Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.

Abstract: An electronic device includes a casing, a concave portion, and an air outlet portion. The casing includes a first side surface, a second side surface, and a third side surface that are adjacent to each other, where two sides of the first side surface are respectively connected to the second side surface and the third side surface. The concave portion is recessed at a junction of the first side surface and the second side surface and includes a first concave surface and a second concave surface. The second side surface, the first concave surface, the second concave surface, and the first side surface are sequentially connected. The air outlet portion is arranged on the first concave surface. A length of the air outlet portion in one direction is greater than a half of a length between the second side surface and the third side surface in the direction.

Abstract: An electronic device includes a casing and an electronic assembly. The casing has an opening between a first side surface and a second side surface parallel to each other, and the opening has a first side edge and a second side edge opposite to each other. The electronic assembly is assembled in the casing, and includes a body, a connecting portion, and a waterproof ring. The connecting portion is arranged on one side of the body. The waterproof ring includes an outer ring, an inner ring, and two blocking portions. The outer ring is a closed ring, and is arranged around an outer surface of the connecting portion. The inner ring is arranged on the outer surface of the connecting portion and is closer to the body than the outer ring. The two blocking portions are each connected to the outer ring and the inner ring.

Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).

Abstract: A filter system includes: a first mixer, converting an input signal into a first signal according to a reference frequency signal, wherein the reference frequency signal corresponding to a target frequency band; an analog-to-digital converter, coupled to the first mixer, converting the first signal into a first digital signal; a digital filter, coupled to the analog-to-digital converter, filtering the first digital signal according to a first frequency band and generating a second digital signal, wherein the first frequency band corresponding to the first signal; a digital-to-analog converter coupled to the digital filter, converting the second digital signal into a second signal; and a second mixer, coupled to the digital-to-analog converter, converting the second signal into an output signal according to the reference frequency signal, wherein the output signal corresponds to the input signal filtered by the target frequency band.

Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: A method, a communication device and a communication system for multiple-input-multiple-output (MIMO) communication. In the method, Antenna information and channel information of the communication device are obtained. Eigenvalues of an intermediate matrix according to the antenna information and the channel information are determined, where the intermediate matrix is related to an L-term approximated matrix for Neumann series expansion of a matrix inversion, the matrix inversion is an inverse of a K×K matrix, L is a positive integer, and K is a positive integer according to the antenna information. Coefficients of the L-term approximated matrix are determined from the eigenvalues of the intermediate matrix by calculating a coefficient approximation. The matrix inversion according to the L-term approximated matrix with the determined coefficients of the L-term approximated matrix are determined.

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: Velocity-weighted analysis of UE location data is disclosed. UE velocity can be determined from the change in position and time. UE dwell can also be determined from the change in position and time. UE dwell and UE velocity can be inversely related. UE dwell an UE velocity can be correlated to a likelihood that an event occurrence related to a point of interest affects UE travel between a first and second location. A location of the point of interest can be determined to be in a region corresponding to a path between the first and second location. The region can be associated with the UE dwell and/or UE velocity, such that a probability of interaction can be determined for the event occurrence for the point of interest. The region can comprise a probable UE path based on historical UE data.

Abstract: A method includes capturing an image of the pattern using one or more scans across a surface of the partially completed wafer. The method includes processing information associated with the captured image of the pattern in a first format (e.g., pixel domain) into a second format, e.g., transform domain. The method includes determining defect information associated with the image of the pattern in the second format and processing the defect information (e.g., wafer identification, product identification, layer information, x-y die scanned) to identify at least one defect associated with a spatial location of a repeating pattern on the partially completed wafer provided by a reticle. The method includes identifying the reticle associated with the defect and a stepper associated with the reticle having the defect and ceasing operation of the stepper. The damaged reticle is replaced, and the process resumes using a replaced reticle.

Abstract: A method includes capturing an image of the pattern using one or more scans across a surface of the partially completed wafer. The method includes processing information associated with the captured image of the pattern in a first format (e.g., pixel domain) into a second format, e.g., transform domain. The method includes determining defect information associated with the image of the pattern in the second format and processing the defect information (e.g., wafer identification, product identification, layer information, x-y die scanned) to identify at least one defect associated with a spatial location of a repeating pattern on the partially completed wafer provided by a reticle. The method includes identifying the reticle associated with the defect and a stepper associated with the reticle having the defect and ceasing operation of the stepper. The damaged reticle is replaced, and the process resumes using a replaced reticle.

Abstract: Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed.

Abstract: Method and system for defect detection in manufacturing integrated circuits. In an embodiment, the invention provides a method for identifying one or more sources for possible causing manufacturing detects in integrated circuits. The method includes a step for providing a plurality of semiconductor substrates. The method includes a step for processing the plurality of semiconductor substrates in a plurality of processing steps using a plurality of processing tools. The method additionally includes a step for providing a database, which includes data associated with the processing of the plurality of semiconductor substrates. The method further includes a step for testing the plurality of semiconductor wafers after the processing of the plurality of semiconductor substrates. Additionally, the method includes a step for detecting at least one defect characteristic associated with the plurality of the semiconductor substrates that have been processed.

Abstract: The present invention provides a semiconductor device protective structure. The structure comprises a die with contact metal balls formed thereon electrically coupling with a print circuit board. A back surface of the die is directly adhered on a substrate and a first buffer layer is formed on the substrate. The substrate is configured over a second buffer layer such that the second buffer layer substantially encompasses the whole substrate to decrease damage to the substrate when the side of the substrate is collided with an external object.

Abstract: A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.

Abstract: In one embodiment of the invention, a programmable integrated circuit includes a plurality of SERDES circuits; a plurality of input/output (I/O) circuits; and a routing structure configurable to provide one or more of the following connections over routing paths having deterministic routing delays: coupling a SERDES circuit to another SERDES circuit; coupling a SERDES circuit to an I/O circuit; coupling an I/O circuit to a SERDES circuit; and coupling an I/O circuit to another I/O circuit.