Patents by Inventor Kuan-Yuan Hsu

Kuan-Yuan Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190244925
    Abstract: A semiconductor device includes an electronic component, a package, a substrate and a plurality of first conductors and second conductors. The package is over the electronic component. T substrate is between the electronic component and the package. The substrate includes a first portion covered by the package, and a second portion protruding out of an edge of the package and uncovered by the package. The first conductors and second conductors are between and electrically connected to the electronic component and the substrate. A width of a second conductor of the plurality of second conductors is larger than a width of a first conductor of the plurality of first conductors, the first conductors are disposed between the second portion of the substrate and the electronic component, and the second conductors are disposed between the first portion of the substrate and the electronic component.
    Type: Application
    Filed: April 16, 2019
    Publication date: August 8, 2019
    Inventors: KUAN-YU HUANG, TZU-KAI LAN, SHOU-CHIH YIN, SHU-CHIA HSU, PAI-YUAN LI, SUNG-HUI HUANG, HSIANG-FAN LEE, YING-SHIN HAN
  • Publication number: 20190227377
    Abstract: A display device includes a first substrate, a second substrate, a plurality of pixels, a polarizing member, and a sealing member. The plurality of pixels are disposed between the first substrate and the second substrate. The polarizing member is disposed between the plurality of pixels and the second substrate, wherein a first area is defined by the polarizing member. The sealing member is disposed between the first substrate and the second substrate, wherein a second area is defined by the sealing member. The first area is located within the second area.
    Type: Application
    Filed: January 22, 2018
    Publication date: July 25, 2019
    Inventors: Jia-Yuan Chen, Tsung-Han Tsai, Kuan-Feng Lee, Ping-Chieh Hsu
  • Patent number: 10340242
    Abstract: A semiconductor device includes a substrate, a package, first conductors and second conductors. The substrate includes a first surface and a second surface opposite to the first surface. The package is disposed over the substrate. The first conductors are disposed over the substrate. The second conductors are disposed over the substrate, wherein the first conductors and the second conductors are substantially at a same tier, and a width of the second conductor is larger than a width of the first conductor.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: July 2, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Kuan-Yu Huang, Tzu-Kai Lan, Shou-Chih Yin, Shu-Chia Hsu, Pai-Yuan Li, Sung-Hui Huang, Hsiang-Fan Lee, Ying-Shin Han
  • Publication number: 20130056836
    Abstract: A semiconductor device with a metal gate is disclosed. An exemplary semiconductor device with a metal gate includes a semiconductor substrate, source and drain features on the semiconductor substrate, a gate stack over the semiconductor substrate and disposed between the source and drain features. The gate stack includes a HK dielectric layer formed over the semiconductor substrate, a plurality of barrier layers of a metal compound formed on top of the HK dielectric layer, wherein each of the barrier layers has a different chemical composition; and a stack of metals gate layers deposited over the plurality of barrier layers.
    Type: Application
    Filed: September 1, 2011
    Publication date: March 7, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xiong-Fei Yu, Chun-Yuan Chou, Da-Yuan Lee, Kuan-Yuan Hsu, Jeff J. Xu