower die set, and a blank holder with a flexible pad. The upper die set has an upper die base and an upper die insert provided on the upper die base and has a cavity surface. The lower die set has a lower die base, an elastic member on the lower die base, and a lower die punch on the lower die base. Guide posts are provided between the upper die set and the lower die set to define relative positions of the two die sets. Through relative movement of the upper and the lower die sets, a blank placed on the blank holder there between is formed by forming. During the forming, the flexible pad is tightly pressed against the blank under the pressing force of the elastic member.