Patents by Inventor KUANG-CHIEH LI

KUANG-CHIEH LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9136038
    Abstract: The invention relates to a moisture-proof and insulating coating material comprising a block copolymer or hydrogenated copolymer thereof (A), an adhesive resin (B) and a solvent (C). The block copolymer or hydride (A) comprises at least two vinyl aromatic polymer blocks and at least one conjugated diene polymer block, and in the moisture-proof and insulating coating material, the content of residual vinyl aromatic monomer is less than 300 ppm, and the content of vinyl aromatic oligomer is less than 300 ppm. The moisture-proof and insulating coating material according to the invention has good reworkability. A moisture-proof and insulating film and a method for producing the same and an electrical component comprising the moisture-proof and insulating film and a method for producing the same are also provided in the invention.
    Type: Grant
    Filed: April 10, 2012
    Date of Patent: September 15, 2015
    Assignee: CHI MEI CORPORATION
    Inventors: Bo-Hsuan Lin, Kuang-Chieh Li
  • Patent number: 9115298
    Abstract: The invention relates to a strippable adhesion composition, and it has the advantage of good stripability. The invention also provides a strippable material and method for manufacturing the same and an electronic device and method for manufacturing the same.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: August 25, 2015
    Assignee: CHI MEI CORPORATION
    Inventor: Kuang-Chieh Li
  • Patent number: 9109145
    Abstract: The invention relates to a strippable adhesive composition, and it has the advantage of good stripability and coating. The invention also provides a strippable material and method for manufacturing the same and an electronic component and method for manufacturing the same.
    Type: Grant
    Filed: March 17, 2014
    Date of Patent: August 18, 2015
    Assignee: CHI MEI CORPORATION
    Inventor: Kuang-Chieh Li
  • Patent number: 9057006
    Abstract: The invention relates to a photo-curing and strippable adhesion composition, and it has the advantage of good reworkability and weatherability. The invention also provides a strippable material and method for manufacturing the same and an electronic component and method for manufacturing the same.
    Type: Grant
    Filed: April 30, 2014
    Date of Patent: June 16, 2015
    Assignee: CHI MEI CORPORATION
    Inventor: Kuang-Chieh Li
  • Publication number: 20150087741
    Abstract: The invention relates to a photo-curing and strippable adhesive composition, and it has the advantages of good reworkability, weathering resistance, coating property and visibility. The invention also provides a strippable material and method for manufacturing the same and an electronic component and method for manufacturing the same.
    Type: Application
    Filed: September 15, 2014
    Publication date: March 26, 2015
    Inventor: KUANG-CHIEH LI
  • Publication number: 20140335352
    Abstract: The invention relates to a photo-curing and strippable adhesion composition, and it has the advantage of good reworkability and weatherability. The invention also provides a strippable material and method for manufacturing the same and an electronic component and method for manufacturing the same.
    Type: Application
    Filed: April 30, 2014
    Publication date: November 13, 2014
    Applicant: CHI MEI CORPORATION
    Inventor: KUANG-CHIEH LI
  • Publication number: 20140296424
    Abstract: The invention relates to a strippable adhesive composition, and it has the advantage of good stripability and coating. The invention also provides a strippable material and method for manufacturing the same and an electronic component and method for manufacturing the same.
    Type: Application
    Filed: March 17, 2014
    Publication date: October 2, 2014
    Applicant: CHI MEI CORPORATION
    Inventor: KUANG-CHIEH LI
  • Publication number: 20140162060
    Abstract: The invention relates to a strippable adhesion composition, and it has the advantage of good stripability. The invention also provides a strippable material and method for manufacturing the same and an electronic device and method for manufacturing the same.
    Type: Application
    Filed: November 21, 2013
    Publication date: June 12, 2014
    Applicant: CHI MEI CORPORATION
    Inventor: Kuang-Chieh LI
  • Publication number: 20130059963
    Abstract: A coating composition includes a block copolymer, an adhesive resin, and a solvent for dispersing the block copolymer and the adhesive resin therein. The block copolymer contains at least two vinyl aromatic polymer blocks and at least one partially hydrogenated conjugated diene polymer block, and has a hydrogenation ratio ranging from 10% to 90%.
    Type: Application
    Filed: August 23, 2012
    Publication date: March 7, 2013
    Inventors: Kuang-Chieh Li, Bo-Hsuan Lin
  • Publication number: 20120277363
    Abstract: The invention relates to a moisture-proof and insulating coating material comprising a block copolymer or hydrogenated copolymer thereof (A), an adhesive resin (B) and a solvent (C). The block copolymer or hydride (A) comprises at least two vinyl aromatic polymer blocks and at least one conjugated diene polymer block, and in the moisture-proof and insulating coating material, the content of residual vinyl aromatic monomer is less than 300 ppm, and the content of vinyl aromatic oligomer is less than 300 ppm. The moisture-proof and insulating coating material according to the invention has good reworkability. A moisture-proof and insulating film and a method for producing the same and an electrical component comprising the moisture-proof and insulating film and a method for producing the same are also provided in the invention.
    Type: Application
    Filed: April 10, 2012
    Publication date: November 1, 2012
    Applicant: CHI MEI CORPORATION
    Inventors: BO-HSUAN LIN, KUANG-CHIEH LI