Patents by Inventor Kuan-Yuan Hwang

Kuan-Yuan Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polyoxyalkylene amine-modified polyamideimide resin and composition thereof
    Publication number: 20060241239
    Abstract: The present invention provides a polyoxyalkylene amine-modified polyamideimide resin and a polyamideimide resin composition includes said polyoxyalkylene amine-modified polyamideimide resin, a thermosetting resin and a rubber elastomer, and may further include an inorganic filler. The polyamideimide resin composition of the present invention has high heat resistance and high bond strength and can achieve sufficient adhesion at lower temperature, for example, 160 to 180° C. Thus, the resin composition of the present invention is suitable for use in bonding circuit boards and IC members.
    Type: Application
    Filed: March 9, 2006
    Publication date: October 26, 2006
    Inventors: Kuan-Yuan Hwang, An-Pang Tu, Sheng-Yen Wu