Abstract: A semiconductor package and a fabrication method thereof are disclosed, which is characterized in that a solder material is used to bond an LED chip and a substrate so as to provide a thick joint between the substrate and the LED chip and hence reduce stresses generated between the LED chip and the substrate due to their CTE mismatch, thereby preventing delamination from occurring between the LED chip and the substrate after a reliability test.

Abstract: A semiconductor package and a fabrication method thereof are disclosed, which is characterized in that a solder material is used to bond an LED chip and a substrate so as to provide a thick joint between the substrate and the LED chip and hence reduce stresses generated between the LED chip and the substrate due to their CTE mismatch, thereby preventing delamination from occurring between the LED chip and the substrate after a reliability test.

Abstract: An LED package structure includes: a substrate having a die attach pad; a first insulating layer formed on the die attach pad and having a plurality of openings; an LED chip having an active surface with a plurality of electrode pads and an inactive surface opposite to the active surface; a second insulating layer formed on the inactive surface and having a plurality of openings, wherein the LED chip is disposed on the substrate with the openings of the second insulating layer corresponding in position to the openings of the first insulating layer; and a plurality of metallic thermal conductive elements formed in the openings of the first insulating layer and the corresponding openings of the second insulating layer, thereby effectively alleviating the conventional problem of thermal stresses induced by a mismatch in CTEs of the LED chip and the substrate.