Patents by Inventor Kuan Chih Wang

Kuan Chih Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096784
    Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.
    Type: Application
    Filed: January 3, 2023
    Publication date: March 21, 2024
    Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
  • Patent number: 11935795
    Abstract: Disclosed is a method for forming a crystalline protective polysilicon layer which does not create defective voids during subsequent processes so as to provide effective protection to devices underneath. In one embodiment, a method for forming a semiconductor device, includes: depositing a protective coating on a first polysilicon layer; forming an epitaxial layer on the protective coating; and depositing a second polysilicon layer over the epitaxial layer, wherein the protective coating comprises a third polysilicon layer, wherein the third polysilicon layer is deposited at a first temperature in a range of 600-700 degree Celsius, and wherein the third polysilicon layer in the protect coating is configured to protect the first polysilicon layer when the second polysilicon layer is etched.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Cheng-Hung Wang, Tsung-Lin Lee, Wen-Chih Chiang, Kuan-Jung Chen
  • Patent number: 10154940
    Abstract: A massage stick includes a rod, a massage tube, two tube stoppers, two handles and two heads. The rod extends through the massage tube and each tube stopper is fixed on one end of the rod. Each tube stopper has a step in a hole thereof. The two handles are mounted to two ends of the rod and each has a passage in which two shoulders and a contact face are formed. The two heads are respectively connected to the two handles, and each has a shank and a massage end. The user may hold the handles and roll the massage tube to massage the body. Alternatively, the user may hold the massage tube and roll the handles to massage the body. The user may hold the handles or the massage tube, using the massage ends of the heads to massage the body.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: December 18, 2018
    Inventor: Kuan Chih Wang
  • Publication number: 20170143581
    Abstract: A massage stick includes a rod, a masssage tube, two tube stoppers, two handles and two heads. The rod extends through the massage tube and each tube stopper is secured on the rod. Each tube stopper has a first shoulder in the hole thereof. The two handles are mounted to the two sides of the rod and each has a second passage in which second shoulders and a contact face are formed. The two heads are respectively connected to the two handles, and each has a shank and a massage end. The user holds the handles to massage the body by rolling the massage tube. Alternatively, the user holds the massage tube to massage the body by rolling the handles. The user may hold the handles or the massage tube to massage the body by pressing the massage ends onto the body.
    Type: Application
    Filed: November 24, 2015
    Publication date: May 25, 2017
    Inventor: Kuan Chih Wang