Patents by Inventor Kuang-Chih Lai

Kuang-Chih Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080009150
    Abstract: The chip connection device's main feature is a structurally simple and rigid engagement member. The engagement member mainly contains a knob having only a top cylinder for turning and indication, an eccentric base cylinder to cause reliable relative lateral movement of the top and base plates of the chip connection device, and a flange between the top and base cylinders. The flange is sandwiched between a top board and a base board of the engagement member and the engagement member is in turn housed between the extensions from the top and base plates of the chip connection device. A clamping member is further provided to clamp the extensions from the top and base plates vertically together and, therefore, the plates can only be engaged into relative lateral movement.
    Type: Application
    Filed: June 28, 2007
    Publication date: January 10, 2008
    Inventor: KUANG-CHIH LAI
  • Patent number: 7247043
    Abstract: A land grid array integrated circuit (LGA IC) connector uses a pressing rod assembly linked with a cover for opening/closing operation. The LGA IC connector includes a first tooth and a second tooth driven by a first post and a second post of a positioning section to enhance the rotation angle thereof. A sufficient pressure can be provided with smaller operation angle of the pressing rod and cover, thus facilitating operation. A protection board is assembled to the terminal stage and then arranged on a frame. A V-shaped spring element is provided between the protection board and the terminal stage such that the protection board is higher than the terminal to protect the terminal. The terminal can be protected from deformation. In the present invention, the terminal is received in the terminal hole and the annular cone at terminal tail can clamp the solder ball.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: July 24, 2007
    Inventor: Kuang-Chih Lai
  • Patent number: 7175449
    Abstract: An integrated circuit connector for LGA package is used to fix a support assembly and a back assembly to circuit board. An integrated circuit is mounted in the support assembly and corresponding to the circuit board. The support assembly comprises protection board and contact stage and the contact stage comprises contact holes for containing contacts. The protection board includes a plurality of through holes corresponding to the contact holes such that the contacts are movable in the through holes. The protection board includes spring elements on both sides thereof and between the protection board and the contact stage such that the protection board is movable to protect the contact. The contact will not be deformed when the circuit board is manufactured and conveyed.
    Type: Grant
    Filed: October 6, 2005
    Date of Patent: February 13, 2007
    Inventor: Kuang-Chih Lai
  • Publication number: 20060178031
    Abstract: A CPU connector includes at least one terminal and the terminal includes a first spring section moved along a bevel of a latitude rib of a protection board in order to preload the terminal in a through hole of the protection board. The first spring section pushes upward the bevel of the protection board such that the terminal has uniform action of CPU contact face. The terminal includes arc section to scratch dirt on CPU contact face. When the terminal is soldered to contact of the motherboard, the terminal release pressure to push downward the tin ball. The terminal can be soldered to motherboard without needing high evenness. The terminal board can be directly clamped into a frame and a handle on a cover can be rotated to clamp the terminal board.
    Type: Application
    Filed: November 14, 2005
    Publication date: August 10, 2006
    Inventor: Kuang-Chih Lai
  • Publication number: 20060079104
    Abstract: An integrated circuit connector for LGA package is used to fix a support assembly and a back assembly to circuit board. An integrated circuit is mounted in the support assembly and corresponding to the circuit board. The support assembly comprises protection board and contact stage and the contact stage comprises contact holes for containing contacts. The protection board includes a plurality of through holes corresponding to the contact holes such that the contacts are movable in the through holes. The protection board includes spring elements on both sides thereof and between the protection board and the contact stage such that the protection board is movable to protect the contact. The contact will not be deformed when the circuit board is manufactured and conveyed.
    Type: Application
    Filed: October 6, 2005
    Publication date: April 13, 2006
    Inventor: Kuang-Chih Lai
  • Publication number: 20050112959
    Abstract: A large elastic conduction member of an IC device socket, including a middle part imbedded in an insertion hole of an insulation plate of the IC device socket; a first elastic part and a second elastic part respectively extending from a first end and a second end of the middle part; both elastic parts extending laterally at a certain inclination or curvature with each of their length projected on the insulation plate greater than the spacing between any two abutted terminals of the IC device socket to allow longer elastic part, larger elastic movement, and lowered height without being restricted by the minimum spacing to allow a contactor of the elastic part to make at least one point of strong effect contact of elastic compression with the IC device or a circuit board.
    Type: Application
    Filed: November 20, 2003
    Publication date: May 26, 2005
    Inventor: Kuang-Chih Lai
  • Patent number: 6773290
    Abstract: A conductive member of zero insertion/extraction force integrated circuit socket, including: an insertion section inserted in an inlay hole of the insulating seat body; an electrically connecting section extending from one end of the insertion section; and a clamp section connected with the insertion section for contacting with the pin of the integrated circuit. The clamp section has resilient sections, contact sections and bent guide sections. Ones of the contact sections and the guide sections are connected with the resilient ends of the resilient sections, while the others of both sections transversely extend from the ones of the contact sections and the guide sections. The inlay hole is fully sealed by the insertion section, whereby the soldering tin will not infiltrate into the insertion hole of the seat body. The electrically connecting section is 90 degrees bent to form an angle.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: August 10, 2004
    Inventor: Kuang-Chih Lai
  • Patent number: 6695635
    Abstract: A zero insertion/extraction force integrated circuit socket including an insulating socket having multiple pivot arch recesses and an L-shaped driving member having a driving section. The driving section has multiple pivot arch shaft sections which are respectively rotatably engaged in the pivot arch recesses. The integrated circuit socket further includes a slide cover having multiple driven faces. The driving section has multiple driving cams which respectively slidably contact with the driven faces for driving the slide cover to slide between a separation position and a contact position. The pivot arch shaft sections of the driving section and one of the driving cams are spaced from each other without connecting with each other. Therefore, the cross-sectional area of the driving section is smaller, while the strength of the driving section is greater.
    Type: Grant
    Filed: May 13, 2003
    Date of Patent: February 24, 2004
    Inventor: Kuang-Chih Lai
  • Patent number: 6692283
    Abstract: A zero insertion/extraction force integrated circuit socket including an insulating socket one side of which is formed with a receiving dent. A slide cover is slidably connected with the insulating socket and a corresponding side of which is formed with a U-shaped dent. A driving member having a driving cam is pivotally disposed in the receiving dent and U-shaped dent. The rotational axis of the driving member is normal to the sliding direction of the slide cover and parallel to a slide connecting face of the insulating socket. The slide cover is formed with a perforation and the driving member has an insertion dent corresponding to the perforation. An operating piece can be inserted into the insertion dent to drive the driving member, whereby the driving cam contacts with the U-shaped dent to drive the slide cover to slide between a separation position and a contact position.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: February 17, 2004
    Inventor: Kuang-Chih Lai
  • Publication number: 20040009694
    Abstract: A conductive member of zero insertion/extraction force integrated circuit socket, including: an insertion section inserted in an inlay hole of the insulating seat body; an electrically connecting section extending from one end of the insertion section; and a clamp section connected with the insertion section for contacting with the pin of the integrated circuit. The clamp section has resilient sections, contact sections and bent guide sections. Ones of the contact sections and the guide sections are connected with the resilient ends of the resilient sections, while the others of both sections transversely extend from the ones of the contact sections and the guide sections. The inlay hole is fully sealed by the insertion section, whereby the soldering tin will not infiltrate into the insertion hole of the seat body. The electrically connecting section is 90 degrees bent to form an angle.
    Type: Application
    Filed: December 16, 2002
    Publication date: January 15, 2004
    Inventor: Kuang-Chih Lai
  • Patent number: 6626683
    Abstract: A land grid array or ball grid array type integrated circuit socket including a metal basin having a bottom face and multiple side walls. An insulating board snugly inlaid in the metal basin. Multiple conductive members inlaid in the insertion holes of the insulating board, upper and lower ends of the conductive members respectively correspondingly contacting with the terminals of the integrated circuit and conductive contacts of the circuit board. An upper cover bottom face of which has a receiving section for accommodating the integrated circuit therein, the upper cover being latched on the metal basin. Clamping leaf springs mounted on one side of the upper cover for fixing the integrated circuit in the receiving section of the upper cover. The resilient section of the conductive member integrally transversely extending from the inlay section. Therefore, the resilient section has longer length and greater resilience, while having not high height.
    Type: Grant
    Filed: December 18, 2002
    Date of Patent: September 30, 2003
    Inventor: Kuang-Chih Lai
  • Publication number: 20030124882
    Abstract: A land grid array or ball grid array type integrated circuit socket including a metal basin having a bottom face and multiple side walls. An insulating board snugly inlaid in the metal basin. Multiple conductive members inlaid in the insertion holes of the insulating board, upper and lower ends of the conductive members respectively correspondingly contacting with the terminals of the integrated circuit and conductive contacts of the circuit board. An upper cover bottom face of which has a receiving section for accommodating the integrated circuit therein, the upper cover being latched on the metal basin. Clamping leaf springs mounted on one side of the upper cover for fixing the integrated circuit in the receiving section of the upper cover. The resilient section of the conductive member integrally transversely extending from the inlay section. Therefore, the resilient section has longer length and greater resilience, while having not high height.
    Type: Application
    Filed: December 18, 2002
    Publication date: July 3, 2003
    Inventor: Kuang-Chih Lai
  • Patent number: 6488523
    Abstract: A conductive member of zero insertion/extraction force integrated circuit socket, including spring sections and contact sections is provided. The spring sections and contact sections of the conductive members are interlaced with each other and arranged on the blank. The unfolding pitch of the blank is equal to the insertion pitch, whereby a maximum utility ratio of the blank is achieved and the conductive members, made by punching the same blank, can be fully inserted into the same row of insertion holes of the insulating seat body at the same time during the insertion operation.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: December 3, 2002
    Inventor: Kuang-Chih Lai
  • Publication number: 20020048985
    Abstract: A conductive member of integrated circuit socket. Spring section and contact section integrally extend from two opposite sides of insertion section of the conductive member in reverse directions to form two opposite spring sections and contact sections. The pitch between two adjacent spring sections is equal to the insertion pitch between the insertion holes of the insulating seat body. Therefore, the conductive members made by punching the same blank can be fully inserted into the same row of insertion holes of the insulating seat body at one time of insertion operation.
    Type: Application
    Filed: September 26, 2001
    Publication date: April 25, 2002
    Inventor: Kuang-Chih Lai
  • Patent number: 5791928
    Abstract: A zero insertion/extraction force socket adapted to be mounted on a printed circuit board. The socket includes an insulative housing having multiple insertion holes for conductive contacts to insert thereinto, multiple insertion pins of an integrated circuit being inserted into the insertion holes to contact with the conductive contacts, and two fulcrum dents disposed on or near two edges of the housing for a pushing piece to insert thereinto. Each fulcrum dent serves as a leverage fulcrum, enabling the pushing piece to directly push/lever an edge of the integrated circuit and shift the integrated circuit on an insertion face of the housing with the insertion pins of the integrated circuit moving from a loosening position where the insertion pins loosen from the conductive contacts to a contacting position where the insertion pins contact with the conductive contacts or moving from the contacting position to the loosening position.
    Type: Grant
    Filed: November 14, 1995
    Date of Patent: August 11, 1998
    Inventor: Kuang-Chih Lai
  • Patent number: 5658160
    Abstract: A zero extraction force socket including an insulative housing formed with multiple insertion holes for conductive contacts to insert thereinto. Multiple insertion pins of an integrated circuit are inserted into the insertion holes to contact with the conductive contacts. The housing is further formed with a fulcrum dent disposed on or near one edge of the housing for a pushing piece to insert thereinto. The fulcrum dent serves as a leverage fulcrum, enabling the pushing piece to directly push/lever an edge of the integrated circuit and shift the integrated circuit on an insertion face of the housing with the insertion pins of the integrated circuit moving from a contacting position where the insertion pins contact with the conductive contacts to a loosening position where the insertion pins loosen from the conductive contacts.
    Type: Grant
    Filed: November 3, 1995
    Date of Patent: August 19, 1997
    Inventor: Kuang-Chih Lai
  • Patent number: 5466169
    Abstract: An improved zero insertion force socket suitable for engaging with terminals of an integrated circuit such as a CPU of a personal computer. The terminals are permitted to be inserted into and withdrawn from the socket with very little or even zero insertion and withdrawal force. The socket includes multiple contacts and multiple insertion holes each of which has a relatively wide first insertion space for receiving the contacts and a relatively narrow second insertion space for receiving the terminals. Two locating walls are formed at an adjoining portion between the first and second insertion spaces and the each contact has an elastic engaging portion formed with two stopping portions, whereby when the contact is inserted into the first insertion space, the two stopping portion abut against the two locating walls to bias and pre-load the elastic engaging portion of the contact and accurately locate the same at its true position.
    Type: Grant
    Filed: August 3, 1994
    Date of Patent: November 14, 1995
    Inventor: Kuang-Chih Lai